JP2002528649A5 - - Google Patents

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JP2002528649A5
JP2002528649A5 JP2000579810A JP2000579810A JP2002528649A5 JP 2002528649 A5 JP2002528649 A5 JP 2002528649A5 JP 2000579810 A JP2000579810 A JP 2000579810A JP 2000579810 A JP2000579810 A JP 2000579810A JP 2002528649 A5 JP2002528649 A5 JP 2002528649A5
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【特許請求の範囲】
【請求項1】 上面とこの上面に位置されたキャビティとを有し、これら上面とキャビティとに位置された導電性層を有するワークピースに、電解液から導電性材料を堆積させる方法であって、
アノード近くに配設されたワークピースとアノードとの間に電位差を与えて、ワークピースのキャビティに少なくとも位置された導電性層に導電性材料を供給する工程と、
この導電性材料を供給する工程が実施されている間に、パッドで、前記ワークピースの上面に位置された前記導電性層を研磨することによって、このワークピースの上面に位置された導電性層への、前記導電性材料の堆積を最小限にする工程とを具備する方法。
【請求項2】 前記供給する工程及び堆積を最小限にする工程が中で行われるチャンバから電解液を排出する工程と、
排出された電解液をクリーンにする工程と、
この電解液をワークピースに供給するために、チャンバ内に補給する工程とを更に具備する、請求項1の方法。
【請求項3】 前記導電性材料は、銅を含む、請求項1又は2の方法。
【請求項4】 前記ワークピースのキャビティは、ビアホールを含み、ワークピースは、ウエハを含む、請求項1ないし3のいずれか1の方法。
【請求項5】 前記電解液は、スラリーを含んでいる、請求項1ないし4のいずれか1の方法。
【請求項6】 前記導電性層は、バリヤー/シード層である、請求項1ないし5のいずれか1の方法。
【請求項7】 前記ワークピースのキャビティに位置された導電性層と接する電解液の保持を助けるようにパッドを移動させる工程を有する、請求項1ないし6のいずれか1の方法。
【請求項8】 前記パッドを移動させる工程は、機械的なパルシングを発生させ、これによって、グレインのサイズを向上させる、請求項7の方法。
【請求項9】 前記パッドは、前記アノードに取り付けられ、前記導電性材料を供給する工程は、前記アノード及びパッドを介して電解液を流す工程を、更に有する、請求項1ないし8のいずれか1の方法。
【請求項10】 前記導電性材料を供給する工程は、電解液をパッドに直接供給する工程を更に有する、請求項1ないし9のいずれか1の方法。
【請求項11】 前記堆積を最小限にする工程は、導電性材料が、前記ワークピースの上面に位置された導電性層に形成されるのを防ぐ、請求項1ないし10のいずれか1の方法。
【請求項12】 前記電位差を与えるのは、第1の極性を有する電位差を与える電位の差を与え、さらに、この与える前に、
前記ワークピースとアノードとの間に、前記第1の極性と逆の第2の極性を有する第2の電位差を与える工程と、
この第2の電位差を与えている間に、前記ワークピースの上面に位置された導電性層を研磨する工程とを更に有する、請求項1ないし11のいずれか1の方法。
【請求項13】 前記電解液は、スラリーを含む、請求項12の方法。
【請求項14】 前記導電性材料が、前記キャビティ全体に渡って位置された導電性層に供給されて、このキャビティを充填した後に、スラリーをワークピースに供給する工程と、このワークピースを化学的機械的研磨する工程とを更に有する、請求項1ないし13のいずれか1の方法。
【請求項15】 前記ワークピースは、ウエハである、請求項1ないし14のいずれか1の方法。
【請求項16】 前記導電性材料を供給する工程は、パッドを介して電解液を流す工程を有する、請求項1の方法。
【請求項17】 前記電位差を与えることは、プラチナを前記アノードとして使用する、請求項1ないし16の方法。
【請求項18】 ワークピースの少なくともキャビティに電力を供給して、電解液から導電性材料を堆積し、また、前記ワークピースの上面部分への導電性材料の堆積を最小限にする装置であって、
電力の供給によって第1の電位を受け得、前記ワークピースから離れた電極と、
前記電極に取り付けられ、この電極とワークピースとの間に位置されたパッドとを具備し、
第1の電位が与えられている間のワークピースに対するパッドの相対的な動きは、パッドが、ワークピースの上面部分と接触し、多量の導電性材料を前記キャビティに堆積しているときに、上面部分への導電性材料の堆積を最小限にする、装置。
