YU71000A - Postupak za oblaganje podloga sa metalima - Google Patents
Postupak za oblaganje podloga sa metalimaInfo
- Publication number
- YU71000A YU71000A YU71000A YU71000A YU71000A YU 71000 A YU71000 A YU 71000A YU 71000 A YU71000 A YU 71000A YU 71000 A YU71000 A YU 71000A YU 71000 A YU71000 A YU 71000A
- Authority
- YU
- Yugoslavia
- Prior art keywords
- electrically conductive
- metalization
- conductive polymer
- substrates
- metal coating
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2013—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by mechanical pretreatment, e.g. grinding, sanding
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/26—Roughening, e.g. by etching using organic liquids
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Chemical Treatment Of Metals (AREA)
Abstract
Postupak za oblaganje podloga sa metalima koje imaju polimerne površine u proizvodnji ploča štampanih kola, naročito u proizvodnji ploča štampanih kola koje imaju mikroskopske otvore i fine konture nanošenjem elektroprovodljivog polimernog sloja i zatim metalizovanjem, gde se elektroprovodljiv polimerni sloj prvenstveno pre stupanja metalizovanja meša sa rastvorom koloidnog paladijuma koji sadrži cink, elektroprovodljiv polimer je poli-3,4-etilen-dioksitiofen i pre metalizacije izvodi se dovodjenje u dodir sa rastvorom bakar(II) soli.[The invention relates to a method for metal coating of substrates with polymer surfaces in the production of printed boards, more particularly, printed boards with micro-orifices and fine structures, by applying an electrically conductive polymer layer and subsequently conducting metalization. The electrically conductive polymer layer is doped with a colloidal palladium solution containing tin before the metalization step is carried out, whereby the electrically conductive polymer is poly-3,4-ethylene-dioxythiophene and is brought into contact with a copper(II) salt solution before metalization.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19822075A DE19822075C2 (de) | 1998-05-16 | 1998-05-16 | Verfahren zur metallischen Beschichtung von Substraten |
Publications (1)
Publication Number | Publication Date |
---|---|
YU71000A true YU71000A (sh) | 2003-02-28 |
Family
ID=7868037
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
YU71000A YU71000A (sh) | 1998-05-16 | 1999-05-14 | Postupak za oblaganje podloga sa metalima |
Country Status (22)
Country | Link |
---|---|
US (1) | US6589593B1 (sh) |
EP (1) | EP1088121B1 (sh) |
JP (1) | JP4044286B2 (sh) |
KR (1) | KR100541893B1 (sh) |
CN (1) | CN1299548C (sh) |
AT (1) | ATE213510T1 (sh) |
AU (1) | AU4261899A (sh) |
CA (1) | CA2331757A1 (sh) |
DE (2) | DE19822075C2 (sh) |
HK (1) | HK1035385A1 (sh) |
HU (1) | HUP0102325A3 (sh) |
IL (1) | IL139422A (sh) |
IS (1) | IS5704A (sh) |
NO (1) | NO20005778L (sh) |
PL (1) | PL345093A1 (sh) |
RO (1) | RO119837B1 (sh) |
RU (1) | RU2214075C2 (sh) |
SK (1) | SK16922000A3 (sh) |
TR (1) | TR200003369T2 (sh) |
WO (1) | WO1999060189A2 (sh) |
YU (1) | YU71000A (sh) |
ZA (1) | ZA200006623B (sh) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10007435A1 (de) * | 2000-02-18 | 2001-08-23 | Enthone Omi Deutschland Gmbh | Verfahren zum Galvanisieren eines mit einem elektrisch leitenden Polymer beschichteten Werkstücks |
