CN1299548C - 在衬底上形成金属敷层的方法 - Google Patents

在衬底上形成金属敷层的方法 Download PDF

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Publication number
CN1299548C
CN1299548C CNB998086835A CN99808683A CN1299548C CN 1299548 C CN1299548 C CN 1299548C CN B998086835 A CNB998086835 A CN B998086835A CN 99808683 A CN99808683 A CN 99808683A CN 1299548 C CN1299548 C CN 1299548C
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CN
China
Prior art keywords
conductive polymer
solution
metallization
substrate
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB998086835A
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English (en)
Chinese (zh)
Other versions
CN1309881A (zh
Inventor
J·胡佩
S·菲克斯
O·斯泰纽斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Blasberg Oberflachentechnik GmbH
Original Assignee
Blasberg Oberflachentechnik GmbH
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Filing date
Publication date
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Publication of CN1309881A publication Critical patent/CN1309881A/zh
Application granted granted Critical
Publication of CN1299548C publication Critical patent/CN1299548C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2013—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by mechanical pretreatment, e.g. grinding, sanding
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/26—Roughening, e.g. by etching using organic liquids
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Chemical Treatment Of Metals (AREA)
CNB998086835A 1998-05-16 1999-05-14 在衬底上形成金属敷层的方法 Expired - Lifetime CN1299548C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19822075.8 1998-05-16
DE19822075A DE19822075C2 (de) 1998-05-16 1998-05-16 Verfahren zur metallischen Beschichtung von Substraten

Publications (2)

Publication Number Publication Date
CN1309881A CN1309881A (zh) 2001-08-22
CN1299548C true CN1299548C (zh) 2007-02-07

Family

ID=7868037

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB998086835A Expired - Lifetime CN1299548C (zh) 1998-05-16 1999-05-14 在衬底上形成金属敷层的方法

Country Status (21)

Country Link
US (1) US6589593B1 (enExample)
EP (1) EP1088121B1 (enExample)
JP (1) JP4044286B2 (enExample)
KR (1) KR100541893B1 (enExample)
CN (1) CN1299548C (enExample)
AT (1) ATE213510T1 (enExample)
AU (1) AU4261899A (enExample)
CA (1) CA2331757A1 (enExample)
DE (2) DE19822075C2 (enExample)
HU (1) HUP0102325A3 (enExample)
IL (1) IL139422A (enExample)
IS (1) IS5704A (enExample)
NO (1) NO20005778L (enExample)
PL (1) PL345093A1 (enExample)
RO (1) RO119837B1 (enExample)
RU (1) RU2214075C2 (enExample)
SK (1) SK16922000A3 (enExample)
TR (1) TR200003369T2 (enExample)
WO (1) WO1999060189A2 (enExample)
YU (1) YU71000A (enExample)
ZA (1) ZA200006623B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110029382A (zh) * 2019-05-22 2019-07-19 电子科技大学 一种用于直接电镀的表面处理工艺及其相关直接电镀工艺

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DE10007435A1 (de) * 2000-02-18 2001-08-23 Enthone Omi Deutschland Gmbh Verfahren zum Galvanisieren eines mit einem elektrisch leitenden Polymer beschichteten Werkstücks
ATE279552T1 (de) * 2000-09-26 2004-10-15 Enthone Omi Deutschland Gmbh Verfahren zur selektiven metallisierung dielektrischer materialien
ES2387696T3 (es) 2000-10-09 2012-09-28 Hueck Folien Ges.M.B.H. Lámina metalizada y procedimiento para su fabricación, así como su uso
KR20020079075A (ko) * 2001-04-13 2002-10-19 이진규 폴리메틸실세스퀴옥산 공중합체와 이를 이용한 저유전성절연막 및 그 제조방법
DE10343873A1 (de) * 2003-09-23 2005-04-21 Starck H C Gmbh Verfahren zur Reinigung von Thiophenen
US20060009029A1 (en) * 2004-07-06 2006-01-12 Agency For Science, Technology And Research Wafer level through-hole plugging using mechanical forming technique
DE102004042111A1 (de) * 2004-08-30 2006-03-09 Ovd Kinegram Ag Mehrschichtiger Körper mit unterschiedlich mikrostrukturierten Bereichen mit elektrisch leitfähiger Beschichtung
US20070237977A1 (en) * 2006-04-07 2007-10-11 United States Of America As Represented By The Administrator Of The National Aeronautics And Spac Thin Metal Film System To Include Flexible Substrate And Method Of Making Same
EP1870491B1 (de) * 2006-06-22 2015-05-27 Enthone, Inc. Verbessertes Verfahren zur Direktmetallisierung von elektrisch nicht leitfähigen Substratoberflächen, insbesondere Polyimidoberflächen
US8198976B2 (en) * 2006-08-18 2012-06-12 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Flexible thin metal film thermal sensing system
US7649439B2 (en) * 2006-08-18 2010-01-19 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Flexible thin metal film thermal sensing system
KR101409710B1 (ko) * 2006-09-07 2014-06-24 엔쏜 인코포레이티드 전도성 중합체의 전착 및 비전도성 기판의 금속화
CN100553405C (zh) * 2007-07-27 2009-10-21 日月光半导体制造股份有限公司 制作电路板的方法
FR2934609B1 (fr) * 2008-07-30 2011-07-22 Jet Metal Technologies Procede non eletrolytique de metallisation en ligne de substrats par projection avec traitement de surface prealable et dispositif pour la mise en oeuvre du procede.
RU2390978C1 (ru) * 2008-09-15 2010-05-27 Игорь Валерьевич Реутов Способ формирования проводящих дорожек в пористой полимерной пленке
JP5491022B2 (ja) * 2008-12-10 2014-05-14 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、基板処理装置の制御方法および基板処理装置の表示方法
US9378859B2 (en) 2010-08-20 2016-06-28 Rhodia Operations Polymer compositions, polymer films, polymer gels, polymer foams, and electronic devices containing such films, gels and foams
PL2447296T3 (pl) * 2010-10-29 2018-06-29 Macdermid Enthone Inc. Kompozycja i sposób osadzania przewodzących polimerów na podłożach dielektrycznych
CN104349585B (zh) * 2013-08-01 2018-05-15 宏启胜精密电子(秦皇岛)有限公司 电路板及其制作方法
WO2015183304A1 (en) 2014-05-30 2015-12-03 Uab Rekin International Chrome-free adhesion pre-treatment for plastics
CN105887054B (zh) * 2016-06-13 2019-01-18 华南理工大学 一种高导电生物质/纳米金属柔性复合膜及其制备方法

