DK1332238T3 - Metalliseret film, fremgangsmåde til fremstilling heraf samt anvendelse heraf - Google Patents

Metalliseret film, fremgangsmåde til fremstilling heraf samt anvendelse heraf

Info

Publication number
DK1332238T3
DK1332238T3 DK01960161T DK01960161T DK1332238T3 DK 1332238 T3 DK1332238 T3 DK 1332238T3 DK 01960161 T DK01960161 T DK 01960161T DK 01960161 T DK01960161 T DK 01960161T DK 1332238 T3 DK1332238 T3 DK 1332238T3
Authority
DK
Denmark
Prior art keywords
metal
alloy
insulator
substrate
metal compound
Prior art date
Application number
DK01960161T
Other languages
English (en)
Inventor
Friedrich Kastner
Martin Bergsmann
Johann Hillburger
Roland Treutlein
Ronald Einsiedler
Original Assignee
Hueck Folien Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7947483&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DK1332238(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hueck Folien Gmbh filed Critical Hueck Folien Gmbh
Application granted granted Critical
Publication of DK1332238T3 publication Critical patent/DK1332238T3/da

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02Pretreatment of the material to be coated
    • C23C14/021Cleaning or etching treatments
    • C23C14/022Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42DBOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30Identification or security features, e.g. for preventing forgery
    • B42D25/36Identification or security features, e.g. for preventing forgery comprising special materials
    • B42D25/373Metallic materials
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • B42D2033/10
    • B42D2033/30
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42DBOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/20Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose
    • B42D25/29Securities; Bank notes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556Organic component
    • Y10T428/12569Synthetic resin
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal
DK01960161T 2000-10-09 2001-08-09 Metalliseret film, fremgangsmåde til fremstilling heraf samt anvendelse heraf DK1332238T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE20017392 2000-10-09
PCT/DE2001/003040 WO2002031214A1 (de) 2000-10-09 2001-08-09 Metallisierte folie und verfahren zu deren herstellung sowie deren anwendung

Publications (1)

Publication Number Publication Date
DK1332238T3 true DK1332238T3 (da) 2009-07-20

Family

ID=7947483

Family Applications (2)

Application Number Title Priority Date Filing Date
DK01960161T DK1332238T3 (da) 2000-10-09 2001-08-09 Metalliseret film, fremgangsmåde til fremstilling heraf samt anvendelse heraf
DK08019431T DK2034039T3 (da) 2000-10-09 2001-08-09 Metalliseret folie og fremgangsmåde til dens fremstilling samt anvendelse af den

Family Applications After (1)

Application Number Title Priority Date Filing Date
DK08019431T DK2034039T3 (da) 2000-10-09 2001-08-09 Metalliseret folie og fremgangsmåde til dens fremstilling samt anvendelse af den

Country Status (9)

