KR970010107B1 - Surface treating method of electrolytic coating using pb/sn alloy in pcb substrate - Google Patents

Surface treating method of electrolytic coating using pb/sn alloy in pcb substrate Download PDF

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Publication number
KR970010107B1
KR970010107B1 KR94009321A KR19940009321A KR970010107B1 KR 970010107 B1 KR970010107 B1 KR 970010107B1 KR 94009321 A KR94009321 A KR 94009321A KR 19940009321 A KR19940009321 A KR 19940009321A KR 970010107 B1 KR970010107 B1 KR 970010107B1
Authority
KR
South Korea
Prior art keywords
layer
coated
alloy
surface treating
pcb substrate
Prior art date
Application number
KR94009321A
Other languages
Korean (ko)
Other versions
KR950030748A (en
Inventor
Jin-Soo Kwon
Oh-Hee Lee
Original Assignee
Lg Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Electronics Inc filed Critical Lg Electronics Inc
Priority to KR94009321A priority Critical patent/KR970010107B1/en
Publication of KR950030748A publication Critical patent/KR950030748A/en
Application granted granted Critical
Publication of KR970010107B1 publication Critical patent/KR970010107B1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The multi-layer electrolysis coated surface finishing of PCB(Printed Circuit Board) substrate is performed as the following steps. (a) After forming the copper wiring on the copper coated insulating plate where only the necessary portion is left out, coat the copper wiring with the first coated layer which is the high thermal endurance polished lead/tin alloy electrolysis coating layer with the thickness of about 5 to 15 micron. After that, (b) coat the first coated layer with the high solderable polished lead/tin alloy coating layer with the thickness of about 1 to 5 micron.
KR94009321A 1994-04-29 1994-04-29 Surface treating method of electrolytic coating using pb/sn alloy in pcb substrate KR970010107B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR94009321A KR970010107B1 (en) 1994-04-29 1994-04-29 Surface treating method of electrolytic coating using pb/sn alloy in pcb substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR94009321A KR970010107B1 (en) 1994-04-29 1994-04-29 Surface treating method of electrolytic coating using pb/sn alloy in pcb substrate

Publications (2)

Publication Number Publication Date
KR950030748A KR950030748A (en) 1995-11-24
KR970010107B1 true KR970010107B1 (en) 1997-06-21

Family

ID=19382126

Family Applications (1)

Application Number Title Priority Date Filing Date
KR94009321A KR970010107B1 (en) 1994-04-29 1994-04-29 Surface treating method of electrolytic coating using pb/sn alloy in pcb substrate

Country Status (1)

Country Link
KR (1) KR970010107B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220092791A (en) 2020-12-24 2022-07-04 한국전자기술연구원 System and method for automating PCB surface treatment

Also Published As

Publication number Publication date
KR950030748A (en) 1995-11-24

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