BR0114432A - Folha metalizada processo para sua produção bem como sua utilização - Google Patents
Folha metalizada processo para sua produção bem como sua utilizaçãoInfo
- Publication number
- BR0114432A BR0114432A BR0114432-4A BR0114432A BR0114432A BR 0114432 A BR0114432 A BR 0114432A BR 0114432 A BR0114432 A BR 0114432A BR 0114432 A BR0114432 A BR 0114432A
- Authority
- BR
- Brazil
- Prior art keywords
- metal
- alloy
- insulator
- production
- substrate
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
- C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
- B42D25/373—Metallic materials
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
- H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
-
- B42D2033/10—
-
- B42D2033/30—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/20—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose
- B42D25/29—Securities; Bank notes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
- Y10T428/12569—Synthetic resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
Abstract
"FOLHA METALIZADA PROCESSO PARA SUA PRODUçãO BEM COMO SUA UTILIZAçãO". A invenção relaciona-se a uma folha metalizada parcialmente depositada a vapor, a uma folha metalizada integralmente depositada a vapor, e a uma folha metalizada que tenha sido revestida um certo número de vezes. A invenção refere-se também a um método para produzir uma folha metalizada parcialmente depositada a vapor, para produzir uma folha metalizada integralmente depositada a vapor, e para produzir uma folha metalizada que foi revestida um certo número de vezes. O método inventivo é caracterizado pelo fato de que: ou uma estrutura está impressa, com uma tinta solúvel (tinta lavável), em um substrato ou em uma folha de suporte, ou os materiais de base são limpos diretamente no vácuo por meio de um processo de plasma e submetidos simultaneamente a uma nucleação com átomos de alvo, subseq³entemente um metal ou semelhante é estampado e finalmente é produzida uma camada estruturada. Esta folha metalizada é utilizada, por exemplo, como uma antena de radiofreq³ência para transponders similares.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE20017392 | 2000-10-09 | ||
PCT/DE2001/003040 WO2002031214A1 (de) | 2000-10-09 | 2001-08-09 | Metallisierte folie und verfahren zu deren herstellung sowie deren anwendung |
Publications (2)
Publication Number | Publication Date |
---|---|
BR0114432A true BR0114432A (pt) | 2004-01-06 |
BR0114432B1 BR0114432B1 (pt) | 2011-04-05 |
Family
ID=7947483
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0114432-4A BR0114432B1 (pt) | 2000-10-09 | 2001-08-09 | processo para produção de uma folha metalizada, e, folha metalizada. |
Country Status (9)
Country | Link |
---|---|
US (2) | US6896938B2 (pt) |
EP (2) | EP1332238B1 (pt) |
JP (1) | JP2004510610A (pt) |
AT (1) | ATE429525T1 (pt) |
BR (1) | BR0114432B1 (pt) |
DE (1) | DE50114859D1 (pt) |
DK (2) | DK1332238T3 (pt) |
ES (2) | ES2325805T3 (pt) |
WO (1) | WO2002031214A1 (pt) |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2825228B1 (fr) * | 2001-05-25 | 2003-09-19 | Framatome Connectors Int | Procede de fabrication d'un circuit imprime et antenne planaire fabriquee avec celui-ci |
