JP2002518825A - 実質的にアンダカットのないシリコンを絶縁体構造上に作製するエッチング工程 - Google Patents

実質的にアンダカットのないシリコンを絶縁体構造上に作製するエッチング工程

Info

Publication number
JP2002518825A
JP2002518825A JP2000553985A JP2000553985A JP2002518825A JP 2002518825 A JP2002518825 A JP 2002518825A JP 2000553985 A JP2000553985 A JP 2000553985A JP 2000553985 A JP2000553985 A JP 2000553985A JP 2002518825 A JP2002518825 A JP 2002518825A
Authority
JP
Japan
Prior art keywords
etching
silicon
ion
reactive
reactive ion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000553985A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002518825A5 (enExample
Inventor
ジョン エフ． ドノフェ
デイビッド ジェイ． ジョンソン
マイケル ダブリュー． デブレ
Original Assignee
ユナキス ユーエスエー インク．
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ユナキス ユーエスエー インク． filed Critical ユナキス ユーエスエー インク．
Publication of JP2002518825A publication Critical patent/JP2002518825A/ja
Publication of JP2002518825A5 publication Critical patent/JP2002518825A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
    • B81C1/00563—Avoid or control over-etching
    • B81C1/00571—Avoid or control under-cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Geometry (AREA)
  • Drying Of Semiconductors (AREA)
  • Element Separation (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2000553985A 1998-06-08 1999-06-08 実質的にアンダカットのないシリコンを絶縁体構造上に作製するエッチング工程 Pending JP2002518825A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US8846098P 1998-06-08 1998-06-08
US60/088,460 1998-06-08
US09/127,762 US6071822A (en) 1998-06-08 1998-07-31 Etching process for producing substantially undercut free silicon on insulator structures
US09/127,762 1998-07-31
PCT/US1999/011809 WO1999065065A1 (en) 1998-06-08 1999-06-08 Etching process for producing substantially undercut free silicon on insulator structures

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010157388A Division JP2010283362A (ja) 1998-06-08 2010-07-12 実質的にアンダカットのないシリコンを絶縁体構造上に作製するエッチング工程

Publications (2)

Publication Number Publication Date
JP2002518825A true JP2002518825A (ja) 2002-06-25
JP2002518825A5 JP2002518825A5 (enExample) 2006-07-20

Family

ID=26778680

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2000553985A Pending JP2002518825A (ja) 1998-06-08 1999-06-08 実質的にアンダカットのないシリコンを絶縁体構造上に作製するエッチング工程
JP2010157388A Pending JP2010283362A (ja) 1998-06-08 2010-07-12 実質的にアンダカットのないシリコンを絶縁体構造上に作製するエッチング工程

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2010157388A Pending JP2010283362A (ja) 1998-06-08 2010-07-12 実質的にアンダカットのないシリコンを絶縁体構造上に作製するエッチング工程

Country Status (5)

Country Link
US (1) US6071822A (enExample)
EP (1) EP1110235A1 (enExample)
JP (2) JP2002518825A (enExample)
KR (1) KR100613842B1 (enExample)
WO (1) WO1999065065A1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006062085A1 (ja) * 2004-12-06 2006-06-15 Matsushita Electric Industrial Co., Ltd. ドライエッチング方法及びドライエッチング装置
JP2010263132A (ja) * 2009-05-11 2010-11-18 Hitachi High-Technologies Corp ドライエッチング方法
JP2011100760A (ja) * 2009-11-04 2011-05-19 Ulvac Japan Ltd エッチング方法
JP2014013821A (ja) * 2012-07-04 2014-01-23 Samco Inc 高アスペクト比の凹凸構造を有するシリコン基板の製造方法
JP7257088B1 (ja) 2022-03-24 2023-04-13 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理システム