DE50008242D1 (de) * | 2000-09-26 | 2004-11-18 | Enthone Omi Deutschland Gmbh | Verfahren zur selektiven Metallisierung dielektrischer Materialien |
DK1332238T3 (da) | 2000-10-09 | 2009-07-20 | Hueck Folien Gmbh | Metalliseret film, fremgangsmåde til fremstilling heraf samt anvendelse heraf |
KR20020079075A (ko) * | 2001-04-13 | 2002-10-19 | 이진규 | 폴리메틸실세스퀴옥산 공중합체와 이를 이용한 저유전성절연막 및 그 제조방법 |
US20060009029A1 (en) * | 2004-07-06 | 2006-01-12 | Agency For Science, Technology And Research | Wafer level through-hole plugging using mechanical forming technique |
DE102004042111A1 (de) * | 2004-08-30 | 2006-03-09 | Ovd Kinegram Ag | Mehrschichtiger Körper mit unterschiedlich mikrostrukturierten Bereichen mit elektrisch leitfähiger Beschichtung |
US20070237977A1 (en) * | 2006-04-07 | 2007-10-11 | United States Of America As Represented By The Administrator Of The National Aeronautics And Spac | Thin Metal Film System To Include Flexible Substrate And Method Of Making Same |
EP1870491B1 (de) * | 2006-06-22 | 2015-05-27 | Enthone, Inc. | Verbessertes Verfahren zur Direktmetallisierung von elektrisch nicht leitfähigen Substratoberflächen, insbesondere Polyimidoberflächen |
US7649439B2 (en) * | 2006-08-18 | 2010-01-19 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Flexible thin metal film thermal sensing system |
US8198976B2 (en) * | 2006-08-18 | 2012-06-12 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Flexible thin metal film thermal sensing system |
US8366901B2 (en) * | 2006-09-07 | 2013-02-05 | Enthone Inc. | Deposition of conductive polymer and metallization of non-conductive substrates |
FR2934609B1 (fr) * | 2008-07-30 | 2011-07-22 | Jet Metal Technologies | Procede non eletrolytique de metallisation en ligne de substrats par projection avec traitement de surface prealable et dispositif pour la mise en oeuvre du procede. |
JP5491022B2 (ja) * | 2008-12-10 | 2014-05-14 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法、基板処理装置の制御方法および基板処理装置の表示方法 |
WO2012023992A1 (en) | 2010-08-20 | 2012-02-23 | Rhodia Operations | Films containing electrically conductive polymers |
ES2662039T3 (es) * | 2010-10-29 | 2018-04-05 | Macdermid Enthone Inc. | Composición y método para la deposición de polímeros conductores en sustratos dieléctricos |
CN104349585B (zh) * | 2013-08-01 | 2018-05-15 | 宏启胜精密电子(秦皇岛)有限公司 | 电路板及其制作方法 |
US10920321B2 (en) | 2014-05-30 | 2021-02-16 | Uab Rekin International | Chrome-free adhesion pre-treatment for plastics |
CN105887054B (zh) * | 2016-06-13 | 2019-01-18 | 华南理工大学 | 一种高导电生物质/纳米金属柔性复合膜及其制备方法 |
CN110029382B (zh) * | 2019-05-22 | 2021-09-24 | 电子科技大学 | 一种用于直接电镀的表面处理工艺及其相关直接电镀工艺 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4847114A (en) * | 1984-01-26 | 1989-07-11 | Learonal, Inc. | Preparation of printed circuit boards by selective metallization |
DE3806884C1 (en) * | 1988-03-03 | 1989-09-21 | Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De | Through-plated contact printed circuit and method for fabricating it |
US5183692A (en) * | 1991-07-01 | 1993-02-02 | Motorola, Inc. | Polyimide coating having electroless metal plate |
US5268088A (en) * | 1991-12-12 | 1993-12-07 | Eric F. Harnden | Simplified method for direct electroplating of acrylic or epoxy containing dielectric substrates |
DE4202337A1 (de) * | 1992-01-29 | 1993-08-05 | Bayer Ag | Verfahren zur durchkontaktierung von zweilagigen leiterplatten und multilayern |