DE10143523B4 (de) * | 2001-09-05 | 2008-08-21 | Hueck Folien Gesellschaft M.B.H. | Verfahren zur Herstellung einer selektiv metallisierten Folie |
KR100810400B1 (ko) * | 2001-10-15 | 2008-03-04 | 에스케이케미칼주식회사 | Petg 플라스틱 기판을 이용한 전도성 산화박막의제조방법 |
AT413360B (de) | 2002-08-06 | 2006-02-15 | Hueck Folien Gmbh | Verfahren zur herstellung von fälschungssicheren identifikationsmerkmalen |
DE10254622A1 (de) * | 2002-11-22 | 2004-09-02 | Hueck Folien Gesellschaft M.B.H. | Hochbelastbar, beständige, flexible Folie |
KR100547745B1 (ko) * | 2003-10-23 | 2006-01-31 | 삼성전자주식회사 | 카메라 장치의 이미지 센서 모듈 및 그 조립방법 |
DE10350648A1 (de) * | 2003-10-29 | 2005-06-16 | Steiner Gmbh & Co. Kg | Transponder |
AT504631B1 (de) * | 2004-03-26 | 2012-02-15 | Hueck Folien Gmbh | Folienmaterial insbesondere für sicherheitselemente |
JP2005317836A (ja) * | 2004-04-30 | 2005-11-10 | Nitto Denko Corp | 配線回路基板およびその製造方法 |
WO2006104792A1 (en) * | 2005-03-28 | 2006-10-05 | Avery Dennison Corporation | Method for making rfid device antennas |
DE102005018984A1 (de) * | 2005-04-22 | 2006-11-02 | Steiner Gmbh & Co. Kg | Verfahren und Vorrichtung zum Herstellen von elektronischen Bauteilen |
AT502160B1 (de) * | 2005-07-12 | 2013-07-15 | Hueck Folien Gmbh | Sicherheitsfolie zur sicherung von dokumenten |
EP1746208A1 (de) * | 2005-07-19 | 2007-01-24 | Hueck Folien GmbH & Co. KG | Verfahren zur Herstellung eines partiell metallisierten Trägersubstrats |
EP1818425A1 (de) | 2006-02-06 | 2007-08-15 | Hueck Folien Ges.m.b.H. | Verfahren zur Herstellung von partiell metallisierten Trägersubstraten |
EP2001668B1 (en) * | 2006-02-28 | 2013-01-23 | Contra Vision Limited | Partial printing of a panel comprising a light permeable sheet and a metallized layer |
US20070210924A1 (en) * | 2006-03-10 | 2007-09-13 | Wavezero, Inc. | RFID Smart Label with Reduced Layers and Method of Production |
US7564628B2 (en) * | 2006-06-06 | 2009-07-21 | Cpfilms, Inc. | Multiple band reflector with metal and dielectric layers |
US7483215B2 (en) * | 2006-08-28 | 2009-01-27 | Genie Lens Technologies, Llc | Reflective imaging assembly for displaying interlaced images |
DE102007055112A1 (de) † | 2007-01-05 | 2008-07-10 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Sicherheitsfolien |
DE102008031573B4 (de) * | 2008-07-07 | 2012-06-28 | Carl Freudenberg Kg | Dehnbares Vlies mit Leiterstrukturen |
EP2323788B1 (en) * | 2008-08-15 | 2014-07-30 | Toray Plastics (America) , Inc. | Biaxially oriented polylactic acid film with high barrier |
PL2164032T3 (pl) * | 2008-09-15 | 2019-01-31 | Hueck Folien Ges.M.B.H. | Zabezpieczona przed manipulacją antena RFID z cechą zabezpieczającą |
US9150004B2 (en) * | 2009-06-19 | 2015-10-06 | Toray Plastics (America), Inc. | Biaxially oriented polylactic acid film with improved heat seal properties |
DE102009034532A1 (de) * | 2009-07-23 | 2011-02-03 | Msg Lithoglas Ag | Verfahren zum Herstellen einer strukturierten Beschichtung auf einem Substrat, beschichtetes Substrat sowie Halbzeug mit einem beschichteten Substrat |
US9221213B2 (en) | 2009-09-25 | 2015-12-29 | Toray Plastics (America), Inc. | Multi-layer high moisture barrier polylactic acid film |