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US6417013B1 (en) 1999-01-29 2002-07-09 Plasma-Therm, Inc. Morphed processing of semiconductor devices
AU2114001A (en) * 1999-10-15 2001-04-23 California Institute Of Technology Formation of smooth vertical surface on an optical component
US6593244B1 (en) * 2000-09-11 2003-07-15 Applied Materials Inc. Process for etching conductors at high etch rates
US6402301B1 (en) 2000-10-27 2002-06-11 Lexmark International, Inc Ink jet printheads and methods therefor
KR100378353B1 (ko) * 2001-03-12 2003-03-29 삼성전자주식회사 Ｒｉｅ 식각시 발생하는 노칭 저감방법
JP4306149B2 (ja) * 2001-05-28 2009-07-29 株式会社デンソー 半導体装置の製造方法
US6660642B2 (en) 2001-07-25 2003-12-09 Chartered Semiconductor Manufacturing Ltd. Toxic residual gas removal by non-reactive ion sputtering
JP4117450B2 (ja) * 2002-03-18 2008-07-16 株式会社デンソー 半導体装置の製造方法
US6846746B2 (en) * 2002-05-01 2005-01-25 Applied Materials, Inc. Method of smoothing a trench sidewall after a deep trench silicon etch process
US7052117B2 (en) 2002-07-03 2006-05-30 Dimatix, Inc. Printhead having a thin pre-fired piezoelectric layer
US6905626B2 (en) * 2002-07-24 2005-06-14 Unaxis Usa Inc. Notch-free etching of high aspect SOI structures using alternating deposition and etching and pulsed plasma
DE10246063A1 (de) * 2002-10-02 2004-04-22 Robert Bosch Gmbh Verfahren zum anisotropen Ätzen eines Siliziumsubstrates
US7977390B2 (en) 2002-10-11 2011-07-12 Lam Research Corporation Method for plasma etching performance enhancement
US7169695B2 (en) * 2002-10-11 2007-01-30 Lam Research Corporation Method for forming a dual damascene structure
US6833325B2 (en) * 2002-10-11 2004-12-21 Lam Research Corporation Method for plasma etching performance enhancement
DE10247913A1 (de) * 2002-10-14 2004-04-22 Robert Bosch Gmbh Plasmaanlage und Verfahren zum anisotropen Einätzen von Strukturen in ein Substrat
US7294580B2 (en) * 2003-04-09 2007-11-13 Lam Research Corporation Method for plasma stripping using periodic modulation of gas chemistry and hydrocarbon addition
US6916746B1 (en) * 2003-04-09 2005-07-12 Lam Research Corporation Method for plasma etching using periodic modulation of gas chemistry
DE10317748B4 (de) * 2003-04-17 2008-10-30 X-Fab Semiconductor Foundries Ag Verfahren zur Überprüfung von Isoliergrabenätzungen in SOI-Scheiben mittels einer Teststruktur
WO2004095570A2 (de) * 2003-04-17 2004-11-04 X-Fab Semiconductor Foundries Ag Teststruktur zur elektrischen ueberpruefung der tiefen von trench-aetzungen in einem soi wafer und zugehoerige arbeitsverfahren
US20050112891A1 (en) * 2003-10-21 2005-05-26 David Johnson Notch-free etching of high aspect SOI structures using a time division multiplex process and RF bias modulation
US7081407B2 (en) * 2003-12-16 2006-07-25 Lam Research Corporation Method of preventing damage to porous low-k materials during resist stripping
US8491076B2 (en) 2004-03-15 2013-07-23 Fujifilm Dimatix, Inc. Fluid droplet ejection devices and methods
US7281778B2 (en) 2004-03-15 2007-10-16 Fujifilm Dimatix, Inc. High frequency droplet ejection device and method
US7728252B2 (en) * 2004-07-02 2010-06-01 Ulvac, Inc. Etching method and system
US7396769B2 (en) * 2004-08-02 2008-07-08 Lam Research Corporation Method for stripping photoresist from etched wafer
US7459100B2 (en) * 2004-12-22 2008-12-02 Lam Research Corporation Methods and apparatus for sequentially alternating among plasma processes in order to optimize a substrate
WO2006074016A2 (en) 2004-12-30 2006-07-13 Fujifilm Dimatix, Inc. Ink jet printing
US7241683B2 (en) * 2005-03-08 2007-07-10 Lam Research Corporation Stabilized photoresist structure for etching process
US7491647B2 (en) * 2005-03-08 2009-02-17 Lam Research Corporation Etch with striation control
JP4275096B2 (ja) * 2005-04-14 2009-06-10 パナソニック株式会社 半導体チップの製造方法
US20060261436A1 (en) * 2005-05-19 2006-11-23 Freescale Semiconductor, Inc. Electronic device including a trench field isolation region and a process for forming the same
JP4512533B2 (ja) * 2005-07-27 2010-07-28 住友精密工業株式会社 エッチング方法及びエッチング装置
US7910489B2 (en) * 2006-02-17 2011-03-22 Lam Research Corporation Infinitely selective photoresist mask etch
US20070249127A1 (en) * 2006-04-24 2007-10-25 Freescale Semiconductor, Inc. Electronic device including a semiconductor layer and a sidewall spacer and a process of forming the same
US7491622B2 (en) * 2006-04-24 2009-02-17 Freescale Semiconductor, Inc. Process of forming an electronic device including a layer formed using an inductively coupled plasma
US7670895B2 (en) 2006-04-24 2010-03-02 Freescale Semiconductor, Inc Process of forming an electronic device including a semiconductor layer and another layer adjacent to an opening within the semiconductor layer
US7528078B2 (en) 2006-05-12 2009-05-05 Freescale Semiconductor, Inc. Process of forming electronic device including a densified nitride layer adjacent to an opening within a semiconductor layer
JP4812512B2 (ja) * 2006-05-19 2011-11-09 オンセミコンダクター・トレーディング・リミテッド 半導体装置の製造方法
KR100875442B1 (ko) 2006-12-28 2008-12-23 주식회사 래디언테크 웨이퍼 식각 방법
US7988247B2 (en) 2007-01-11 2011-08-02 Fujifilm Dimatix, Inc. Ejection of drops having variable drop size from an ink jet printer
US8467221B2 (en) 2010-07-09 2013-06-18 International Business Machines Corporation Magnetic spin shift register memory
US8802545B2 (en) * 2011-03-14 2014-08-12 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
US9105705B2 (en) * 2011-03-14 2015-08-11 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
US8637381B2 (en) * 2011-10-17 2014-01-28 International Business Machines Corporation High-k dielectric and silicon nitride box region
US8691698B2 (en) 2012-02-08 2014-04-08 Lam Research Corporation Controlled gas mixing for smooth sidewall rapid alternating etch process
US9892931B2 (en) * 2013-10-14 2018-02-13 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor manufacturing apparatus and method thereof
CN105448697B (zh) * 2014-07-18 2018-05-01 中微半导体设备(上海)有限公司 高深宽比结构的刻蚀方法及mems器件的制作方法
US11173486B2 (en) 2019-02-13 2021-11-16 International Business Machines Corporation Fluidic cavities for on-chip layering and sealing of separation arrays
JP7382578B2 (ja) * 2019-12-27 2023-11-17 パナソニックＩｐマネジメント株式会社 プラズマ処理方法および素子チップの製造方法
JP2023519708A (ja) 2020-03-31 2023-05-12 ラム リサーチ コーポレーション 塩素を用いた高アスペクト比誘電体エッチング
KR20230069877A (ko) * 2020-09-18 2023-05-19 램 리써치 코포레이션 플라즈마 에칭을 위한 패시베이션 화학 물질
US20240096641A1 (en) * 2022-09-20 2024-03-21 Applied Materials, Inc. In-situ carbon liner for high aspect ratio features

