JPS55122666A - Solder fusion-connecting method - Google Patents
Solder fusion-connecting methodInfo
- Publication number
- JPS55122666A JPS55122666A JP3002079A JP3002079A JPS55122666A JP S55122666 A JPS55122666 A JP S55122666A JP 3002079 A JP3002079 A JP 3002079A JP 3002079 A JP3002079 A JP 3002079A JP S55122666 A JPS55122666 A JP S55122666A
- Authority
- JP
- Japan
- Prior art keywords
- circuit element
- connecting portions
- wiring substrate
- solder alloy
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE: To achieve the elimination of need for pre-soldering work on a wiring substrate by aligning the solder alloy electrodes of a circuit element on the specific metal layer provided on the wiring conductor surface of the wiring substrate and heating the same to fuse.
CONSTITUTION: In the case of fusion-connecting the solder alloy electrodes 2 of a circuit element 1 to the wiring conductors 4 of a wiring substrate 3, hitherto the connecting portions 5 of the conductors segmented by an insulation layer 6 are coated thereon with flux and are then dipped in a solder tank, by which they are subjected pre-soldering, but since the connecting portions are fine, the wetting of the alloy is poor. Thereupon, the plating layer composed of the metal of the single composition which is well wetted by alloys of gole, copper, tin, etc. is beforehand formed on the connecting portions and the solder alloy electrodes are contacted onto this plating layer, thence they are directly heated to fuse, whereby the circuit element may be connected readily and surely.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3002079A JPS55122666A (en) | 1979-03-16 | 1979-03-16 | Solder fusion-connecting method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3002079A JPS55122666A (en) | 1979-03-16 | 1979-03-16 | Solder fusion-connecting method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55122666A true JPS55122666A (en) | 1980-09-20 |
Family
ID=12292149
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3002079A Pending JPS55122666A (en) | 1979-03-16 | 1979-03-16 | Solder fusion-connecting method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55122666A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6318695A (en) * | 1986-07-11 | 1988-01-26 | 株式会社日立製作所 | Wiring board |
JPS63107087A (en) * | 1986-05-19 | 1988-05-12 | 株式会社デンソー | Hybrid integrated circuit board |
US5829665A (en) * | 1992-12-09 | 1998-11-03 | Nippondenso Co., Ltd. | Fluxless soldering process |
KR100906710B1 (en) | 2008-01-24 | 2009-07-07 | 대덕전자 주식회사 | Copper pad for surface mount technology and processing method thereof |
-
1979
- 1979-03-16 JP JP3002079A patent/JPS55122666A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63107087A (en) * | 1986-05-19 | 1988-05-12 | 株式会社デンソー | Hybrid integrated circuit board |
US5383093A (en) * | 1986-05-19 | 1995-01-17 | Nippondenso Co., Ltd. | Hybrid integrated circuit apparatus |
US5897724A (en) * | 1986-05-19 | 1999-04-27 | Nippondenso Co., Ltd. | Method of producing a hybrid integrated circuit |
JPS6318695A (en) * | 1986-07-11 | 1988-01-26 | 株式会社日立製作所 | Wiring board |
US5829665A (en) * | 1992-12-09 | 1998-11-03 | Nippondenso Co., Ltd. | Fluxless soldering process |
KR100906710B1 (en) | 2008-01-24 | 2009-07-07 | 대덕전자 주식회사 | Copper pad for surface mount technology and processing method thereof |
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