CN100373405C - A network card packaging arrangement and packaging method thereof - Google Patents
A network card packaging arrangement and packaging method thereof Download PDFInfo
- Publication number
- CN100373405C CN100373405C CNB031155057A CN03115505A CN100373405C CN 100373405 C CN100373405 C CN 100373405C CN B031155057 A CNB031155057 A CN B031155057A CN 03115505 A CN03115505 A CN 03115505A CN 100373405 C CN100373405 C CN 100373405C
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- circuit board
- printed circuit
- board assembly
- network interface
- interface card
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Abstract
The present invention discloses a network card sealing structure device and a sealing method thereof. The device comprises a printed circuit board assembly, an insulating paint protecting layer, a conductive paint shielding layer and a plastic sealing casing, wherein the insulating paint protecting layer is sprayed on the printed circuit board assembly in a corresponding region requiring the insulating protection to insulate; the conductive paint shielding layer is sprayed on the printed circuit board assembly to realize the electromagnetic shielding of relevant circuit parts on the printed circuit board assembly. The device can be matched with insulating paint among different regions according to requirements to be used for spraying to realize the electromagnetic shielding of different regions on the printed circuit board assembly. The plastic sealing casing is made from plastic materials in an encapsulation and injection molding way by a plastic sealing die under the condition of normal temperature. The present invention can be applied to the sealing technology of a communication network card.
Description
Technical field:
The invention belongs to communication field, relate in particular to the encapsulating structure and the encapsulation technology of network interface card.
Background technology:
Along with the develop rapidly of mechanics of communication in modern age, wireless communication technique has also obtained significant progress.A kind of new wireless data communication technology that WLAN (wireless local area network) is got up as new development is also progressively full-fledged.Wireless network card is as indispensable parts in the wireless local area network (WLAN) system, and his application and development prospect and market are also good day by day.Most network interface cards on the market are that reference design is made with PCMCIA 2.0 editions all at present, mainly are wired network adapters, the wireless network card that also has the design of a small amount of external producer to produce.This class network interface card generally is made up of following components: on, following metalwork shell, plastic stent, label up and down, dielectric film, internal shield box, circuit board assemblies, PCMCIA connector etc.According to the requirement of PCMCIA2.0 standard, the maximum ga(u)ge of network interface card is 5mm, and breadth extreme is 54mm., targeting part thickness 3.3mm..Network interface card requires shell to remove to possess enough physical strengths from design, and hardware components is played protection, supports and help also must have capability of electromagnetic shielding outside network interface card realizes plugging accurately.Outer cover metal spare is generally selected the impact briquetting of corrosion resistant plate timber die for use.
Because the physical dimension of network interface card fixes substantially and can not change, inside dimension is very compact, requires very high to part precision.Therefore, very high to the accuracy requirement of structural member and mould thereof, the exploitation manufacture difficulty and the cost of mould are very high, and the yield rate of part is lower.
Summary of the invention:
Tight for solving wireless network card bulk, and need the multilayer electromagnetic screen, mould is made problems such as difficulty.The present invention proposes a kind of network interface card encapsulating structure device and method for packing thereof, solved the problems referred to above effectively.
A kind of network interface card encapsulating structure device comprises: printed circuit board assembly, insullac protective seam, conductive paint screen layer and plastic packaging shell.
Described printed circuit board assembly is the circuit part of network interface card, also is most crucial part;
Described insullac protective seam is sprayed on the respective regions that needs insulation protection on the printed circuit board assembly, plays insulating effect;
Described conductive paint screen layer is sprayed on the respective regions that has sprayed the insullac protective seam; realization is carried out electromagnetic screen to circuit part relevant on the printed circuit board assembly; can between zones of different, be used as required with insullac; spray, to realize electromagnetic screen zones of different on the printed circuit board assembly.
Described plastic packaging shell is by plastic package die at normal temperatures, uses embedding plastic material injection mo(u)lding.
Realize the method for packing of above-mentioned network interface card encapsulating structure device, described network interface card encapsulating structure device comprises: printed circuit board assembly, encapsulating die, embedding plastic material, conductive paint, insullac, and encapsulation step is as follows:
1. be ready to printed circuit board assembly;
2. earlier the part that does not need on the printed circuit board assembly to shield is protected with covering method, then to the zone spray insullac that will shield protecting this zone, so that do not cause the short circuit of this part, oven dry then during the spray conductive paint;
3. the part that does not need on the printed circuit board assembly to shield is protected with covering method, then the zone spray conductive paint that will shield is formed one deck conducting film, to realize to this regional function of shielding oven dry then;
4. clear up the protective seam that the above-mentioned part that does not need to shield is protected with covering method, the shielding properties of conductive shield lacquer and the insulating property of insullac are tested, change next procedure over to after qualified;
5. printed circuit board assembly is put into encapsulating die, carry out the location;
6. matched moulds, embedding;
7. after the die sinking, cleaning network interface card surface promptly gets described network interface card.