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JPH07503815A (ja) * 1992-12-05 1995-04-20 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング ケイ素の異方性エッチング法
JPH0845903A (ja) * 1994-07-27 1996-02-16 Hitachi Ltd プラズマエッチング方法
JPH09129610A (ja) * 1995-10-26 1997-05-16 Yamaha Corp ドライエッチング方法及び装置

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US4528066A (en) * 1984-07-06 1985-07-09 Ibm Corporation Selective anisotropic reactive ion etching process for polysilicide composite structures
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JP2574094B2 (ja) * 1992-02-27 1997-01-22 株式会社日本製鋼所 エッチング方法
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JPH0845903A (ja) * 1994-07-27 1996-02-16 Hitachi Ltd プラズマエッチング方法
JPH09129610A (ja) * 1995-10-26 1997-05-16 Yamaha Corp ドライエッチング方法及び装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006062085A1 (ja) * 2004-12-06 2006-06-15 Matsushita Electric Industrial Co., Ltd. ドライエッチング方法及びドライエッチング装置
JP2010263132A (ja) * 2009-05-11 2010-11-18 Hitachi High-Technologies Corp ドライエッチング方法
JP2011100760A (ja) * 2009-11-04 2011-05-19 Ulvac Japan Ltd エッチング方法
JP2014013821A (ja) * 2012-07-04 2014-01-23 Samco Inc 高アスペクト比の凹凸構造を有するシリコン基板の製造方法
JP7257088B1 (ja) 2022-03-24 2023-04-13 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理システム
JP2023143686A (ja) * 2022-03-24 2023-10-06 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理システム

Also Published As

Publication number Publication date
KR100613842B1 (ko) 2006-08-17
WO1999065065B1 (en) 2000-08-03
US6071822A (en) 2000-06-06
EP1110235A1 (en) 2001-06-27
WO1999065065A9 (en) 2000-07-06
JP2010283362A (ja) 2010-12-16
KR20010052677A (ko) 2001-06-25
WO1999065065A1 (en) 1999-12-16

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