【請求項19】 複数のパッドが、前記電極に取り付けられ、この電極とワークピースとの間に位置され、また、これら複数のパッドが、ワークピースの上面部分に接する際に、この上面部分への導電性材料の堆積を最小限にする、請求項18の装置。
【請求項20】 前記ワークピースとパッドとは、同じ1つの軸を中心として回転するように配置されている、請求項18又は19の装置。
【請求項21】 前記ワークピースは、第1の軸を中心として回転するように配置され、前記パッドは、第1の軸と異なる第2の軸を中心として回転するように配置されている、請求項18又は19の装置。
【請求項22】 前記パッドは、シリンダのように成形されている、請求項18ないし21のいずれか1の装置。
【請求項23】 前記パッドは、シリンダのように成形された電極の周りに形作られている、請求項18ないし21のいずれか1の装置。
【請求項24】 前記ワークピースを支持し、このワークピースを第1の軸を中心として回転させるように適合されたワークピースヘッドアセンブリと、
前記パッドと電極とを有し、このパッドは、ワークピースのキャビティと接する電解液の保持を助けるために、ワークピースに対して移動可能なパッドアセンブリとを更に有する、請求項18ないし23のいずれか1の装置。
【請求項25】 電解液をワークピースに流すための入口のチャンネルと、
チャンバからの電解液を流すための出口のチャンネルとを有するチャンバを有する、請求項18ないし24のいずれか1の装置。
【請求項26】 前記出口のチャンネルを通って流出する電解液を補給し、クリーンにするための再生リザーバを更に有する、請求項25の装置。
【請求項27】 前記電解液が、入口のチャンネルから、電極及びパッドを通って、ワークピースまで流れることが可能なようにこの装置が配置されている、請求項25又は26の装置。
【請求項28】 前記電解液が、入口のチャネルから直接パッドに、そして、ワークピースに、流される、請求項25ないし27のいずれか1の装置。
【請求項29】 第1の軸を中心として回転するように適合された、ワークピースを支持するためのワークピースヘッドアセンブリと、
アノードに取り付けられたパッドを有するパッドアセンブリとを有し、前記アノードは、円筒形で、第2の軸を中心として回転するように適合されている、請求項24の装置
【請求項30】 円筒形の前記アノードは、通路及び複数の孔を有し、電解液が、パッドを介して、通路及び複数の孔を通り、ワークピースまで流れることが可能なように配置されている、請求項29の装置。
【請求項31】 前記電解液が、入口のチャンネルから直接パッドまで流れるようにこの装置は配置されている、請求項29又は30の装置。
【請求項32】 前記アノードは、第1の電位を受けているとき、第1の期間に続く第2の期間の間に、第1の電位と逆の第2の電位を受けるように配置され、前記パッドは、第2の期間の間に、前記ワークピースの上面部分を研磨し、この上面部分から導電性材料を除去するように配置されている請求項24の装置。
【請求項33】 電解液が、ワークピースに供給されるのを、また、導電性材料が、ワークピースのキャビティに堆積されるのを、可能にするチャンバを有する、請求項32の装置。
【請求項34】 前記チャンバは、導電性材料を、第1の期間にワークピースに堆積し、第2の期間に前記上面から除去するのを可能にするように配置されている、請求項33の装置。
図1は、本発明の第1の実施形態に係わる電気的化学的機械的堆積装置10の概観を示し、また、第1の軸を中心とする矢印14方向への回転(回転14と称する)を果たす機械的なパッド32を有する機械的なパッドアセンブリ12と、第2の軸を中心とする矢印18方向への回転(回転18と称する)を果たすウエハを有するウエハヘッドアセンブリ16とを、平面図で示している。図示されるように、ウエハは、以下に詳述されるように、機械的なパッド32によって覆われた領域内で回転する。この領域は、中に入れられた様々の溶液を維持するコンテナ20内にある。単一のウエハに対して動作するように示されているが、複数のウエハヘッドアセンブリ16が、各機械的なパッドアセンブリ12と関連して設けられ得、このために、装置10は、夫々に異なったウエハに対して動作する複数の機械的なパッドアセンブリ12を有し得る。
図2は、本発明に係わる図1のA―A線に沿って切断された装置(システム)10の縦断面である。図示されるように、システム10は、ウエハ上に金属の薄膜を堆積することが可能である。
各ウエハヘッドアセンブリ16は、好ましくは中心部が数ミリメータの深さを有するとともに静止パッド25を収容し得るキャビティを備え、非導電性で、好ましくは円形の、ヘッドアセンブリを有する。半導体ウエハは、従来形式の搬送もしくは真空機構を用いて、まず裏側が静止パッド25に当たるように前記キャビティ22内に装填され、この結果、使用中、ウエハは、ウエハヘッドアセンブリに対して確実に静止される。ウエハヘッドアセンブリ16の周囲に位置する非導電性の維持リング24は、夫々ウエハの表面を押し、ウエハを先端部の所定位置に保持するための、少なくとも1つのO−リングもしくは他のゴム形式のシール26と、ばねにより付勢されたカソードコンタクト電極28とを有する。このようにして、液密シールが、得られ、かくして、後述されるように、カソードコンタクト電極28は、コンテナ20内の溶液から隔離されるように維持される。このように、静止パッド25を押すウエハの裏側全体と、保持リング24の下の前面領域(典型的には前面領域の1−10mmの外側の面)とが、後述されるように、電解液を含むいかなる溶液からも保護される。
上述され、かつ後述されるように、機械的なパッドアセンブリ12は、コンテナ20内に配置され、このコンテナ20は、導入された様々の溶液を保持する。機械的なパッドアセンブリ12は、好ましくは薄く平らな円形状であるとともに銅並びに/もしくは白金のような多孔性もしくは固形の導電性材料で形成されたアノード板30を有し、第2の軸を中心として回転18するように設けられ、公知のように、ベアリング支持材及びテーブルに設けられている。当業者に公知で、例えば化学的機械的研磨において使用され、好ましくはポリウレタンのような非導電性かつ多孔性形状の材料で形成された機械的なパッド32が、板状のアノード30の一面に設けられる。この機械的なパッド32は、円形状が好ましいが、効果的にウエハを研磨し得る限り他の形状にも成型され得る。電解液は、アノード30の後ろに配置されたリザーバ(示されず)から、チャンバ31を介して、パッド32に供給され得、このために、チャンバ31は、入口のチャンネル34から、アノード30及びパッド32全体に電解液を供給する。これに代わって、別の入口のチャンネル44が、また、パッド32の表面に電解液を直接供給するために使用され得る。
前記ウエハヘッドアセンブリ16は、機械的なパッドアセンブリ12に面し、制御される力で押し下げられる。このウエハヘッドアセンブリ16は、従来の電動スピンドル36を用いて、軸を中心として回転18する。一方、前記機械的なパッドアセンブリ12は、従来の電動スピンドル38を用いて、軸を中心として回転14する。
適当なドレインチャンネル(出口のチャンネル)40が、電解液の、安全な再利用もしくは破棄を可能にする。かくして、電解液は、上述されたように、パッド32の面に供給された後に、ドレインチャンネル40を介して、図示されていない再利用リザーバに排水され得る。また、この再利用リザーバは、電解液を補給及び清浄にして、再利用を可能にし、環境保護に貢献する。
また、前記入口のチャンネル44が、後述されるように、本発明の第2のモードで動作するとき、脱イオン水を供給するのに使用され得る。
本発明の第1のモードに係わる動作において、装置10は、電源を用いて、カソードコンタクト電極28に負の電位を、アノード(アノード電極)30に正の電位を、印加する。電解液は、チャンネル34,44の一方もしくは両方の中から、機械的な研磨パッド32の表面に導入される。電流が2つの電極28、30間に流されると、電解液中の金属分子が、イオン化され、これが、カソードコンタクト電極28によって、これに引き寄せられてウエハの表面に堆積される。これが行われている間に、また、機械的なパッドアセンブリ12を用いる機械的な研磨も、行われる。この機械的なパッドアセンブリ12は、機械的なパッド32の研磨もしくは擦り動作によって、実質的に、このような堆積が望ましくないウエハの表面に、金属の分子が永久的に堆積されるのを防ぐ。このように、現在、堆積を防ぐかもしくは減じるために用いられている、上述された汚染物質もしくは添加剤は、必要とされないか、あるいは、かなり低い割合で使用され得る。従って、動作の第1のモードの結果、金属は、ビアとその他望ましい部分に堆積され、実質的に、望ましくない領域に堆積されるのが防がれる。
JP2000579810A 1998-11-03 1999-11-02 電気的化学的機械的堆積を行うための方法と装置 Withdrawn JP2002528649A (ja)

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US10685398P 1998-11-03 1998-11-03
US60/106,853 1998-12-01
US09/201,929 US6176992B1 (en) 1998-11-03 1998-12-01 Method and apparatus for electro-chemical mechanical deposition
US09/201,929 1998-12-01
PCT/US1999/025656 WO2000026443A2 (en) 1998-11-03 1999-11-02 Method and apparatus for electrochemical mechanical deposition

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