US9023443B2 (en) | 2009-09-25 | 2015-05-05 | Toray Plastics (America), Inc. | Multi-layer high moisture barrier polylactic acid film |
EP2552689B1 (en) | 2010-03-31 | 2017-10-25 | Toray Plastics (America) , Inc. | Biaxially oriented polyactic acid film with reduced noise level |
US9492962B2 (en) | 2010-03-31 | 2016-11-15 | Toray Plastics (America), Inc. | Biaxially oriented polylactic acid film with reduced noise level and improved moisture barrier |
AT510366B1 (de) | 2010-08-27 | 2012-12-15 | Hueck Folien Gmbh | Wertdokument mit zumindest teilweise eingebettetem sicherheitselement |
DE102010050031A1 (de) * | 2010-11-02 | 2012-05-03 | Ovd Kinegram Ag | Sicherheitselement und Verfahren zur Herstellung eines Sicherheitselements |
US9648751B2 (en) | 2012-01-13 | 2017-05-09 | Arjo Wiggins Fine Papers Limited | Method for producing a sheet |
FR2993204B1 (fr) | 2012-07-16 | 2018-02-02 | Oberthur Fiduciaire Sas | Structure de securite. |
DE102013108666A1 (de) | 2013-08-09 | 2015-03-05 | Leonhard Kurz Stiftung & Co. Kg | Verfahren zur Herstellung eines Mehrschichtkörpers sowie Mehrschichtkörper |
GB2527763B (en) * | 2014-06-30 | 2017-10-04 | Innovia Films Ltd | A process for producing a security film |
GB2527764B (en) * | 2014-06-30 | 2017-02-22 | Innovia Films Ltd | Process for producing a security film |
FR3031697B1 (fr) | 2015-01-16 | 2020-12-18 | Hologram Ind | Composant optique de securite. |
DE102015010744A1 (de) | 2015-08-17 | 2017-02-23 | Giesecke & Devrient Gmbh | Sicherheitselement, Verfahren zum Herstellen desselben und mit dem Sicherheitselement ausgestatteter Datenträger |
TWI615819B (zh) * | 2015-09-01 | 2018-02-21 | 立體貼標的製作方法及結構 | |
CN105895736B (zh) * | 2016-03-15 | 2017-06-23 | 深圳市金耀辉科技有限公司 | 一种耐高温柔性衬底微晶硅薄膜的制备方法 |
DE102017105355B4 (de) | 2016-03-22 | 2020-06-10 | Dr. Schneider Kunststoffwerke Gmbh | Kunststoffteil und Verfahren zu dessen Herstellung |
DE102017106545A1 (de) * | 2017-03-27 | 2018-09-27 | Ovd Kinegram Ag | Verfahren zur Herstellung eines optischen Sicherheitsmerkmals sowie ein Sicherheitselement und ein Sicherheitsdokument |
WO2020203109A1 (ja) * | 2019-03-29 | 2020-10-08 | 東レ株式会社 | 金属化フィルムおよびその製造方法 |
CN110045573B (zh) * | 2019-04-23 | 2021-01-01 | 天津市宝晶投影器材有限公司 | 一种投影幕及其生产工艺 |
DE102020207090A1 (de) | 2020-06-05 | 2021-12-09 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Verfahren zum Herstellen eines strukturierten Objekts auf einem flexiblen Substrat durch elektrohydrodynamisches Drucken |
DE112021005835T5 (de) * | 2020-11-06 | 2023-09-07 | Iee International Electronics & Engineering S.A. | Verfahren zum Ausstatten von dreidimensionalen Objekten mit elektrisch leitfähigen Strukturen mit einer geringen Topographie und einer geringen Oberflächenrauheit |
LU102265B1 (en) * | 2020-12-03 | 2022-06-03 | Iee Sa | Method of Furnishing Three-Dimensional Objects with Electrically Conductive Structures having Low Topography and Low Surface Roughness |
Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4242378A (en) | 1979-03-29 | 1980-12-30 | Reiko Co., Ltd. | Method of making a decorated film with a metal layer in the form of a given pattern |
