AU5733400A - Method and apparatus for electroplating depressions of a substrate simultaneously preventing plating on the substrate surface using a membrane cover - Google Patents

Method and apparatus for electroplating depressions of a substrate simultaneously preventing plating on the substrate surface using a membrane cover

Info

Publication number
AU5733400A
AU5733400A AU57334/00A AU5733400A AU5733400A AU 5733400 A AU5733400 A AU 5733400A AU 57334/00 A AU57334/00 A AU 57334/00A AU 5733400 A AU5733400 A AU 5733400A AU 5733400 A AU5733400 A AU 5733400A
Authority
AU
Australia
Prior art keywords
electroplating
depressions
substrate
membrane cover
simultaneously preventing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU57334/00A
Inventor
Mehrdad M. Moslehi
Ajit P. Paranjpe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CVC Products Inc
Original Assignee
CVC Products Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CVC Products Inc filed Critical CVC Products Inc
Publication of AU5733400A publication Critical patent/AU5733400A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H01L21/76879—Filling of holes, grooves or trenches, e.g. vias, with conductive material by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • Computer Hardware Design (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
AU57334/00A 1999-06-14 2000-06-12 Method and apparatus for electroplating depressions of a substrate simultaneously preventing plating on the substrate surface using a membrane cover Abandoned AU5733400A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US33249299A 1999-06-14 1999-06-14
US09332492 1999-06-14
US50292400A 2000-02-11 2000-02-11
US09502924 2000-02-11
PCT/US2000/016078 WO2000077278A1 (en) 1999-06-14 2000-06-12 Method and apparatus for electroplating depressions of a substrate simultaneously preventing plating on the substrate surface using a membrane cover

Publications (1)

Publication Number Publication Date
AU5733400A true AU5733400A (en) 2001-01-02

Family

ID=26988237

Family Applications (1)

Application Number Title Priority Date Filing Date
AU57334/00A Abandoned AU5733400A (en) 1999-06-14 2000-06-12 Method and apparatus for electroplating depressions of a substrate simultaneously preventing plating on the substrate surface using a membrane cover

Country Status (2)

Country Link
AU (1) AU5733400A (en)
WO (1) WO2000077278A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1701136B (en) * 2001-09-28 2010-07-14 Asm纳托尔公司 Low-force electrochemical mechanical processing method and apparatus

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6896776B2 (en) * 2000-12-18 2005-05-24 Applied Materials Inc. Method and apparatus for electro-chemical processing
US6932896B2 (en) * 2001-03-30 2005-08-23 Nutool, Inc. Method and apparatus for avoiding particle accumulation in electrodeposition
US7247222B2 (en) * 2002-07-24 2007-07-24 Applied Materials, Inc. Electrochemical processing cell
WO2006060520A2 (en) * 2004-11-30 2006-06-08 E.I. Dupont De Nemours And Company Membrane-limited selective electroplating of a conductive surface
US20080217182A1 (en) * 2007-03-08 2008-09-11 E. I. Dupont De Nemours And Company Electroplating process

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2008664A1 (en) * 1970-02-25 1971-09-09 Licentia Gmbh Galvanically or chemically assisted mechanic
DE4324330C2 (en) * 1992-08-01 1994-11-17 Atotech Deutschland Gmbh Process for the electrolytic treatment of, in particular, flat items to be treated, and arrangement, in particular for carrying out this process
US6004880A (en) * 1998-02-20 1999-12-21 Lsi Logic Corporation Method of single step damascene process for deposition and global planarization
US6176992B1 (en) * 1998-11-03 2001-01-23 Nutool, Inc. Method and apparatus for electro-chemical mechanical deposition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1701136B (en) * 2001-09-28 2010-07-14 Asm纳托尔公司 Low-force electrochemical mechanical processing method and apparatus

Also Published As

Publication number Publication date
WO2000077278A1 (en) 2000-12-21

Similar Documents

Publication Publication Date Title
AU2163801A (en) Method and device for coating a substrate
GB9914484D0 (en) Polishing apparatus and method for polishing a substrate
SG93262A1 (en) Method and apparatus for preventing edge deposition
EP0999012A3 (en) Method and apparatus for polishing substrate
AU2237599A (en) Apparatus and method for depositing a material on a substrate
ZA978722B (en) Method and apparatus for coating a substrate.
AU2001240049A1 (en) Method and apparatus for extruding a coating upon a substrate surface
AU7378998A (en) Method and apparatus for clamping a substrate
AU1461700A (en) Method and apparatus for electrochemical mechanical deposition
AU2233399A (en) Plating apparatus and method
AU1590801A (en) Method and apparatus for applying a coating onto a substrate
AU7418300A (en) Agents for producing self-cleaning thin surface coatings and methods suited therefor
GB2355992B (en) Method and apparatus for forming a film on a substrate
AU1590701A (en) Method and apparatus for dynamically coating a substrate
AU4067399A (en) Method for selective plating of a metal substrate using laser developed masking layer and apparatus for carrying out the method
AU1700401A (en) Coating agent and a method for coating the surface of a substrate
AU4009200A (en) Ceramic substrate for nonstick coating
EP1118696A4 (en) Method for plating substrate and apparatus
EP1182271B8 (en) Apparatus and method for coating substrate
AU4741497A (en) Apparatus for reducing polymer deposition on substrate support
HK1042627A1 (en) Process for depositing conducting layer on substrate
AU5733400A (en) Method and apparatus for electroplating depressions of a substrate simultaneously preventing plating on the substrate surface using a membrane cover
AU4248699A (en) Method for depositing a metallic layer on a polymer surface of a workpiece
AU6363600A (en) Method for forming a sequence of crosslinked pigmented coatings on ceramic substrates
EP1048756A4 (en) Substrate plating device

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase