DE2008664A1 - Galvanically or chemically assisted mechanic - Google Patents

Galvanically or chemically assisted mechanic

Info

Publication number
DE2008664A1
DE2008664A1 DE19702008664 DE2008664A DE2008664A1 DE 2008664 A1 DE2008664 A1 DE 2008664A1 DE 19702008664 DE19702008664 DE 19702008664 DE 2008664 A DE2008664 A DE 2008664A DE 2008664 A1 DE2008664 A1 DE 2008664A1
Authority
DE
Grant status
Application
Patent type
Prior art keywords
deposition
galvanically
chemically assisted
mechanic
mechanical polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19702008664
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent-Verwaltungs-GmbH
Original Assignee
Licentia Patent-Verwaltungs-GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/22Electroplating combined with mechanical treatment during the deposition
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1655Process features
    • C23C18/1664Process features with additional means during the plating process
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/1803Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1806Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by mechanical pretreatment, e.g. grinding, sanding
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/1803Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1827Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
    • C23C18/1831Use of metal, e.g. activation, sensitisation with noble metals

Abstract

Galvanically or chemically assisted mechanical polishing of metals Generation of a high quality surface finish on metal objects is achieved by a mechanical polishing process which is combined with the simultaneous deposition of a metal on the surface concerned. The deposition may be effected electrolytically by cathodic deposition or by chemical deposition. A catalyst may opt. be added to the polishing fluid.
DE19702008664 1970-02-25 1970-02-25 Galvanically or chemically assisted mechanic Pending DE2008664A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19702008664 DE2008664A1 (en) 1970-02-25 1970-02-25 Galvanically or chemically assisted mechanic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702008664 DE2008664A1 (en) 1970-02-25 1970-02-25 Galvanically or chemically assisted mechanic

Publications (1)

Publication Number Publication Date
DE2008664A1 true true DE2008664A1 (en) 1971-09-09

Family

ID=5763263

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19702008664 Pending DE2008664A1 (en) 1970-02-25 1970-02-25 Galvanically or chemically assisted mechanic

Country Status (1)

Country Link
DE (1) DE2008664A1 (en)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000026443A2 (en) * 1998-11-03 2000-05-11 Nutool, Inc. Method and apparatus for electrochemical mechanical deposition
WO2000077278A1 (en) * 1999-06-14 2000-12-21 Cvc Products, Inc. Method and apparatus for electroplating depressions of a substrate simultaneously preventing plating on the substrate surface using a membrane cover
WO2001032362A1 (en) * 1999-11-04 2001-05-10 Philips Semiconductors Inc. Method and apparatus for deposition on and polishing of a semiconductor surface
US6328872B1 (en) 1999-04-03 2001-12-11 Nutool, Inc. Method and apparatus for plating and polishing a semiconductor substrate
US6355153B1 (en) * 1999-09-17 2002-03-12 Nutool, Inc. Chip interconnect and packaging deposition methods and structures
WO2002023613A2 (en) * 2000-09-15 2002-03-21 Rodel Holdings, Inc. Metal cmp process with reduced dishing
US6409904B1 (en) 1998-12-01 2002-06-25 Nutool, Inc. Method and apparatus for depositing and controlling the texture of a thin film
US6773576B2 (en) 2000-05-11 2004-08-10 Nutool, Inc. Anode assembly for plating and planarizing a conductive layer
US7204924B2 (en) 1998-12-01 2007-04-17 Novellus Systems, Inc. Method and apparatus to deposit layers with uniform properties
US7204917B2 (en) 1998-12-01 2007-04-17 Novellus Systems, Inc. Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same
US7341649B2 (en) 1998-12-01 2008-03-11 Novellus Systems, Inc. Apparatus for electroprocessing a workpiece surface
US7378004B2 (en) 2000-02-23 2008-05-27 Novellus Systems, Inc. Pad designs and structures for a versatile materials processing apparatus
US7416975B2 (en) 2005-09-21 2008-08-26 Novellus Systems, Inc. Method of forming contact layers on substrates
US7427337B2 (en) 1998-12-01 2008-09-23 Novellus Systems, Inc. System for electropolishing and electrochemical mechanical polishing
US7648622B2 (en) 2004-02-27 2010-01-19 Novellus Systems, Inc. System and method for electrochemical mechanical polishing
US7670473B1 (en) 1998-12-01 2010-03-02 Uzoh Cyprian E Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same
US7947163B2 (en) 2006-07-21 2011-05-24 Novellus Systems, Inc. Photoresist-free metal deposition
US8236160B2 (en) 2000-08-10 2012-08-07 Novellus Systems, Inc. Plating methods for low aspect ratio cavities

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6676822B1 (en) 1998-11-03 2004-01-13 Nutool, Inc. Method for electro chemical mechanical deposition
WO2000026443A3 (en) * 1998-11-03 2000-10-12 Nutool Inc Method and apparatus for electrochemical mechanical deposition
WO2000026443A2 (en) * 1998-11-03 2000-05-11 Nutool, Inc. Method and apparatus for electrochemical mechanical deposition
US6176992B1 (en) 1998-11-03 2001-01-23 Nutool, Inc. Method and apparatus for electro-chemical mechanical deposition
US6402925B2 (en) 1998-11-03 2002-06-11 Nutool, Inc. Method and apparatus for electrochemical mechanical deposition
US7427337B2 (en) 1998-12-01 2008-09-23 Novellus Systems, Inc. System for electropolishing and electrochemical mechanical polishing
US7341649B2 (en) 1998-12-01 2008-03-11 Novellus Systems, Inc. Apparatus for electroprocessing a workpiece surface
US7204917B2 (en) 1998-12-01 2007-04-17 Novellus Systems, Inc. Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same
US7204924B2 (en) 1998-12-01 2007-04-17 Novellus Systems, Inc. Method and apparatus to deposit layers with uniform properties
US7670473B1 (en) 1998-12-01 2010-03-02 Uzoh Cyprian E Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same
US6409904B1 (en) 1998-12-01 2002-06-25 Nutool, Inc. Method and apparatus for depositing and controlling the texture of a thin film
US6837979B2 (en) 1998-12-01 2005-01-04 Asm-Nutool Inc. Method and apparatus for depositing and controlling the texture of a thin film
US6328872B1 (en) 1999-04-03 2001-12-11 Nutool, Inc. Method and apparatus for plating and polishing a semiconductor substrate
US6797132B2 (en) 1999-04-03 2004-09-28 Nutool, Inc. Apparatus for plating and polishing a semiconductor workpiece
US7309406B2 (en) 1999-04-03 2007-12-18 Novellus Systems, Inc. Method and apparatus for plating and polishing semiconductor substrate
WO2000077278A1 (en) * 1999-06-14 2000-12-21 Cvc Products, Inc. Method and apparatus for electroplating depressions of a substrate simultaneously preventing plating on the substrate surface using a membrane cover
US6905588B2 (en) 1999-09-17 2005-06-14 Asm Nutool, Inc. Packaging deposition methods
US7147766B2 (en) 1999-09-17 2006-12-12 Asm Nutool, Inc. Chip interconnect and packaging deposition methods and structures
US6355153B1 (en) * 1999-09-17 2002-03-12 Nutool, Inc. Chip interconnect and packaging deposition methods and structures
US6341998B1 (en) 1999-11-04 2002-01-29 Vlsi Technology, Inc. Integrated circuit (IC) plating deposition system and method
WO2001032362A1 (en) * 1999-11-04 2001-05-10 Philips Semiconductors Inc. Method and apparatus for deposition on and polishing of a semiconductor surface
US7378004B2 (en) 2000-02-23 2008-05-27 Novellus Systems, Inc. Pad designs and structures for a versatile materials processing apparatus
US6773576B2 (en) 2000-05-11 2004-08-10 Nutool, Inc. Anode assembly for plating and planarizing a conductive layer
US8236160B2 (en) 2000-08-10 2012-08-07 Novellus Systems, Inc. Plating methods for low aspect ratio cavities
WO2002023613A2 (en) * 2000-09-15 2002-03-21 Rodel Holdings, Inc. Metal cmp process with reduced dishing
WO2002023613A3 (en) * 2000-09-15 2002-07-25 Rodel Inc Metal cmp process with reduced dishing
US7648622B2 (en) 2004-02-27 2010-01-19 Novellus Systems, Inc. System and method for electrochemical mechanical polishing
US7704880B1 (en) 2005-09-21 2010-04-27 Novellus Systems, Inc. Method of forming contact layers on substrates
US7416975B2 (en) 2005-09-21 2008-08-26 Novellus Systems, Inc. Method of forming contact layers on substrates
US7947163B2 (en) 2006-07-21 2011-05-24 Novellus Systems, Inc. Photoresist-free metal deposition
US8500985B2 (en) 2006-07-21 2013-08-06 Novellus Systems, Inc. Photoresist-free metal deposition

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