Country Link
US (2) US6896938B2 (da)
EP (2) EP1332238B1 (da)
JP (1) JP2004510610A (da)
AT (1) ATE429525T1 (da)
BR (1) BR0114432B1 (da)
DE (1) DE50114859D1 (da)
DK (2) DK1332238T3 (da)
ES (2) ES2387696T3 (da)
WO (1) WO2002031214A1 (da)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2825228B1 (fr) * 2001-05-25 2003-09-19 Framatome Connectors Int Procede de fabrication d'un circuit imprime et antenne planaire fabriquee avec celui-ci
DE10143523B4 (de) * 2001-09-05 2008-08-21 Hueck Folien Gesellschaft M.B.H. Verfahren zur Herstellung einer selektiv metallisierten Folie
KR100810400B1 (ko) * 2001-10-15 2008-03-04 에스케이케미칼주식회사 Petg 플라스틱 기판을 이용한 전도성 산화박막의제조방법
AT413360B (de) 2002-08-06 2006-02-15 Hueck Folien Gmbh Verfahren zur herstellung von fälschungssicheren identifikationsmerkmalen
DE10254622A1 (de) * 2002-11-22 2004-09-02 Hueck Folien Gesellschaft M.B.H. Hochbelastbar, beständige, flexible Folie
KR100547745B1 (ko) * 2003-10-23 2006-01-31 삼성전자주식회사 카메라 장치의 이미지 센서 모듈 및 그 조립방법
DE10350648A1 (de) * 2003-10-29 2005-06-16 Steiner Gmbh & Co. Kg Transponder
AT504631B1 (de) * 2004-03-26 2012-02-15 Hueck Folien Gmbh Folienmaterial insbesondere für sicherheitselemente
JP2005317836A (ja) * 2004-04-30 2005-11-10 Nitto Denko Corp 配線回路基板およびその製造方法
WO2006104792A1 (en) * 2005-03-28 2006-10-05 Avery Dennison Corporation Method for making rfid device antennas
DE102005018984A1 (de) * 2005-04-22 2006-11-02 Steiner Gmbh & Co. Kg Verfahren und Vorrichtung zum Herstellen von elektronischen Bauteilen
AT502160B1 (de) * 2005-07-12 2013-07-15 Hueck Folien Gmbh Sicherheitsfolie zur sicherung von dokumenten
EP1746208A1 (de) * 2005-07-19 2007-01-24 Hueck Folien GmbH & Co. KG Verfahren zur Herstellung eines partiell metallisierten Trägersubstrats
EP1818425A1 (de) * 2006-02-06 2007-08-15 Hueck Folien Ges.m.b.H. Verfahren zur Herstellung von partiell metallisierten Trägersubstraten
JP2009528188A (ja) * 2006-02-28 2009-08-06 コントラ ビジョン リミテッド 金属化を用いる基板の部分印刷
US20070210924A1 (en) * 2006-03-10 2007-09-13 Wavezero, Inc. RFID Smart Label with Reduced Layers and Method of Production
US7564628B2 (en) * 2006-06-06 2009-07-21 Cpfilms, Inc. Multiple band reflector with metal and dielectric layers
US7483215B2 (en) * 2006-08-28 2009-01-27 Genie Lens Technologies, Llc Reflective imaging assembly for displaying interlaced images
DE102007055112A1 (de) 2007-01-05 2008-07-10 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Sicherheitsfolien
DE102008031573B4 (de) * 2008-07-07 2012-06-28 Carl Freudenberg Kg Dehnbares Vlies mit Leiterstrukturen
MX2011001623A (es) * 2008-08-15 2011-05-24 Toray Plastics America Inc Pelicula de acido polilactico biaxialmente orientada con alta barrera.
PL2164032T3 (pl) * 2008-09-15 2019-01-31 Hueck Folien Ges.M.B.H. Zabezpieczona przed manipulacją antena RFID z cechą zabezpieczającą
US9150004B2 (en) * 2009-06-19 2015-10-06 Toray Plastics (America), Inc. Biaxially oriented polylactic acid film with improved heat seal properties
