JP2000114252A5 - - Google Patents

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Publication number
JP2000114252A5
JP2000114252A5 JP1998297614A JP29761498A JP2000114252A5 JP 2000114252 A5 JP2000114252 A5 JP 2000114252A5 JP 1998297614 A JP1998297614 A JP 1998297614A JP 29761498 A JP29761498 A JP 29761498A JP 2000114252 A5 JP2000114252 A5 JP 2000114252A5
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JP
Japan
Prior art keywords
film
forming
plasma
carbon
fluorine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998297614A
Other languages
English (en)
Japanese (ja)
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JP2000114252A (ja
JP4361625B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP29761498A external-priority patent/JP4361625B2/ja
Priority to JP29761498A priority Critical patent/JP4361625B2/ja
Priority to KR10-2001-7004239A priority patent/KR100414297B1/ko
Priority to TW088117137A priority patent/TW429428B/zh
Priority to PCT/JP1999/005464 priority patent/WO2000021124A1/ja
Priority to EP99970209A priority patent/EP1122769A4/en
Publication of JP2000114252A publication Critical patent/JP2000114252A/ja
Priority to US09/659,342 priority patent/US6429518B1/en
Publication of JP2000114252A5 publication Critical patent/JP2000114252A5/ja
Publication of JP4361625B2 publication Critical patent/JP4361625B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP29761498A 1998-10-05 1998-10-05 半導体装置及びその製造方法 Expired - Fee Related JP4361625B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP29761498A JP4361625B2 (ja) 1998-10-05 1998-10-05 半導体装置及びその製造方法
EP99970209A EP1122769A4 (en) 1998-10-05 1999-10-05 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
TW088117137A TW429428B (en) 1998-10-05 1999-10-05 Semiconductor device and process of making the same
PCT/JP1999/005464 WO2000021124A1 (fr) 1998-10-05 1999-10-05 Dispositif a semi-conducteurs et procede de fabrication de ce dernier
KR10-2001-7004239A KR100414297B1 (ko) 1998-10-05 1999-10-05 반도체 장치
US09/659,342 US6429518B1 (en) 1998-10-05 2000-09-12 Semiconductor device having a fluorine-added carbon film as an inter-layer insulating film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29761498A JP4361625B2 (ja) 1998-10-05 1998-10-05 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2000114252A JP2000114252A (ja) 2000-04-21
JP2000114252A5 true JP2000114252A5 (da) 2005-11-04
JP4361625B2 JP4361625B2 (ja) 2009-11-11

Family

ID=17848846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29761498A Expired - Fee Related JP4361625B2 (ja) 1998-10-05 1998-10-05 半導体装置及びその製造方法

Country Status (6)

