JPS55122666A - Solder fusion-connecting method - Google Patents

Solder fusion-connecting method

Info

Publication number
JPS55122666A
JPS55122666A JP3002079A JP3002079A JPS55122666A JP S55122666 A JPS55122666 A JP S55122666A JP 3002079 A JP3002079 A JP 3002079A JP 3002079 A JP3002079 A JP 3002079A JP S55122666 A JPS55122666 A JP S55122666A
Authority
JP
Japan
Prior art keywords
circuit element
connecting portions
wiring substrate
solder alloy
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3002079A
Other languages
Japanese (ja)
Inventor
Masaaki Kusano
Shinji Okuhara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3002079A priority Critical patent/JPS55122666A/en
Publication of JPS55122666A publication Critical patent/JPS55122666A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To achieve the elimination of need for pre-soldering work on a wiring substrate by aligning the solder alloy electrodes of a circuit element on the specific metal layer provided on the wiring conductor surface of the wiring substrate and heating the same to fuse.
CONSTITUTION: In the case of fusion-connecting the solder alloy electrodes 2 of a circuit element 1 to the wiring conductors 4 of a wiring substrate 3, hitherto the connecting portions 5 of the conductors segmented by an insulation layer 6 are coated thereon with flux and are then dipped in a solder tank, by which they are subjected pre-soldering, but since the connecting portions are fine, the wetting of the alloy is poor. Thereupon, the plating layer composed of the metal of the single composition which is well wetted by alloys of gole, copper, tin, etc. is beforehand formed on the connecting portions and the solder alloy electrodes are contacted onto this plating layer, thence they are directly heated to fuse, whereby the circuit element may be connected readily and surely.
COPYRIGHT: (C)1980,JPO&Japio
JP3002079A 1979-03-16 1979-03-16 Solder fusion-connecting method Pending JPS55122666A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3002079A JPS55122666A (en) 1979-03-16 1979-03-16 Solder fusion-connecting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3002079A JPS55122666A (en) 1979-03-16 1979-03-16 Solder fusion-connecting method

Publications (1)

Publication Number Publication Date
JPS55122666A true JPS55122666A (en) 1980-09-20

Family

ID=12292149

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3002079A Pending JPS55122666A (en) 1979-03-16 1979-03-16 Solder fusion-connecting method

Country Status (1)

Country Link
JP (1) JPS55122666A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6318695A (en) * 1986-07-11 1988-01-26 株式会社日立製作所 Wiring board
JPS63107087A (en) * 1986-05-19 1988-05-12 株式会社デンソー Hybrid integrated circuit board
US5829665A (en) * 1992-12-09 1998-11-03 Nippondenso Co., Ltd. Fluxless soldering process
KR100906710B1 (en) 2008-01-24 2009-07-07 대덕전자 주식회사 Copper pad for surface mount technology and processing method thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63107087A (en) * 1986-05-19 1988-05-12 株式会社デンソー Hybrid integrated circuit board
US5383093A (en) * 1986-05-19 1995-01-17 Nippondenso Co., Ltd. Hybrid integrated circuit apparatus
US5897724A (en) * 1986-05-19 1999-04-27 Nippondenso Co., Ltd. Method of producing a hybrid integrated circuit
JPS6318695A (en) * 1986-07-11 1988-01-26 株式会社日立製作所 Wiring board
US5829665A (en) * 1992-12-09 1998-11-03 Nippondenso Co., Ltd. Fluxless soldering process
KR100906710B1 (en) 2008-01-24 2009-07-07 대덕전자 주식회사 Copper pad for surface mount technology and processing method thereof

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