DE102009034532A1 (de) 2009-07-23 2011-02-03 Msg Lithoglas Ag Verfahren zum Herstellen einer strukturierten Beschichtung auf einem Substrat, beschichtetes Substrat sowie Halbzeug mit einem beschichteten Substrat
US9023443B2 (en) 2009-09-25 2015-05-05 Toray Plastics (America), Inc. Multi-layer high moisture barrier polylactic acid film
WO2011103452A1 (en) 2010-02-19 2011-08-25 Toray Plastics (America) , Inc. Multi-layer high moisture barrier polylactic acid film
WO2011123165A1 (en) 2010-03-31 2011-10-06 Toray Plastics (America), Inc. Biaxially oriented polyactic acid film with reduced noise level
US9492962B2 (en) 2010-03-31 2016-11-15 Toray Plastics (America), Inc. Biaxially oriented polylactic acid film with reduced noise level and improved moisture barrier
AT510366B1 (de) 2010-08-27 2012-12-15 Hueck Folien Gmbh Wertdokument mit zumindest teilweise eingebettetem sicherheitselement
DE102010050031A1 (de) * 2010-11-02 2012-05-03 Ovd Kinegram Ag Sicherheitselement und Verfahren zur Herstellung eines Sicherheitselements
KR102145822B1 (ko) 2012-01-13 2020-08-28 아르조 위긴스 파인 페이퍼즈 리미티드 시트의 제조방법
FR2993204B1 (fr) 2012-07-16 2018-02-02 Oberthur Fiduciaire Sas Structure de securite.
DE102013108666A1 (de) 2013-08-09 2015-03-05 Leonhard Kurz Stiftung & Co. Kg Verfahren zur Herstellung eines Mehrschichtkörpers sowie Mehrschichtkörper
GB2527764B (en) * 2014-06-30 2017-02-22 Innovia Films Ltd Process for producing a security film
GB2527763B (en) * 2014-06-30 2017-10-04 Innovia Films Ltd A process for producing a security film
FR3031697B1 (fr) 2015-01-16 2020-12-18 Hologram Ind Composant optique de securite.
DE102015010744A1 (de) 2015-08-17 2017-02-23 Giesecke & Devrient Gmbh Sicherheitselement, Verfahren zum Herstellen desselben und mit dem Sicherheitselement ausgestatteter Datenträger
TWI615819B (zh) * 2015-09-01 2018-02-21 立體貼標的製作方法及結構
CN105895736B (zh) * 2016-03-15 2017-06-23 深圳市金耀辉科技有限公司 一种耐高温柔性衬底微晶硅薄膜的制备方法
DE102017105355B4 (de) 2016-03-22 2020-06-10 Dr. Schneider Kunststoffwerke Gmbh Kunststoffteil und Verfahren zu dessen Herstellung
DE102017106545A1 (de) * 2017-03-27 2018-09-27 Ovd Kinegram Ag Verfahren zur Herstellung eines optischen Sicherheitsmerkmals sowie ein Sicherheitselement und ein Sicherheitsdokument
CN110045573B (zh) * 2019-04-23 2021-01-01 天津市宝晶投影器材有限公司 一种投影幕及其生产工艺
DE102020207090A1 (de) 2020-06-05 2021-12-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren zum Herstellen eines strukturierten Objekts auf einem flexiblen Substrat durch elektrohydrodynamisches Drucken
LU102265B1 (en) * 2020-12-03 2022-06-03 Iee Sa Method of Furnishing Three-Dimensional Objects with Electrically Conductive Structures having Low Topography and Low Surface Roughness
DE112021005835T5 (de) * 2020-11-06 2023-09-07 Iee International Electronics & Engineering S.A. Verfahren zum Ausstatten von dreidimensionalen Objekten mit elektrisch leitfähigen Strukturen mit einer geringen Topographie und einer geringen Oberflächenrauheit

