JP2002542622A5 - - Google Patents

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Publication number
JP2002542622A5
JP2002542622A5 JP2000612989A JP2000612989A JP2002542622A5 JP 2002542622 A5 JP2002542622 A5 JP 2002542622A5 JP 2000612989 A JP2000612989 A JP 2000612989A JP 2000612989 A JP2000612989 A JP 2000612989A JP 2002542622 A5 JP2002542622 A5 JP 2002542622A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000612989A
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Japanese (ja)
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JP2002542622A (ja
Filing date
Publication date
Priority claimed from US09/399,985 external-priority patent/US6287941B1/en
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Publication of JP2002542622A publication Critical patent/JP2002542622A/ja
Publication of JP2002542622A5 publication Critical patent/JP2002542622A5/ja
Pending legal-status Critical Current

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JP2000612989A 1999-04-21 2000-04-20 エピプロセスを用いたｓｏｉ基板の表面仕上げ Pending JP2002542622A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US13042399P 1999-04-21 1999-04-21
US60/130,423 1999-04-21
US09/399,985 1999-09-20
US09/399,985 US6287941B1 (en) 1999-04-21 1999-09-20 Surface finishing of SOI substrates using an EPI process
PCT/US2000/010872 WO2000063954A1 (en) 1999-04-21 2000-04-20 Surface finishing of soi substrates using an epi process

Publications (2)

Publication Number Publication Date
JP2002542622A JP2002542622A (ja) 2002-12-10
JP2002542622A5 true JP2002542622A5 (enExample) 2007-06-14

Family

ID=26828477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000612989A Pending JP2002542622A (ja) 1999-04-21 2000-04-20 エピプロセスを用いたｓｏｉ基板の表面仕上げ

Country Status (8)

Country Link
US (3) US6287941B1 (enExample)
EP (2) EP1887616A3 (enExample)
JP (1) JP2002542622A (enExample)
KR (2) KR100709689B1 (enExample)
AT (1) ATE372590T1 (enExample)
AU (1) AU4483300A (enExample)
DE (1) DE60036286T2 (enExample)
WO (1) WO2000063954A1 (enExample)

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