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Publication number Priority date Publication date Assignee Title
US5183692A (en) * 1991-07-01 1993-02-02 Motorola, Inc. Polyimide coating having electroless metal plate
US5268088A (en) * 1991-12-12 1993-12-07 Eric F. Harnden Simplified method for direct electroplating of acrylic or epoxy containing dielectric substrates
US5403467A (en) * 1992-01-29 1995-04-04 Bayer Ag Process for through-hole plating of two-layer circuit boards and multilayers

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US4216246A (en) * 1977-05-14 1980-08-05 Hitachi Chemical Company, Ltd. Method of improving adhesion between insulating substrates and metal deposits electrolessly plated thereon, and method of making additive printed circuit boards
US4847114A (en) * 1984-01-26 1989-07-11 Learonal, Inc. Preparation of printed circuit boards by selective metallization
DE3806884C1 (en) * 1988-03-03 1989-09-21 Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De Through-plated contact printed circuit and method for fabricating it
DE3928832C2 (de) * 1989-08-31 1995-04-20 Blasberg Oberflaechentech Verfahren zur Herstellung von durchkontaktierten Leiterplatten und Leiterplatten-Halbzeug
US5427841A (en) * 1993-03-09 1995-06-27 U.S. Philips Corporation Laminated structure of a metal layer on a conductive polymer layer and method of manufacturing such a structure
DE4326079A1 (de) * 1993-07-30 1995-02-02 Atotech Deutschland Gmbh Verfahren zur Behandlung von Kunststoffoberflächen und Anquell-Lösung
DE19502988B4 (de) * 1995-01-31 2004-03-18 Blasberg Oberflächentechnik GmbH Verfahren zur galvanischen Beschichtung von Polymeroberflächen
KR20010031137A (ko) * 1997-10-15 2001-04-16 그래햄 이. 테일러 전자 전도성 중합체

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5183692A (en) * 1991-07-01 1993-02-02 Motorola, Inc. Polyimide coating having electroless metal plate
US5268088A (en) * 1991-12-12 1993-12-07 Eric F. Harnden Simplified method for direct electroplating of acrylic or epoxy containing dielectric substrates
US5403467A (en) * 1992-01-29 1995-04-04 Bayer Ag Process for through-hole plating of two-layer circuit boards and multilayers

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110029382A (zh) * 2019-05-22 2019-07-19 电子科技大学 一种用于直接电镀的表面处理工艺及其相关直接电镀工艺
CN110029382B (zh) * 2019-05-22 2021-09-24 电子科技大学 一种用于直接电镀的表面处理工艺及其相关直接电镀工艺

Also Published As

Publication number Publication date
KR100541893B1 (ko) 2006-01-10
CN1309881A (zh) 2001-08-22
IS5704A (is) 2000-11-02
JP4044286B2 (ja) 2008-02-06
DE59900882D1 (de) 2002-03-28
NO20005778D0 (no) 2000-11-15
YU71000A (sh) 2003-02-28
HK1035385A1 (en) 2001-11-23
KR20010025021A (ko) 2001-03-26
HUP0102325A3 (en) 2002-02-28
PL345093A1 (en) 2001-12-03
DE19822075C2 (de) 2002-03-21
EP1088121A2 (de) 2001-04-04
DE19822075A1 (de) 1999-11-18
IL139422A0 (en) 2001-11-25
SK16922000A3 (sk) 2001-07-10
RO119837B1 (ro) 2005-04-29
ATE213510T1 (de) 2002-03-15
AU4261899A (en) 1999-12-06
CA2331757A1 (en) 1999-11-25
WO1999060189A2 (de) 1999-11-25
HUP0102325A2 (hu) 2001-10-28
RU2214075C2 (ru) 2003-10-10
IL139422A (en) 2004-01-04
US6589593B1 (en) 2003-07-08
EP1088121B1 (de) 2002-02-20
WO1999060189A3 (de) 2000-04-06
NO20005778L (no) 2000-11-27
TR200003369T2 (tr) 2001-07-23
JP2002515657A (ja) 2002-05-28
ZA200006623B (en) 2001-05-30

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