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4242378A (en) 1979-03-29 1980-12-30 Reiko Co., Ltd. Method of making a decorated film with a metal layer in the form of a given pattern
JPS5718735A (en) * 1980-07-04 1982-01-30 Toppan Printing Co Ltd Preparation of partially metallized film
US4354911A (en) * 1981-08-07 1982-10-19 Western Electric Company Inc. Method of selectively depositing a metal on a surface by means of sputtering
US4582564A (en) * 1982-01-04 1986-04-15 At&T Technologies, Inc. Method of providing an adherent metal coating on an epoxy surface
US4402998A (en) * 1982-01-04 1983-09-06 Western Electric Co., Inc. Method for providing an adherent electroless metal coating on an epoxy surface
JPS5978987A (ja) 1982-10-29 1984-05-08 マルイ工業株式会社 金属被膜上へのパタ−ン形成方法
JPS59215790A (ja) * 1983-05-23 1984-12-05 マルイ工業株式会社 印刷回路板の製造法
JPS6196614A (ja) * 1984-10-18 1986-05-15 釜屋化学工業株式会社 透明導電性樹脂基板の製造方法
CA1302947C (en) 1985-09-13 1992-06-09 Jerome S. Sallo Copper-chromium-polyimide composite
US4863808A (en) 1985-09-13 1989-09-05 Gould Inc. Copper-chromium-polyimide composite
DE3610379A1 (de) 1986-03-27 1987-10-01 Helmuth Schmoock Folie mit mindestens einer von einer metallschicht ueberdeckten oberflaeche sowie verfahren und vorrichtung zu ihrer herstellung
US4685997A (en) 1986-06-16 1987-08-11 Beckett Donald E Production of demetallized packaging material
US4774434A (en) * 1986-08-13 1988-09-27 Innovative Products, Inc. Lighted display including led's mounted on a flexible circuit board
DE3887497D1 (de) 1988-03-04 1994-03-10 Gao Ges Automation Org Sicherheitselement in Form eines Fadens oder Bandes zur Einbettung in Sicherheitsdokumente sowie Verfahren zur Herstellung desselben.
JPH01278339A (ja) * 1988-04-30 1989-11-08 Furukawa Electric Co Ltd:The 可撓性サワー流体輸送管
US5059454A (en) * 1989-04-26 1991-10-22 Flex Products, Inc. Method for making patterned thin film
JPH03134154A (ja) * 1989-10-17 1991-06-07 Toppan Printing Co Ltd ヘアライン状金属蒸着層の形成方法
US5112462A (en) * 1990-09-13 1992-05-12 Sheldahl Inc. Method of making metal-film laminate resistant to delamination
JP2632078B2 (ja) 1990-10-01 1997-07-16 シャープ株式会社 移動体識別システムに用いられる応答装置
JPH04197680A (ja) * 1990-11-28 1992-07-17 Reiko Co Ltd 部分蒸着フイルムの製造装置及び製造方法
JPH05109046A (ja) * 1990-12-13 1993-04-30 Hitachi Maxell Ltd 磁気記録媒体及びその製造方法
US5461203A (en) * 1991-05-06 1995-10-24 International Business Machines Corporation Electronic package including lower water content polyimide film
JPH05315740A (ja) * 1992-05-06 1993-11-26 Fujimori Kogyo Kk 印刷回路用銅張フイルムおよびその製法
US5450088A (en) 1992-11-25 1995-09-12 Texas Instruments Deutschland Gmbh Transponder arrangement
JP2591585B2 (ja) * 1993-10-18 1997-03-19 平岡織染株式会社 電磁波シールド性積層シート
JP3400164B2 (ja) * 1995-01-23 2003-04-28 三井金属鉱業株式会社 多層プリント配線板およびその製造方法
TW302507B (da) * 1995-02-10 1997-04-11 Siemens Ag
DE19643823C2 (de) 1996-10-30 2002-10-17 Lpw Chemie Gmbh Verfahren zur direkten Funktionsmetallisierung der Oberfläche eines Kunststoffgegenstandes
DE19718177A1 (de) 1997-04-29 1998-11-05 Fraunhofer Ges Forschung Verfahren zur Aufrauhung von Kunststoffen
US5863650A (en) * 1997-05-05 1999-01-26 Bioengineered Materials, Inc. Interfacial coatings
US6013563A (en) * 1997-05-12 2000-01-11 Silicon Genesis Corporation Controlled cleaning process
DE19729891B4 (de) 1997-07-12 2006-12-21 AHC-Oberflächentechnik GmbH & Co. OHG Verfahren zur gezielten Aufrauhung von Kunststoffoberflächen und Vorrichtung zur Ausführung des Verfahrens
DE19834348A1 (de) 1998-07-30 2000-02-03 Grundig Ag Verfahren zur Metallisierung einer Kunststoffoberfläche
DE19739193B4 (de) 1997-09-08 2006-08-03 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Sicherheitsfolien für Wertpapiere
DE19744953A1 (de) * 1997-10-10 1999-04-15 Giesecke & Devrient Gmbh Sicherheitselement und Verfahren zu seiner Herstellung
AT2589U1 (de) 1997-10-14 1999-01-25 Schwarz Rudolf Mappe zur aufnahme eines blattstapels und rückenteil für diese mappe
JPH11147279A (ja) * 1997-11-18 1999-06-02 Matsushita Electric Ind Co Ltd 積層体及びコンデンサ
NL1008517C1 (nl) 1998-03-06 1999-09-07 Shyh Yuan Shyu Werkwijze voor het vervaardigen van een geregenereerde vlakke plaat met driedimensionale patronen.
DE19815175A1 (de) 1998-04-04 1999-10-07 Lpw Chemie Gmbh Verfahren zur galvanotechnischen Oberflächenmetallisierung von Kunststoffteilen
DE19818968C2 (de) 1998-04-28 2000-11-30 Fraunhofer Ges Forschung Verfahren zur Herstellung eines Transponders, Verfahren zur Herstellung einer Chipkarte, die einen Transponder aufweist, sowie nach dem erfindungsgemäßen Verfahren hergestellter Transponder und nach dem erfindungsgemäßen Verfahren hergestellte Chipkarte
DE19822075C2 (de) 1998-05-16 2002-03-21 Enthone Gmbh Verfahren zur metallischen Beschichtung von Substraten