After described encapsulation work is finished, network interface card encapsulated moulding, trade mark, label directly silk-screen to the outside surface of network interface card.
This invents described this network interface card encapsulating structure device compared with prior art, significantly reduces with constitutional detail quantity such as precision die processing shells, without the metallic shield box, comprises inner screening box and external shield box, without dielectric film, and label etc. up and down.Only need do a cover plastic package die, the simple accuracy requirement of mould structure is low, and cost is low.Wholely behind the plastic packaging block into as a wholely, physical strength is good, can not be out of shape appearance looks elegant.
By realizing insulation and electromagnetic screen at circuit unit outside surface spray insullac and conductive paint, saved the very high metallic shield box of accuracy requirement, saved manufacturing cost, shortened mold developing cycle greatly.Directly silk-screen is to the outside surface of card for trade mark, label, and network interface card stamps different patterns after also can making various appearance colour, to improve the appreciative value of card.
The present invention the prior art of network interface card by four/three cover extrustion of metals moulds, the designs simplification that two cover injection molds just can be finished can be finished once overlapping simple plastic package die to only needing.Without outer cover metal spare, without the metallic shield box, without dielectric film, label up and down, parts such as plastic stent.Simplify the structure of network interface card greatly, greatly reduced R﹠D cycle, R﹠D costs and manufacturing cost.
Description of drawings
Network interface card circuit board assemblies before Fig. 1 plastic packaging
Fig. 2 is the outside drawing of network interface card behind the plastic packaging
Embodiment
Be described in further detail implementing the present invention below in conjunction with accompanying drawing.
Network interface card encapsulating structure device disclosed by the invention has solved the manufacturing of wireless network card shell, assemble and satisfy shell to the electromagnetic screen of hardware system, machinery support, the problem of protection aspect.
Be network interface card circuit board assemblies figure before the plastic packaging as shown in Figure 1.
Network interface card encapsulating structure device disclosed by the invention comprises with the lower part:
Printed circuit board assembly is the core of network interface card, and this structure Design purpose is exactly the support of satisfying printed circuit board assembly, and protection is satisfied it the electromagnetic screen of circuit part is required and network interface card positioning and guiding effect in use.
The insullac protective seam; be that the electromagnetic screen of circuit part requires and be sprayed on the circuit respective regions to play insulating effect on the printed circuit board assembly in order to satisfy; realize the circuit relevant portion is carried out electromagnetic screen so that spray conductive paint again, can spray arbitrarily in zones of different as required.
The effect of conductive paint screen layer is the electromagnetic screen of realizing the circuit relevant portion, can be used in zones of different and insullac as required, and spraying arbitrarily is to realize the shielding to the circuit zones of different.
The plastic packaging shell is the main body of this structure; realization is to the support and the protection of printed circuit board assembly; finish network interface card positioning and guiding effect in use; provide enough physical strength and profiles attractive in appearance for network interface card simultaneously; can be by plastic package die injection mo(u)lding at normal temperatures; also can make different colours and shape as required, to meet the different needs.
In addition, print pictorial trademark and label respectively, also the pros and cons that the trade mark that prints or label directly can be attached to card at the pros and cons of card.The surface of card can be sprayed into different colors or stamp different patterns in the hope of receiving the effect of better appearance according to different demands.
Realize the method for packing of above-mentioned network interface card encapsulating structure device, comprising: printed circuit board assembly, encapsulating die, embedding plastic material, conductive paint, insullac, encapsulation step is as follows:
1. be ready to circuit board assemblies;
2. to the part that will shield on printed circuit board assembly spray insullac, oven dry (part that will not need to shield is protected with covering method earlier, then to the zone spray insullac that will shield protecting this zone, so that do not cause short circuit during the spray conductive paint);
3. the part spray conductive paint to shielding on the printed circuit board assembly is dried (part that will not need to shield is protected with covering method earlier, then the zone spray insullac that will shield is formed one deck conducting film, to realize this regional function of shielding);
4. printed circuit board assembly is put into encapsulating die, carry out the location;
5. matched moulds, embedding;
6. after the die sinking, cleaning network interface card surface promptly gets described network interface card;
7. silk-screen trade mark label or spray paint.