JPS5718735A (en) * | 1980-07-04 | 1982-01-30 | Toppan Printing Co Ltd | Preparation of partially metallized film |
US4354911A (en) * | 1981-08-07 | 1982-10-19 | Western Electric Company Inc. | Method of selectively depositing a metal on a surface by means of sputtering |
US4582564A (en) * | 1982-01-04 | 1986-04-15 | At&T Technologies, Inc. | Method of providing an adherent metal coating on an epoxy surface |
US4402998A (en) * | 1982-01-04 | 1983-09-06 | Western Electric Co., Inc. | Method for providing an adherent electroless metal coating on an epoxy surface |
JPS5978987A (ja) | 1982-10-29 | 1984-05-08 | マルイ工業株式会社 | 金属被膜上へのパタ−ン形成方法 |
JPS59215790A (ja) * | 1983-05-23 | 1984-12-05 | マルイ工業株式会社 | 印刷回路板の製造法 |
JPS6196614A (ja) * | 1984-10-18 | 1986-05-15 | 釜屋化学工業株式会社 | 透明導電性樹脂基板の製造方法 |
CA1302947C (en) | 1985-09-13 | 1992-06-09 | Jerome S. Sallo | Copper-chromium-polyimide composite |
US4863808A (en) | 1985-09-13 | 1989-09-05 | Gould Inc. | Copper-chromium-polyimide composite |
DE3610379A1 (de) | 1986-03-27 | 1987-10-01 | Helmuth Schmoock | Folie mit mindestens einer von einer metallschicht ueberdeckten oberflaeche sowie verfahren und vorrichtung zu ihrer herstellung |
US4685997A (en) | 1986-06-16 | 1987-08-11 | Beckett Donald E | Production of demetallized packaging material |
US4774434A (en) * | 1986-08-13 | 1988-09-27 | Innovative Products, Inc. | Lighted display including led's mounted on a flexible circuit board |
ES2048186T3 (es) | 1988-03-04 | 1994-03-16 | Gao Ges Automation Org | Elemento de seguridad en forma de un hilo o de una banda para su incorporacion en documentos de seguridad y procedimiento para su fabricacion. |
JPH01278339A (ja) * | 1988-04-30 | 1989-11-08 | Furukawa Electric Co Ltd:The | 可撓性サワー流体輸送管 |
US5059454A (en) * | 1989-04-26 | 1991-10-22 | Flex Products, Inc. | Method for making patterned thin film |
JPH03134154A (ja) * | 1989-10-17 | 1991-06-07 | Toppan Printing Co Ltd | ヘアライン状金属蒸着層の形成方法 |
US5112462A (en) * | 1990-09-13 | 1992-05-12 | Sheldahl Inc. | Method of making metal-film laminate resistant to delamination |
JP2632078B2 (ja) | 1990-10-01 | 1997-07-16 | シャープ株式会社 | 移動体識別システムに用いられる応答装置 |
JPH04197680A (ja) * | 1990-11-28 | 1992-07-17 | Reiko Co Ltd | 部分蒸着フイルムの製造装置及び製造方法 |
JPH05109046A (ja) * | 1990-12-13 | 1993-04-30 | Hitachi Maxell Ltd | 磁気記録媒体及びその製造方法 |
US5461203A (en) * | 1991-05-06 | 1995-10-24 | International Business Machines Corporation | Electronic package including lower water content polyimide film |
JPH05315740A (ja) * | 1992-05-06 | 1993-11-26 | Fujimori Kogyo Kk | 印刷回路用銅張フイルムおよびその製法 |
US5450088A (en) | 1992-11-25 | 1995-09-12 | Texas Instruments Deutschland Gmbh | Transponder arrangement |
JP2591585B2 (ja) * | 1993-10-18 | 1997-03-19 | 平岡織染株式会社 | 電磁波シールド性積層シート |
JP3400164B2 (ja) * | 1995-01-23 | 2003-04-28 | 三井金属鉱業株式会社 | 多層プリント配線板およびその製造方法 |
TW302507B (pt) * | 1995-02-10 | 1997-04-11 | Siemens Ag | |
DE19643823C2 (de) | 1996-10-30 | 2002-10-17 | Lpw Chemie Gmbh | Verfahren zur direkten Funktionsmetallisierung der Oberfläche eines Kunststoffgegenstandes |
DE19718177A1 (de) | 1997-04-29 | 1998-11-05 | Fraunhofer Ges Forschung | Verfahren zur Aufrauhung von Kunststoffen |
