PL2447296T3 - Kompozycja i sposób osadzania przewodzących polimerów na podłożach dielektrycznych - Google Patents

Kompozycja i sposób osadzania przewodzących polimerów na podłożach dielektrycznych

Info

Publication number
PL2447296T3
PL2447296T3 PL10189442T PL10189442T PL2447296T3 PL 2447296 T3 PL2447296 T3 PL 2447296T3 PL 10189442 T PL10189442 T PL 10189442T PL 10189442 T PL10189442 T PL 10189442T PL 2447296 T3 PL2447296 T3 PL 2447296T3
Authority
PL
Poland
Prior art keywords
compostion
deposition
conductive polymers
dielectric substrates
dielectric
Prior art date
Application number
PL10189442T
Other languages
English (en)
Inventor
Jean Rasmussen
Christian Rietmann
Original Assignee
Macdermid Enthone Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macdermid Enthone Inc. filed Critical Macdermid Enthone Inc.
Publication of PL2447296T3 publication Critical patent/PL2447296T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
    • C08G61/123—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds
    • C08G61/126—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds with a five-membered ring containing one sulfur atom in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H01B1/127—Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Chemically Coating (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
PL10189442T 2010-10-29 2010-10-29 Kompozycja i sposób osadzania przewodzących polimerów na podłożach dielektrycznych PL2447296T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP10189442.6A EP2447296B1 (en) 2010-10-29 2010-10-29 Compostion and method for the deposition of conductive polymers on dielectric substrates

Publications (1)

Publication Number Publication Date
PL2447296T3 true PL2447296T3 (pl) 2018-06-29

Family

ID=43828289

Family Applications (1)

Application Number Title Priority Date Filing Date
PL10189442T PL2447296T3 (pl) 2010-10-29 2010-10-29 Kompozycja i sposób osadzania przewodzących polimerów na podłożach dielektrycznych

Country Status (9)

Country Link
US (1) US10021782B2 (pl)
EP (3) EP2447296B1 (pl)
JP (1) JP6126005B2 (pl)
KR (1) KR101828118B1 (pl)
CN (1) CN103354818B (pl)
ES (3) ES2662039T3 (pl)
PL (1) PL2447296T3 (pl)
TR (1) TR201802555T4 (pl)
WO (1) WO2012058681A2 (pl)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101898499B1 (ko) 2010-08-20 2018-09-13 로디아 오퍼레이션스 중합체 조성물, 중합체 막, 중합체 겔, 중합체 발포제, 및 이러한 막, 겔, 및 발포제를 포함하는 전자장치
DE102012022976A1 (de) * 2012-11-26 2014-05-28 Ewe-Forschungszentrum Für Energietechnologie E. V. Einsatz leitfähiger Polymere in Batterie-Elektroden
CN103338596A (zh) * 2013-06-18 2013-10-02 华南理工大学 一种不用光刻胶的全加成线路板制作方法
CN103491710B (zh) * 2013-09-09 2016-02-17 莆田市龙腾电子科技有限公司 一种双面及多层线路板加工工艺
CN104113980B (zh) * 2014-06-13 2017-06-30 梅州鼎泰电路板有限公司 一种钻孔后可直接进行导电处理的pcb板
BR112017015625A2 (pt) 2015-01-20 2019-11-12 Macdermid Enthone Inc composições incluindo um ácido com alto peso molecular adequado para formação de polímero condutivo em substratos dielétricos
CN111171356B (zh) 2018-10-24 2021-06-22 电子科技大学 一种制备复合型导电聚合物的方法
CN111935919A (zh) * 2020-07-16 2020-11-13 江门市奔力达电路有限公司 一种新型的铝基板盲孔电镀工艺
KR102876645B1 (ko) * 2021-02-08 2025-10-28 맥더미드 엔쏜 인코포레이티드 확산 장벽 형성을 위한 방법 및 습식 화학 조성물
CN119639186B (zh) * 2024-12-31 2026-07-21 贵州省材料产业技术研究院 一种低腐蚀性高导电pedot：pss材料及其制备方法与应用

