AU2502401A - Method for production of a conductor cross-over on a data support card - Google Patents
Method for production of a conductor cross-over on a data support cardInfo
- Publication number
- AU2502401A AU2502401A AU25024/01A AU2502401A AU2502401A AU 2502401 A AU2502401 A AU 2502401A AU 25024/01 A AU25024/01 A AU 25024/01A AU 2502401 A AU2502401 A AU 2502401A AU 2502401 A AU2502401 A AU 2502401A
- Authority
- AU
- Australia
- Prior art keywords
- conductor
- card body
- production
- connector points
- over
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Networks & Wireless Communication (AREA)
- Credit Cards Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Multi-Process Working Machines And Systems (AREA)
- Programmable Controllers (AREA)
Abstract
The invention relates to a method for the production of a data support card, comprising a card body, and at least one conductor, arranged in the card body, with at least one conductor cross-over and conductor connectors, characterised by the following method steps: After production of a plastic card body blank (1), the conductor (3), with conductor connection surfaces (4), is applied to at least one flat side of the plastic card body blank (1), whereby the conductor (3) has connector points (6a, 6b) for a conductor bridge (9), in the vicinity of the conductor cross-over point (5); then an insulating coating material (7) is applied to the remaining surface of the flat side of the plastic card body blank, which is not already covered by the conductor (3), in such a way that the thickness of the insulating coating material is fractionally less than the thickness of the conductor (3). In the next step of the method an insulating coating material (8) is applied, in the vicinity of the conductor crossover point (5), between the connector points (6a, 6b) for the conductor bridge (8), then the conductor bridge (9) is applied, in the form of a conducting coating between the connector points (6a, 6b), whereby the connector points (6a, 6b) are conductively connected to each other and, finally, a protective layer (10), made from an insulating material, is applied to the flat side of the plastic card body blank, which carries the conductor (3), the connector surfaces (4) and the connector points (6a, 6b), whereby the conductor connectors remain exposed. The disclosed method permits the particularly cheap production of chip cards.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19956436 | 1999-11-24 | ||
DE19956436A DE19956436A1 (en) | 1999-11-24 | 1999-11-24 | Process for the production of a data carrier card |
PCT/DE2000/003991 WO2001039114A1 (en) | 1999-11-24 | 2000-11-16 | Method for production of a conductor cross-over on a data support card |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2502401A true AU2502401A (en) | 2001-06-04 |
Family
ID=7930117
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU25024/01A Abandoned AU2502401A (en) | 1999-11-24 | 2000-11-16 | Method for production of a conductor cross-over on a data support card |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1410320B1 (en) |
AT (1) | ATE300771T1 (en) |
AU (1) | AU2502401A (en) |
DE (2) | DE19956436A1 (en) |
WO (1) | WO2001039114A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100373405C (en) * | 2003-02-19 | 2008-03-05 | 中兴通讯股份有限公司 | A network card packaging arrangement and packaging method thereof |
EP1657666A1 (en) * | 2004-11-10 | 2006-05-17 | Shinichi Umeda | IC tag and method for manufacturing the IC tag |
US8408473B2 (en) | 2008-11-03 | 2013-04-02 | Smartrac Technology Dresden Gmbh | Method for producing an RFID transponder product, and RFID transponder product produced using the method |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3013667C2 (en) * | 1980-04-09 | 1983-01-20 | Wilhelm Ruf KG, 8000 München | Printed circuit board and process for their manufacture |
JPH01154669U (en) * | 1988-04-14 | 1989-10-24 | ||
DE19512272C2 (en) * | 1995-04-01 | 2000-05-11 | Loewe Opta Gmbh | Method for producing a multilayer printed circuit board for a chassis of a consumer electronic device and printed circuit board produced according to this method |
-
1999
- 1999-11-24 DE DE19956436A patent/DE19956436A1/en not_active Withdrawn
-
2000
- 2000-11-16 AT AT00988596T patent/ATE300771T1/en not_active IP Right Cessation
- 2000-11-16 WO PCT/DE2000/003991 patent/WO2001039114A1/en active IP Right Grant
- 2000-11-16 AU AU25024/01A patent/AU2502401A/en not_active Abandoned
- 2000-11-16 EP EP00988596A patent/EP1410320B1/en not_active Expired - Lifetime
- 2000-11-16 DE DE50010853T patent/DE50010853D1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
ATE300771T1 (en) | 2005-08-15 |
DE50010853D1 (en) | 2005-09-01 |
EP1410320B1 (en) | 2005-07-27 |
DE19956436A1 (en) | 2001-06-07 |
EP1410320A1 (en) | 2004-04-21 |
WO2001039114A1 (en) | 2001-05-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |