JP2002515657A5 - - Google Patents
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- Publication number
- JP2002515657A5 JP2002515657A5 JP2000549789A JP2000549789A JP2002515657A5 JP 2002515657 A5 JP2002515657 A5 JP 2002515657A5 JP 2000549789 A JP2000549789 A JP 2000549789A JP 2000549789 A JP2000549789 A JP 2000549789A JP 2002515657 A5 JP2002515657 A5 JP 2002515657A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive polymer
- electrically conductive
- polymer layer
- pumice
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 6
- 229920001940 conductive polymer Polymers 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- 238000005422 blasting Methods 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000008262 pumice Substances 0.000 claims 2
- 239000000243 solution Substances 0.000 claims 2
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical group O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 claims 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical class [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims 1
- 230000001680 brushing effect Effects 0.000 claims 1
- 239000003638 chemical reducing agent Substances 0.000 claims 1
- 239000000706 filtrate Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000001465 metallisation Methods 0.000 claims 1
- 239000003960 organic solvent Substances 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 239000012266 salt solution Substances 0.000 claims 1
- 238000005488 sandblasting Methods 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 230000008961 swelling Effects 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19822075.8 | 1998-05-16 | ||
| DE19822075A DE19822075C2 (de) | 1998-05-16 | 1998-05-16 | Verfahren zur metallischen Beschichtung von Substraten |
| PCT/EP1999/003322 WO1999060189A2 (de) | 1998-05-16 | 1999-05-14 | Verfahren zur metallischen beschichtung von substraten |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002515657A JP2002515657A (ja) | 2002-05-28 |
| JP2002515657A5 true JP2002515657A5 (enExample) | 2005-10-20 |
| JP4044286B2 JP4044286B2 (ja) | 2008-02-06 |
Family
ID=7868037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000549789A Expired - Lifetime JP4044286B2 (ja) | 1998-05-16 | 1999-05-14 | 金属を用いた基板の被覆方法 |
Country Status (21)
| Country | Link |
|---|---|
| US (1) | US6589593B1 (enExample) |
| EP (1) | EP1088121B1 (enExample) |
| JP (1) | JP4044286B2 (enExample) |
| KR (1) | KR100541893B1 (enExample) |
| CN (1) | CN1299548C (enExample) |
| AT (1) | ATE213510T1 (enExample) |
| AU (1) | AU4261899A (enExample) |
| CA (1) | CA2331757A1 (enExample) |
| DE (2) | DE19822075C2 (enExample) |
| HU (1) | HUP0102325A3 (enExample) |
| IL (1) | IL139422A (enExample) |
| IS (1) | IS5704A (enExample) |
| NO (1) | NO20005778L (enExample) |
| PL (1) | PL345093A1 (enExample) |
| RO (1) | RO119837B1 (enExample) |
| RU (1) | RU2214075C2 (enExample) |
| SK (1) | SK16922000A3 (enExample) |
| TR (1) | TR200003369T2 (enExample) |
| WO (1) | WO1999060189A2 (enExample) |
| YU (1) | YU71000A (enExample) |
| ZA (1) | ZA200006623B (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10007435A1 (de) * | 2000-02-18 | 2001-08-23 | Enthone Omi Deutschland Gmbh | Verfahren zum Galvanisieren eines mit einem elektrisch leitenden Polymer beschichteten Werkstücks |
| ATE279552T1 (de) * | 2000-09-26 | 2004-10-15 | Enthone Omi Deutschland Gmbh | Verfahren zur selektiven metallisierung dielektrischer materialien |
| ES2387696T3 (es) | 2000-10-09 | 2012-09-28 | Hueck Folien Ges.M.B.H. | Lámina metalizada y procedimiento para su fabricación, así como su uso |
| KR20020079075A (ko) * | 2001-04-13 | 2002-10-19 | 이진규 | 폴리메틸실세스퀴옥산 공중합체와 이를 이용한 저유전성절연막 및 그 제조방법 |
| DE10343873A1 (de) * | 2003-09-23 | 2005-04-21 | Starck H C Gmbh | Verfahren zur Reinigung von Thiophenen |
| US20060009029A1 (en) * | 2004-07-06 | 2006-01-12 | Agency For Science, Technology And Research | Wafer level through-hole plugging using mechanical forming technique |
| DE102004042111A1 (de) * | 2004-08-30 | 2006-03-09 | Ovd Kinegram Ag | Mehrschichtiger Körper mit unterschiedlich mikrostrukturierten Bereichen mit elektrisch leitfähiger Beschichtung |
| US20070237977A1 (en) * | 2006-04-07 | 2007-10-11 | United States Of America As Represented By The Administrator Of The National Aeronautics And Spac | Thin Metal Film System To Include Flexible Substrate And Method Of Making Same |
| EP1870491B1 (de) * | 2006-06-22 | 2015-05-27 | Enthone, Inc. | Verbessertes Verfahren zur Direktmetallisierung von elektrisch nicht leitfähigen Substratoberflächen, insbesondere Polyimidoberflächen |
| US8198976B2 (en) * | 2006-08-18 | 2012-06-12 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Flexible thin metal film thermal sensing system |
| US7649439B2 (en) * | 2006-08-18 | 2010-01-19 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Flexible thin metal film thermal sensing system |