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3603373A1 (de) * 1986-02-05 1987-08-06 Basf Ag Verfahren zur elektrochemischen beschichtung von kohlenstoff-fasern
US4803096A (en) * 1987-08-03 1989-02-07 Milliken Research Corporation Electrically conductive textile materials and method for making same
KR960014476B1 (ko) 1988-03-03 1996-10-15 블라스베르그 오베르플래첸테크닉 게엠베하 신규의 통과구멍이 도금된 인쇄 회로판 및 그 제조방법
DE59010247D1 (de) * 1990-02-08 1996-05-02 Bayer Ag Neue Polythiophen-Dispersionen, ihre Herstellung und ihre Verwendung
GB2243838A (en) 1990-05-09 1991-11-13 Learonal Process for metallising a through-hole printed circuit board by electroplating
DE4113654A1 (de) 1991-04-26 1992-10-29 Blasberg Oberflaechentech Mittel zur selektiven ausbildung einer duennen oxidierenden schicht
DE4202337A1 (de) * 1992-01-29 1993-08-05 Bayer Ag Verfahren zur durchkontaktierung von zweilagigen leiterplatten und multilayern
DE4205190C2 (de) 1992-02-20 1994-07-14 Blasberg Oberflaechentech Verfahren und Mittel zur Konditionierung von Substraten oder Basismaterialien für die nachfolgende Metallisierung
DE4436391A1 (de) * 1994-10-12 1996-04-18 Bayer Ag Verfahren zur direkten galvanischen Durchkontaktierung von zweilagigen Leiterplatten und Multilayern
DE19822075C2 (de) * 1998-05-16 2002-03-21 Enthone Gmbh Verfahren zur metallischen Beschichtung von Substraten
DE50115774D1 (de) * 2000-11-22 2011-02-24 Strack H C Clevios Gmbh Dispergierbare polymerpulver
DE10124631C1 (de) * 2001-05-18 2002-11-21 Atotech Deutschland Gmbh Verfahren zum direkten elektrolytischen Metallisieren von elektrisch nichtleiteitenden Substratoberflächen
JP2009507946A (ja) * 2005-09-08 2009-02-26 サイテック サーフェース スペシャリティーズ、エス．エイ． ポリマー及び組成物
EP1870491B1 (de) * 2006-06-22 2015-05-27 Enthone, Inc. Verbessertes Verfahren zur Direktmetallisierung von elektrisch nicht leitfähigen Substratoberflächen, insbesondere Polyimidoberflächen
JP5236648B2 (ja) * 2006-09-07 2013-07-17 エンソン インコーポレイテッド 電解めっき銅金属配線で絶縁性基板の表面を金属配線するための方法
EP1897974B1 (en) 2006-09-07 2012-08-01 Enthone Inc. Deposition of conductive polymer and metallization of non-conductive substrates
JP5062738B2 (ja) * 2007-06-20 2012-10-31 テイカ株式会社 導電性組成物、その製造方法、上記導電性組成物の分散液および上記導電性組成物の応用物
JP5581078B2 (ja) * 2009-03-02 2014-08-27 富士フイルム株式会社 平版印刷版原版及び平版印刷版の作製方法
JP2010090397A (ja) * 2010-01-29 2010-04-22 Nagase Chemtex Corp ポリ（３，４−ジアルコキシチオフェン）とポリ陰イオンとの複合体の水分散体の製造方法

Also Published As

Publication number Publication date
KR20140000258A (ko) 2014-01-02
ES2949516T3 (es) 2023-09-29
US10021782B2 (en) 2018-07-10
TR201802555T4 (tr) 2018-03-21
EP2447296A1 (en) 2012-05-02
JP6126005B2 (ja) 2017-05-10
US20140138253A1 (en) 2014-05-22
WO2012058681A2 (en) 2012-05-03
ES2718822T3 (es) 2019-07-04
EP2632969A2 (en) 2013-09-04
WO2012058681A3 (en) 2012-08-02
ES2662039T3 (es) 2018-04-05
EP2447296B1 (en) 2018-01-10
EP2632969B1 (en) 2019-02-27
EP3502159B1 (en) 2023-05-31
KR101828118B1 (ko) 2018-02-13
EP3502159A1 (en) 2019-06-26
JP2013543908A (ja) 2013-12-09
CN103354818B (zh) 2016-10-19
CN103354818A (zh) 2013-10-16

Similar Documents

Publication Publication Date Title
EP2673403A1 (en) Insulated metal substrate
EP2599583A4 (en) Substrate processing method
EP2599582A4 (en) Substrate processing method
EP2673330A2 (en) Electrically conductive adhesives comprising at least one metal precursor
EP2634795A4 (en) Process for manufacture of through-type wiring substrate, and through-type wiring substrate
GB2497451A8 (en) Gate insulator layer for electronic devices
EP2576105A4 (en) PROTECTIVE COATINGS FOR SUBSTRATES WITH AN ACTIVE SURFACE
SG11201503968SA (en) Methods of coating an electrically conductive substrate and related electrodepositable compositions
EP2547807B8 (en) Method for direct metallization of non-conductive substrates
EP2535183A4 (en) HART COATING PROCESS FORM
EP2532029A4 (en) Insulating metal substrate and semiconductor device
EP2661100A4 (en) Electronic apparatus
GB2477336B (en) Dielectric component with electrical connection
EP2530783A4 (en) Dielectric antenna
EP3016113A4 (en) Conductive substrate and manufacturing method thereof
EP2610969A4 (en) CONDUCTIVE RUBBER COMPONENTS AND ASSEMBLY METHOD THEREFOR
EP2760945A4 (en) CONDUCTIVE COATINGS FOR CAPACITORS AND CONDENSERS THEREWITH
EP2521621A4 (en) APPARATUS AND METHOD FOR COATING A SUBSTRATE
PL2451880T3 (pl) Metaliczne podłoże pokryte polimerem i sposób wytwarzania
AU2011263565A1 (en) Method for the low-temperature preparation of electrically conductive mesostructured coatings
GB2477117B (en) Anticorrosion sol-gel coating for metal substrate
EP2587910A4 (en) Electronic component
KR101881861B1 (ko) 도전 패턴 구조물 및 이의 형성 방법
EP2587909A4 (en) Electronic component
EP2639883A4 (en) Conductive member and method for producing same