US5427841A (en) * | 1993-03-09 | 1995-06-27 | U.S. Philips Corporation | Laminated structure of a metal layer on a conductive polymer layer and method of manufacturing such a structure |
DE4326079A1 (de) * | 1993-07-30 | 1995-02-02 | Atotech Deutschland Gmbh | Verfahren zur Behandlung von Kunststoffoberflächen und Anquell-Lösung |
DE19502988B4 (de) * | 1995-01-31 | 2004-03-18 | Blasberg Oberflächentechnik GmbH | Verfahren zur galvanischen Beschichtung von Polymeroberflächen |
WO1999019883A1 (en) * | 1997-10-15 | 1999-04-22 | The Dow Chemical Company | Electronically-conductive polymers |
-
1998
- 1998-05-16 DE DE19822075A patent/DE19822075C2/de not_active Expired - Fee Related
-
1999
- 1999-05-14 RO ROA200001122A patent/RO119837B1/ro unknown
- 1999-05-14 HU HU0102325A patent/HUP0102325A3/hu unknown
- 1999-05-14 US US09/674,510 patent/US6589593B1/en not_active Expired - Fee Related
- 1999-05-14 AT AT99952103T patent/ATE213510T1/de not_active IP Right Cessation
- 1999-05-14 JP JP2000549789A patent/JP4044286B2/ja not_active Expired - Lifetime
- 1999-05-14 TR TR2000/03369T patent/TR200003369T2/xx unknown
- 1999-05-14 AU AU42618/99A patent/AU4261899A/en not_active Abandoned
- 1999-05-14 EP EP99952103A patent/EP1088121B1/de not_active Expired - Lifetime
- 1999-05-14 PL PL99345093A patent/PL345093A1/xx unknown
- 1999-05-14 KR KR1020007012740A patent/KR100541893B1/ko not_active IP Right Cessation
- 1999-05-14 WO PCT/EP1999/003322 patent/WO1999060189A2/de active IP Right Grant
- 1999-05-14 DE DE59900882T patent/DE59900882D1/de not_active Expired - Lifetime
- 1999-05-14 CN CNB998086835A patent/CN1299548C/zh not_active Expired - Lifetime
- 1999-05-14 SK SK1692-2000A patent/SK16922000A3/sk unknown
- 1999-05-14 IL IL13942299A patent/IL139422A/en not_active IP Right Cessation
- 1999-05-14 YU YU71000A patent/YU71000A/sh unknown
- 1999-05-14 CA CA002331757A patent/CA2331757A1/en not_active Abandoned
- 1999-05-14 RU RU2000131601/09A patent/RU2214075C2/ru not_active IP Right Cessation
-
2000
- 2000-11-02 IS IS5704A patent/IS5704A/is unknown
- 2000-11-15 NO NO20005778A patent/NO20005778L/no not_active Application Discontinuation
- 2000-11-15 ZA ZA200006623A patent/ZA200006623B/xx unknown
-
2001
- 2001-08-28 HK HK01106071A patent/HK1035385A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO1999060189A2 (de) | 1999-11-25 |
SK16922000A3 (sk) | 2001-07-10 |
EP1088121A2 (de) | 2001-04-04 |
TR200003369T2 (tr) | 2001-07-23 |
KR20010025021A (ko) | 2001-03-26 |
KR100541893B1 (ko) | 2006-01-10 |
DE19822075C2 (de) | 2002-03-21 |
IL139422A0 (en) | 2001-11-25 |
RO119837B1 (ro) | 2005-04-29 |
IS5704A (is) | 2000-11-02 |
JP4044286B2 (ja) | 2008-02-06 |
HK1035385A1 (en) | 2001-11-23 |
CN1309881A (zh) | 2001-08-22 |
JP2002515657A (ja) | 2002-05-28 |
CN1299548C (zh) | 2007-02-07 |
IL139422A (en) | 2004-01-04 |
DE19822075A1 (de) | 1999-11-18 |
WO1999060189A3 (de) | 2000-04-06 |
NO20005778D0 (no) | 2000-11-15 |
CA2331757A1 (en) | 1999-11-25 |
ZA200006623B (en) | 2001-05-30 |
DE59900882D1 (de) | 2002-03-28 |
HUP0102325A2 (hu) | 2001-10-28 |
HUP0102325A3 (en) | 2002-02-28 |
RU2214075C2 (ru) | 2003-10-10 |
US6589593B1 (en) | 2003-07-08 |
NO20005778L (no) | 2000-11-27 |
ATE213510T1 (de) | 2002-03-15 |
EP1088121B1 (de) | 2002-02-20 |
PL345093A1 (en) | 2001-12-03 |
AU4261899A (en) | 1999-12-06 |
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