Also Published As

Publication number Publication date
US7374794B2 (en) 2008-05-20
ES2325805T3 (es) 2009-09-18
EP1332238B1 (de) 2009-04-22
DE50114859D1 (de) 2009-06-04
EP1332238A1 (de) 2003-08-06
US20050142376A1 (en) 2005-06-30
JP2004510610A (ja) 2004-04-08
ATE429525T1 (de) 2009-05-15
EP2034039A1 (de) 2009-03-11
BR0114432B1 (pt) 2011-04-05
US6896938B2 (en) 2005-05-24
ES2387696T3 (es) 2012-09-28
EP2034039B1 (de) 2012-06-20
WO2002031214A1 (de) 2002-04-18
US20030175545A1 (en) 2003-09-18
DK2034039T3 (da) 2012-10-01
BR0114432A (pt) 2004-01-06

Similar Documents

Publication Publication Date Title
DK1332238T3 (da) Metalliseret film, fremgangsmåde til fremstilling heraf samt anvendelse heraf
WO2001039288A8 (en) Method for patterning devices
WO2001036704A3 (en) Method and apparatus for forming carbonaceous film
JP2000114252A5 (da)
WO2006057711A3 (en) Method for preparing solid precursor tray for use in solid precursor evaporation system
DE3573806D1 (en) Surface treatment process
WO2005039868A3 (de) Strukturierung von elektrischen funktionsschichten mittels einer transferfolie und strukturierung des klebers
TW367602B (en) Manufacturing method for semiconductor apparatus
WO2004017365A3 (en) Deposition of amorphous silicon-containing films
DE3485829D1 (de) Verfahren und vorrichtung zur kontinuierlichen herstellung eines isolierten substrates.
JP2004503066A5 (da)
WO2006039029A3 (en) A method for forming a thin complete high-permittivity dielectric layer
WO2001071734A3 (en) Multi-layer tunneling device with a graded stoichiometry insulating layer
WO2007021544A3 (en) Method for making a thin film layer
KR970067597A (ko) TiN 인터페이스의 플라즈마 처리에 의한 A1-Cu/TiN의 판 저항의 안정화 방법
TW368685B (en) Method of fabricating bump electrode
ES480925A1 (es) Un proceso para incorporar pistas de aluminio sobre un cuer-po semiconductor.
CN104617111B (zh) 基板及其制造方法、显示装置
EP1248289A3 (en) Removal of organic anti-reflection coatings in integrated circuits
ATE414186T1 (de) Vorrichtung zum beidseitigen beschichten von substraten mit einer hydrophoben schicht
AU3800495A (en) Process for coating electrically non-conducting surfaces with connected metal structures
WO2001077419A3 (en) Process for the direct metal-plating of a plastic substrate
AU7267800A (en) Method for producing a conductor pattern on a dielectric substrate
MX167403B (es) Tratamiento de plasma con vapores organicos para activar una adherencia del metal de pelicula de polipropileno
KR940010206A (ko) 텅스텐 플러그 형성방법