JP2002515657A5 - - Google Patents
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- Publication number
- JP2002515657A5 JP2002515657A5 JP2000549789A JP2000549789A JP2002515657A5 JP 2002515657 A5 JP2002515657 A5 JP 2002515657A5 JP 2000549789 A JP2000549789 A JP 2000549789A JP 2000549789 A JP2000549789 A JP 2000549789A JP 2002515657 A5 JP2002515657 A5 JP 2002515657A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive polymer
- electrically conductive
- polymer layer
- pumice
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 6
- 229920001940 conductive polymer Polymers 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- 238000005422 blasting Methods 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000008262 pumice Substances 0.000 claims 2
- 239000000243 solution Substances 0.000 claims 2
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical group O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 claims 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical class [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims 1
- 230000001680 brushing effect Effects 0.000 claims 1
- 239000003638 chemical reducing agent Substances 0.000 claims 1
- 239000000706 filtrate Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000001465 metallisation Methods 0.000 claims 1
- 239000003960 organic solvent Substances 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 239000012266 salt solution Substances 0.000 claims 1
- 238000005488 sandblasting Methods 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 230000008961 swelling Effects 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19822075A DE19822075C2 (de) | 1998-05-16 | 1998-05-16 | Verfahren zur metallischen Beschichtung von Substraten |
| DE19822075.8 | 1998-05-16 | ||
| PCT/EP1999/003322 WO1999060189A2 (de) | 1998-05-16 | 1999-05-14 | Verfahren zur metallischen beschichtung von substraten |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002515657A JP2002515657A (ja) | 2002-05-28 |
| JP2002515657A5 true JP2002515657A5 (enExample) | 2005-10-20 |
| JP4044286B2 JP4044286B2 (ja) | 2008-02-06 |
Family
ID=7868037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000549789A Expired - Lifetime JP4044286B2 (ja) | 1998-05-16 | 1999-05-14 | 金属を用いた基板の被覆方法 |
Country Status (21)
| Country | Link |
|---|---|
| US (1) | US6589593B1 (enExample) |
| EP (1) | EP1088121B1 (enExample) |
| JP (1) | JP4044286B2 (enExample) |
| KR (1) | KR100541893B1 (enExample) |
| CN (1) | CN1299548C (enExample) |
| AT (1) | ATE213510T1 (enExample) |
| AU (1) | AU4261899A (enExample) |
| CA (1) | CA2331757A1 (enExample) |
| DE (2) | DE19822075C2 (enExample) |
| HU (1) | HUP0102325A3 (enExample) |
| IL (1) | IL139422A (enExample) |
| IS (1) | IS5704A (enExample) |
| NO (1) | NO20005778L (enExample) |
| PL (1) | PL345093A1 (enExample) |
| RO (1) | RO119837B1 (enExample) |
| RU (1) | RU2214075C2 (enExample) |
| SK (1) | SK16922000A3 (enExample) |
| TR (1) | TR200003369T2 (enExample) |
| WO (1) | WO1999060189A2 (enExample) |
| YU (1) | YU71000A (enExample) |
| ZA (1) | ZA200006623B (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10007435A1 (de) * | 2000-02-18 | 2001-08-23 | Enthone Omi Deutschland Gmbh | Verfahren zum Galvanisieren eines mit einem elektrisch leitenden Polymer beschichteten Werkstücks |
