JPS6419794A - Method of soldering electronic component - Google Patents

Method of soldering electronic component

Info

Publication number
JPS6419794A
JPS6419794A JP17497687A JP17497687A JPS6419794A JP S6419794 A JPS6419794 A JP S6419794A JP 17497687 A JP17497687 A JP 17497687A JP 17497687 A JP17497687 A JP 17497687A JP S6419794 A JPS6419794 A JP S6419794A
Authority
JP
Japan
Prior art keywords
lead
tin
section
rosinate
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17497687A
Other languages
Japanese (ja)
Inventor
Kenzo Kobayashi
Takao Fukunaga
Hisao Nakajima
Masanao Kono
Hisao Irie
Makoto Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Harima Chemical Inc
Original Assignee
Furukawa Electric Co Ltd
Harima Chemical Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd, Harima Chemical Inc filed Critical Furukawa Electric Co Ltd
Priority to JP17497687A priority Critical patent/JPS6419794A/en
Publication of JPS6419794A publication Critical patent/JPS6419794A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To perform a soldering at a low temperature so as to prevent an electronic component from being damaged to heat and plastic coating after soldering for prevention of the erosion of the part, by a method wherein a contact part of a pad section with a lead section is dipped into a heated solution which consists of a solvent which dissolves lead rosinate or tin lead rosinate in it. CONSTITUTION:An electronic component is mounted on a printed substrate 11 and a pad section 13 is made to be in contact with a lead section 14. A contacting part is dipped into a heated lead rosinate solution 18. Tin plating 19 is performed on the surface of the pad section 13 and a copper-tin alloy layer 20 is formed on the interface. Such the contacting section is dipped into a lead rosinate solution 18, where tin of the tin plated face 19 is replaced with lead which separates out at the face and tin diffuses into lead separated out for the formation of solder. The copper-tin alloy layer 20 of the pad section 13 is made to be exposed at the part around a solidified solder 21, where tin plating vanishes. A plastic coating 23 is performed on the surface so as to prevent erosion from taking place at the exposed part.
JP17497687A 1987-07-15 1987-07-15 Method of soldering electronic component Pending JPS6419794A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17497687A JPS6419794A (en) 1987-07-15 1987-07-15 Method of soldering electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17497687A JPS6419794A (en) 1987-07-15 1987-07-15 Method of soldering electronic component

Publications (1)

Publication Number Publication Date
JPS6419794A true JPS6419794A (en) 1989-01-23

Family

ID=15988036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17497687A Pending JPS6419794A (en) 1987-07-15 1987-07-15 Method of soldering electronic component

Country Status (1)

Country Link
JP (1) JPS6419794A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2171753A1 (en) * 2007-06-28 2010-04-07 Agere Systems Inc. Inhibition of copper dissolution for lead-free soldering
DE102017200782B4 (en) 2016-03-29 2021-11-11 Mitsubishi Electric Corporation Power reuse field effect transistor amplifier

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2171753A1 (en) * 2007-06-28 2010-04-07 Agere Systems Inc. Inhibition of copper dissolution for lead-free soldering
EP2171753A4 (en) * 2007-06-28 2010-09-08 Agere Systems Inc Inhibition of copper dissolution for lead-free soldering
DE102017200782B4 (en) 2016-03-29 2021-11-11 Mitsubishi Electric Corporation Power reuse field effect transistor amplifier

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