Country Link
US (1) US6429518B1 (da)
EP (1) EP1122769A4 (da)
JP (1) JP4361625B2 (da)
KR (1) KR100414297B1 (da)
TW (1) TW429428B (da)
WO (1) WO2000021124A1 (da)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000223485A (ja) * 1999-01-28 2000-08-11 Nec Corp 複合絶縁膜の製造方法及びこれを用いた半導体装置の製造方法
US6440878B1 (en) * 2000-04-03 2002-08-27 Sharp Laboratories Of America, Inc. Method to enhance the adhesion of silicon nitride to low-k fluorinated amorphous carbon using a silicon carbide adhesion promoter layer
WO2001097269A1 (fr) * 2000-06-13 2001-12-20 Applied Materials Inc. Procede et systeme de transformation de film et tranche
TW535253B (en) * 2000-09-08 2003-06-01 Applied Materials Inc Plasma treatment of silicon carbide films
EP1777739A3 (en) * 2000-09-11 2008-09-17 Tokyo Electron Limited Semiconductor device and fabrication method therefor
US6989579B2 (en) * 2001-12-26 2006-01-24 Lucent Technologies Inc. Adhering layers to metals with dielectric adhesive layers
JP3915697B2 (ja) * 2002-01-15 2007-05-16 東京エレクトロン株式会社 成膜方法及び成膜装置
TW574762B (en) * 2002-10-16 2004-02-01 Univ Nat Cheng Kung Method for growing monocrystal GaN on silicon substrate
US7514359B2 (en) * 2003-01-14 2009-04-07 Alcatel-Lucent Usa Inc. Adhering layers to metals with dielectric adhesive layers
JP4369264B2 (ja) * 2003-03-25 2009-11-18 東京エレクトロン株式会社 プラズマ成膜方法
JP4209253B2 (ja) * 2003-05-22 2009-01-14 忠弘 大見 フッ素添加カーボン膜の形成方法
KR100743745B1 (ko) * 2004-01-13 2007-07-27 동경 엘렉트론 주식회사 반도체장치의 제조방법 및 성막시스템
CN100433294C (zh) * 2004-01-13 2008-11-12 东京毅力科创株式会社 半导体装置的制造方法以及成膜系统
JP4737552B2 (ja) * 2004-07-22 2011-08-03 国立大学法人京都大学 フルオロカーボン膜及びその形成方法
JP4927343B2 (ja) * 2005-03-18 2012-05-09 ルネサスエレクトロニクス株式会社 半導体チップおよびその製造方法
US7855401B2 (en) * 2005-06-29 2010-12-21 Cree, Inc. Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides
US7525122B2 (en) * 2005-06-29 2009-04-28 Cree, Inc. Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides
US7598576B2 (en) * 2005-06-29 2009-10-06 Cree, Inc. Environmentally robust passivation structures for high-voltage silicon carbide semiconductor devices
JP4894223B2 (ja) * 2005-10-26 2012-03-14 ソニー株式会社 平面型表示装置
US7851351B2 (en) 2006-03-31 2010-12-14 Tokyo Electron Limited Manufacturing method for semiconductor devices with enhanced adhesivity and barrier properties
JP5119606B2 (ja) * 2006-03-31 2013-01-16 東京エレクトロン株式会社 半導体装置及び半導体装置の製造方法
US8021975B2 (en) * 2007-07-24 2011-09-20 Tokyo Electron Limited Plasma processing method for forming a film and an electronic component manufactured by the method
JP2009088267A (ja) * 2007-09-28 2009-04-23 Tokyo Electron Ltd 成膜方法、成膜装置、記憶媒体及び半導体装置
WO2009101474A2 (en) * 2007-11-27 2009-08-20 Tokyo Electron Limited Semiconductor device and method for manufacturing the same
KR20150052132A (ko) 2012-09-04 2015-05-13 피에스4 뤽스코 에스.에이.알.엘. 반도체 장치 및 그 제조방법
US9991399B2 (en) 2012-10-04 2018-06-05 Cree, Inc. Passivation structure for semiconductor devices
US9812338B2 (en) 2013-03-14 2017-11-07 Cree, Inc. Encapsulation of advanced devices using novel PECVD and ALD schemes
US8994073B2 (en) 2012-10-04 2015-03-31 Cree, Inc. Hydrogen mitigation schemes in the passivation of advanced devices
JP2015065289A (ja) * 2013-09-25 2015-04-09 住友電気工業株式会社 炭化珪素半導体装置の製造方法
JP6176811B2 (ja) * 2014-06-25 2017-08-09 株式会社日立国際電気 半導体装置の製造方法、基板処理装置およびプログラム
JP6345104B2 (ja) * 2014-12-24 2018-06-20 東京エレクトロン株式会社 成膜方法
JP6602263B2 (ja) 2016-05-30 2019-11-06 株式会社東芝 半導体装置、半導体装置の製造方法、インバータ回路、駆動装置、車両、及び、昇降機
JP6946936B2 (ja) * 2017-10-31 2021-10-13 日本電信電話株式会社 光導波路およびその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2826787B2 (ja) * 1992-08-26 1998-11-18 富士通株式会社 半導体装置
US5753975A (en) * 1994-09-01 1998-05-19 Kabushiki Kaisha Toshiba Semiconductor device with improved adhesion between titanium-based metal wiring layer and insulation film
CA2157257C (en) * 1994-09-12 1999-08-10 Kazuhiko Endo Semiconductor device with amorphous carbon layer and method of fabricating the same
JP2748864B2 (ja) * 1994-09-12 1998-05-13 日本電気株式会社 半導体装置及びその製造方法及び非晶質炭素膜の製造方法及びプラズマｃｖｄ装置
US6157083A (en) * 1996-06-03 2000-12-05 Nec Corporation Fluorine doping concentrations in a multi-structure semiconductor device
JP3409984B2 (ja) * 1996-11-14 2003-05-26 東京エレクトロン株式会社 半導体装置及び半導体装置の製造方法
JP3228183B2 (ja) * 1996-12-02 2001-11-12 日本電気株式会社 絶縁膜ならびにその絶縁膜を有する半導体装置とその製造方法
JP3287392B2 (ja) * 1997-08-22 2002-06-04 日本電気株式会社 半導体装置およびその製造方法

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