Be the outside drawing of network interface card behind the plastic packaging as shown in Figure 2
Adopt above-mentioned plastic cement normal temperature plastic packaging method, solved under the conventional structure form, problem such as mould and die accuracy height, manufacture difficulty are big, the member kind is many, physical dimension is strict, manufacturing cost is high, the manufacturing cycle is long.
Adopt network interface card encapsulating structure device provided by the invention and method for packing thereof, compared with prior art, simplified network interface card Structure, reached and saved research and development, manufacturing cost, saved R﹠D cycle and R﹠D fund, beautified product appearance, Improved product competitiveness.
Claims (4)
1. a network interface card encapsulating structure device comprises: printed circuit board assembly, insullac protective seam, conductive paint screen layer and plastic packaging shell is characterized in that
Described printed circuit board assembly is the circuit part of network interface card;
Described insullac protective seam is sprayed on the respective regions that needs insulation protection on the printed circuit board assembly, plays insulating effect;
Described conductive paint screen layer is sprayed on the respective regions that has sprayed the insullac protective seam, realizes circuit part relevant on the printed circuit board assembly is carried out electromagnetic screen;
Described plastic packaging shell is by plastic package die injection mo(u)lding at normal temperatures.
2. network interface card encapsulating structure device as claimed in claim 1 is characterized in that, can use plastic material during the embedding injection moulding.
3. realize the method for packing of claim 1 or 2 described network interface card encapsulating structure devices, described network interface card encapsulating structure device comprises: printed circuit board assembly, encapsulating die, embedding plastic material, conductive paint, insullac is characterized in that encapsulation step is as follows:
1. be ready to printed circuit board assembly;
2. earlier the part that does not need on the printed circuit board assembly to shield is protected with covering method, then to the zone spray insullac that will shield protecting this zone, so that do not cause the short circuit of this part, oven dry then during the spray conductive paint;
3. the part that does not need on the printed circuit board assembly to shield is protected with covering method, then the zone spray conductive paint that will shield is formed one deck conducting film, to realize to this regional function of shielding oven dry then;
4. clear up the protective seam that the above-mentioned part that does not need to shield is protected with covering method, the shielding properties of conductive shield lacquer and the insulating property of insullac are tested, change next procedure over to after qualified;
5. printed circuit board assembly is put into encapsulating die, carry out the location;
6. matched moulds, embedding;
7. after the die sinking, cleaning network interface card surface promptly gets described network interface card.
4. method for packing as claimed in claim 3 is characterized in that: after described encapsulation work is finished, trade mark, label directly silk-screen to the outside surface of network interface card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031155057A CN100373405C (en) | 2003-02-19 | 2003-02-19 | A network card packaging arrangement and packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031155057A CN100373405C (en) | 2003-02-19 | 2003-02-19 | A network card packaging arrangement and packaging method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1523535A CN1523535A (en) | 2004-08-25 |
| CN100373405C true CN100373405C (en) | 2008-03-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031155057A Expired - Lifetime CN100373405C (en) | 2003-02-19 | 2003-02-19 | A network card packaging arrangement and packaging method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100373405C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101493902B (en) * | 2009-03-06 | 2012-04-25 | 北京海升天达科技有限公司 | Method for manufacturing card |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1198782A (en) * | 1996-04-17 | 1998-11-11 | 阿托特德国有限公司 | Process for manufacturing inductive counting systems |
| DE19956436A1 (en) * | 1999-11-24 | 2001-06-07 | Orga Kartensysteme Gmbh | Process for the production of a data carrier card |
| CN1386198A (en) * | 2000-07-28 | 2002-12-18 | 梅塞特罗尼克公司 | Method for making a card with multiple contact tips for testing microsphere integrated circuits, and testing device using said card |
-
2003
- 2003-02-19 CN CNB031155057A patent/CN100373405C/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1198782A (en) * | 1996-04-17 | 1998-11-11 | 阿托特德国有限公司 | Process for manufacturing inductive counting systems |
| DE19956436A1 (en) * | 1999-11-24 | 2001-06-07 | Orga Kartensysteme Gmbh | Process for the production of a data carrier card |
| CN1386198A (en) * | 2000-07-28 | 2002-12-18 | 梅塞特罗尼克公司 | Method for making a card with multiple contact tips for testing microsphere integrated circuits, and testing device using said card |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1523535A (en) | 2004-08-25 |
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Granted publication date: 20080305 |