| DE50008242D1 (de) * | 2000-09-26 | 2004-11-18 | Enthone Omi Deutschland Gmbh | Verfahren zur selektiven Metallisierung dielektrischer Materialien |
| JP2004510610A (ja) | 2000-10-09 | 2004-04-08 | ヒューエック フォリエン ゲゼルシャフト エム．ベー．ハー． | 金属被覆されたフィルム及びその製造方法並びに利用法 |
| KR20020079075A (ko) * | 2001-04-13 | 2002-10-19 | 이진규 | 폴리메틸실세스퀴옥산 공중합체와 이를 이용한 저유전성절연막 및 그 제조방법 |
| DE10343873A1 (de) * | 2003-09-23 | 2005-04-21 | Starck H C Gmbh | Verfahren zur Reinigung von Thiophenen |
| US20060009029A1 (en) * | 2004-07-06 | 2006-01-12 | Agency For Science, Technology And Research | Wafer level through-hole plugging using mechanical forming technique |
| DE102004042111A1 (de) * | 2004-08-30 | 2006-03-09 | Ovd Kinegram Ag | Mehrschichtiger Körper mit unterschiedlich mikrostrukturierten Bereichen mit elektrisch leitfähiger Beschichtung |
| US20070237977A1 (en) * | 2006-04-07 | 2007-10-11 | United States Of America As Represented By The Administrator Of The National Aeronautics And Spac | Thin Metal Film System To Include Flexible Substrate And Method Of Making Same |
| EP1870491B1 (de) * | 2006-06-22 | 2015-05-27 | Enthone, Inc. | Verbessertes Verfahren zur Direktmetallisierung von elektrisch nicht leitfähigen Substratoberflächen, insbesondere Polyimidoberflächen |
| US7649439B2 (en) * | 2006-08-18 | 2010-01-19 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Flexible thin metal film thermal sensing system |
| US8198976B2 (en) * | 2006-08-18 | 2012-06-12 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Flexible thin metal film thermal sensing system |
| JP5236648B2 (ja) * | 2006-09-07 | 2013-07-17 | エンソン インコーポレイテッド | 電解めっき銅金属配線で絶縁性基板の表面を金属配線するための方法 |
| CN100553405C (zh) * | 2007-07-27 | 2009-10-21 | 日月光半导体制造股份有限公司 | 制作电路板的方法 |
| FR2934609B1 (fr) * | 2008-07-30 | 2011-07-22 | Jet Metal Technologies | Procede non eletrolytique de metallisation en ligne de substrats par projection avec traitement de surface prealable et dispositif pour la mise en oeuvre du procede. |
| RU2390978C1 (ru) * | 2008-09-15 | 2010-05-27 | Игорь Валерьевич Реутов | Способ формирования проводящих дорожек в пористой полимерной пленке |
| JP5491022B2 (ja) * | 2008-12-10 | 2014-05-14 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法、基板処理装置の制御方法および基板処理装置の表示方法 |
| KR101898499B1 (ko) | 2010-08-20 | 2018-09-13 | 로디아 오퍼레이션스 | 중합체 조성물, 중합체 막, 중합체 겔, 중합체 발포제, 및 이러한 막, 겔, 및 발포제를 포함하는 전자장치 |
| ES2662039T3 (es) * | 2010-10-29 | 2018-04-05 | Macdermid Enthone Inc. | Composición y método para la deposición de polímeros conductores en sustratos dieléctricos |
| CN104349585B (zh) * | 2013-08-01 | 2018-05-15 | 宏启胜精密电子(秦皇岛)有限公司 | 电路板及其制作方法 |
| WO2015183304A1 (en) | 2014-05-30 | 2015-12-03 | Uab Rekin International | Chrome-free adhesion pre-treatment for plastics |
| CN105887054B (zh) * | 2016-06-13 | 2019-01-18 | 华南理工大学 | 一种高导电生物质/纳米金属柔性复合膜及其制备方法 |
| CN110029382B (zh) * | 2019-05-22 | 2021-09-24 | 电子科技大学 | 一种用于直接电镀的表面处理工艺及其相关直接电镀工艺 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4216246A (en) * | 1977-05-14 | 1980-08-05 | Hitachi Chemical Company, Ltd. | Method of improving adhesion between insulating substrates and metal deposits electrolessly plated thereon, and method of making additive printed circuit boards |
| US4847114A (en) * | 1984-01-26 | 1989-07-11 | Learonal, Inc. | Preparation of printed circuit boards by selective metallization |
| DE3806884C1 (en) * | 1988-03-03 | 1989-09-21 | Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De | Through-plated contact printed circuit and method for fabricating it |
| DE3928832C2 (de) * | 1989-08-31 | 1995-04-20 | Blasberg Oberflaechentech | Verfahren zur Herstellung von durchkontaktierten Leiterplatten und Leiterplatten-Halbzeug |
| US5183692A (en) * | 1991-07-01 | 1993-02-02 | Motorola, Inc. | Polyimide coating having electroless metal plate |
| US5268088A (en) * | 1991-12-12 | 1993-12-07 | Eric F. Harnden | Simplified method for direct electroplating of acrylic or epoxy containing dielectric substrates |
| DE4202337A1 (de) * | 1992-01-29 | 1993-08-05 | Bayer Ag | Verfahren zur durchkontaktierung von zweilagigen leiterplatten und multilayern |
| US5427841A (en) * | 1993-03-09 | 1995-06-27 | U.S. Philips Corporation | Laminated structure of a metal layer on a conductive polymer layer and method of manufacturing such a structure |
| DE4326079A1 (de) * | 1993-07-30 | 1995-02-02 | Atotech Deutschland Gmbh | Verfahren zur Behandlung von Kunststoffoberflächen und Anquell-Lösung |
| DE19502988B4 (de) * | 1995-01-31 | 2004-03-18 | Blasberg Oberflächentechnik GmbH | Verfahren zur galvanischen Beschichtung von Polymeroberflächen |
| EP1027709A1 (en) * | 1997-10-15 | 2000-08-16 | The Dow Chemical Company | Electronically-conductive polymers |
-
1998
- 1998-05-16 DE DE19822075A patent/DE19822075C2/de not_active Expired - Fee Related
-
1999
- 1999-05-14 TR TR2000/03369T patent/TR200003369T2/xx unknown
- 1999-05-14 CN CNB998086835A patent/CN1299548C/zh not_active Expired - Lifetime
- 1999-05-14 AT AT99952103T patent/ATE213510T1/de not_active IP Right Cessation
- 1999-05-14 YU YU71000A patent/YU71000A/sh unknown
- 1999-05-14 RO ROA200001122A patent/RO119837B1/ro unknown
- 1999-05-14 PL PL99345093A patent/PL345093A1/xx unknown
- 1999-05-14 JP JP2000549789A patent/JP4044286B2/ja not_active Expired - Lifetime
- 1999-05-14 CA CA002331757A patent/CA2331757A1/en not_active Abandoned
- 1999-05-14 HU HU0102325A patent/HUP0102325A3/hu unknown
- 1999-05-14 WO PCT/EP1999/003322 patent/WO1999060189A2/de not_active Ceased
- 1999-05-14 IL IL13942299A patent/IL139422A/en not_active IP Right Cessation
- 1999-05-14 KR KR1020007012740A patent/KR100541893B1/ko not_active Expired - Fee Related
- 1999-05-14 SK SK1692-2000A patent/SK16922000A3/sk unknown
- 1999-05-14 AU AU42618/99A patent/AU4261899A/en not_active Abandoned
- 1999-05-14 RU RU2000131601/09A patent/RU2214075C2/ru not_active IP Right Cessation
- 1999-05-14 DE DE59900882T patent/DE59900882D1/de not_active Expired - Lifetime
- 1999-05-14 EP EP99952103A patent/EP1088121B1/de not_active Expired - Lifetime
- 1999-05-14 US US09/674,510 patent/US6589593B1/en not_active Expired - Fee Related
-
2000
- 2000-11-02 IS IS5704A patent/IS5704A/is unknown
- 2000-11-15 NO NO20005778A patent/NO20005778L/no not_active Application Discontinuation
- 2000-11-15 ZA ZA200006623A patent/ZA200006623B/xx unknown
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