| KR101409710B1 (ko) * | 2006-09-07 | 2014-06-24 | 엔쏜 인코포레이티드 | 전도성 중합체의 전착 및 비전도성 기판의 금속화 |
| CN100553405C (zh) * | 2007-07-27 | 2009-10-21 | 日月光半导体制造股份有限公司 | 制作电路板的方法 |
| FR2934609B1 (fr) * | 2008-07-30 | 2011-07-22 | Jet Metal Technologies | Procede non eletrolytique de metallisation en ligne de substrats par projection avec traitement de surface prealable et dispositif pour la mise en oeuvre du procede. |
| RU2390978C1 (ru) * | 2008-09-15 | 2010-05-27 | Игорь Валерьевич Реутов | Способ формирования проводящих дорожек в пористой полимерной пленке |
| JP5491022B2 (ja) * | 2008-12-10 | 2014-05-14 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法、基板処理装置の制御方法および基板処理装置の表示方法 |
| US9378859B2 (en) | 2010-08-20 | 2016-06-28 | Rhodia Operations | Polymer compositions, polymer films, polymer gels, polymer foams, and electronic devices containing such films, gels and foams |
| PL2447296T3 (pl) * | 2010-10-29 | 2018-06-29 | Macdermid Enthone Inc. | Kompozycja i sposób osadzania przewodzących polimerów na podłożach dielektrycznych |
| CN104349585B (zh) * | 2013-08-01 | 2018-05-15 | 宏启胜精密电子(秦皇岛)有限公司 | 电路板及其制作方法 |
| WO2015183304A1 (en) | 2014-05-30 | 2015-12-03 | Uab Rekin International | Chrome-free adhesion pre-treatment for plastics |
| CN105887054B (zh) * | 2016-06-13 | 2019-01-18 | 华南理工大学 | 一种高导电生物质/纳米金属柔性复合膜及其制备方法 |
| CN110029382B (zh) * | 2019-05-22 | 2021-09-24 | 电子科技大学 | 一种用于直接电镀的表面处理工艺及其相关直接电镀工艺 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4216246A (en) * | 1977-05-14 | 1980-08-05 | Hitachi Chemical Company, Ltd. | Method of improving adhesion between insulating substrates and metal deposits electrolessly plated thereon, and method of making additive printed circuit boards |
| US4847114A (en) * | 1984-01-26 | 1989-07-11 | Learonal, Inc. | Preparation of printed circuit boards by selective metallization |
| DE3806884C1 (en) * | 1988-03-03 | 1989-09-21 | Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De | Through-plated contact printed circuit and method for fabricating it |
| DE3928832C2 (de) * | 1989-08-31 | 1995-04-20 | Blasberg Oberflaechentech | Verfahren zur Herstellung von durchkontaktierten Leiterplatten und Leiterplatten-Halbzeug |
| US5183692A (en) * | 1991-07-01 | 1993-02-02 | Motorola, Inc. | Polyimide coating having electroless metal plate |
| US5268088A (en) * | 1991-12-12 | 1993-12-07 | Eric F. Harnden | Simplified method for direct electroplating of acrylic or epoxy containing dielectric substrates |
| DE4202337A1 (de) * | 1992-01-29 | 1993-08-05 | Bayer Ag | Verfahren zur durchkontaktierung von zweilagigen leiterplatten und multilayern |
| US5427841A (en) * | 1993-03-09 | 1995-06-27 | U.S. Philips Corporation | Laminated structure of a metal layer on a conductive polymer layer and method of manufacturing such a structure |
| DE4326079A1 (de) * | 1993-07-30 | 1995-02-02 | Atotech Deutschland Gmbh | Verfahren zur Behandlung von Kunststoffoberflächen und Anquell-Lösung |
| DE19502988B4 (de) * | 1995-01-31 | 2004-03-18 | Blasberg Oberflächentechnik GmbH | Verfahren zur galvanischen Beschichtung von Polymeroberflächen |
| KR20010031137A (ko) * | 1997-10-15 | 2001-04-16 | 그래햄 이. 테일러 | 전자 전도성 중합체 |
-
1998
- 1998-05-16 DE DE19822075A patent/DE19822075C2/de not_active Expired - Fee Related
-
1999
- 1999-05-14 AU AU42618/99A patent/AU4261899A/en not_active Abandoned
- 1999-05-14 EP EP99952103A patent/EP1088121B1/de not_active Expired - Lifetime
- 1999-05-14 CA CA002331757A patent/CA2331757A1/en not_active Abandoned
- 1999-05-14 JP JP2000549789A patent/JP4044286B2/ja not_active Expired - Lifetime
- 1999-05-14 US US09/674,510 patent/US6589593B1/en not_active Expired - Fee Related
- 1999-05-14 SK SK1692-2000A patent/SK16922000A3/sk unknown
- 1999-05-14 RO ROA200001122A patent/RO119837B1/ro unknown
- 1999-05-14 DE DE59900882T patent/DE59900882D1/de not_active Expired - Lifetime
- 1999-05-14 AT AT99952103T patent/ATE213510T1/de not_active IP Right Cessation
- 1999-05-14 PL PL99345093A patent/PL345093A1/xx unknown
- 1999-05-14 KR KR1020007012740A patent/KR100541893B1/ko not_active Expired - Fee Related
- 1999-05-14 TR TR2000/03369T patent/TR200003369T2/xx unknown
- 1999-05-14 HU HU0102325A patent/HUP0102325A3/hu unknown
- 1999-05-14 CN CNB998086835A patent/CN1299548C/zh not_active Expired - Lifetime
- 1999-05-14 YU YU71000A patent/YU71000A/sh unknown
- 1999-05-14 IL IL13942299A patent/IL139422A/en not_active IP Right Cessation
- 1999-05-14 WO PCT/EP1999/003322 patent/WO1999060189A2/de not_active Ceased
- 1999-05-14 RU RU2000131601/09A patent/RU2214075C2/ru not_active IP Right Cessation
-
2000
- 2000-11-02 IS IS5704A patent/IS5704A/is unknown
- 2000-11-15 ZA ZA200006623A patent/ZA200006623B/xx unknown
- 2000-11-15 NO NO20005778A patent/NO20005778L/no not_active Application Discontinuation
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