US5863650A (en) * | 1997-05-05 | 1999-01-26 | Bioengineered Materials, Inc. | Interfacial coatings |
US6146979A (en) * | 1997-05-12 | 2000-11-14 | Silicon Genesis Corporation | Pressurized microbubble thin film separation process using a reusable substrate |
DE19729891B4 (de) | 1997-07-12 | 2006-12-21 | AHC-Oberflächentechnik GmbH & Co. OHG | Verfahren zur gezielten Aufrauhung von Kunststoffoberflächen und Vorrichtung zur Ausführung des Verfahrens |
DE19834348A1 (de) | 1998-07-30 | 2000-02-03 | Grundig Ag | Verfahren zur Metallisierung einer Kunststoffoberfläche |
DE19739193B4 (de) | 1997-09-08 | 2006-08-03 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Sicherheitsfolien für Wertpapiere |
DE19744953A1 (de) | 1997-10-10 | 1999-04-15 | Giesecke & Devrient Gmbh | Sicherheitselement und Verfahren zu seiner Herstellung |
AT2589U1 (de) | 1997-10-14 | 1999-01-25 | Schwarz Rudolf | Mappe zur aufnahme eines blattstapels und rückenteil für diese mappe |
JPH11147279A (ja) * | 1997-11-18 | 1999-06-02 | Matsushita Electric Ind Co Ltd | 積層体及びコンデンサ |
NL1008517C1 (nl) | 1998-03-06 | 1999-09-07 | Shyh Yuan Shyu | Werkwijze voor het vervaardigen van een geregenereerde vlakke plaat met driedimensionale patronen. |
DE19815175A1 (de) | 1998-04-04 | 1999-10-07 | Lpw Chemie Gmbh | Verfahren zur galvanotechnischen Oberflächenmetallisierung von Kunststoffteilen |
DE19818968C2 (de) | 1998-04-28 | 2000-11-30 | Fraunhofer Ges Forschung | Verfahren zur Herstellung eines Transponders, Verfahren zur Herstellung einer Chipkarte, die einen Transponder aufweist, sowie nach dem erfindungsgemäßen Verfahren hergestellter Transponder und nach dem erfindungsgemäßen Verfahren hergestellte Chipkarte |
DE19822075C2 (de) | 1998-05-16 | 2002-03-21 | Enthone Gmbh | Verfahren zur metallischen Beschichtung von Substraten |
-
2001
- 2001-08-09 DK DK01960161T patent/DK1332238T3/da active
- 2001-08-09 DE DE50114859T patent/DE50114859D1/de not_active Expired - Lifetime
- 2001-08-09 EP EP01960161A patent/EP1332238B1/de not_active Revoked
- 2001-08-09 DK DK08019431T patent/DK2034039T3/da active
- 2001-08-09 WO PCT/DE2001/003040 patent/WO2002031214A1/de active Application Filing
- 2001-08-09 JP JP2002534577A patent/JP2004510610A/ja active Pending
- 2001-08-09 AT AT01960161T patent/ATE429525T1/de active
- 2001-08-09 BR BRPI0114432-4A patent/BR0114432B1/pt not_active IP Right Cessation
- 2001-08-09 ES ES01960161T patent/ES2325805T3/es not_active Expired - Lifetime
- 2001-08-09 ES ES08019431T patent/ES2387696T3/es not_active Expired - Lifetime
- 2001-08-09 EP EP20080019431 patent/EP2034039B1/de not_active Expired - Lifetime
-
2003
- 2003-04-03 US US10/407,000 patent/US6896938B2/en not_active Expired - Fee Related
-
2005
- 2005-02-22 US US11/064,155 patent/US7374794B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP2034039B1 (de) | 2012-06-20 |
ES2387696T3 (es) | 2012-09-28 |
US6896938B2 (en) | 2005-05-24 |
US7374794B2 (en) | 2008-05-20 |
DE50114859D1 (de) | 2009-06-04 |
US20030175545A1 (en) | 2003-09-18 |
EP2034039A1 (de) | 2009-03-11 |
BR0114432B1 (pt) | 2011-04-05 |
WO2002031214A1 (de) | 2002-04-18 |
JP2004510610A (ja) | 2004-04-08 |
ATE429525T1 (de) | 2009-05-15 |
EP1332238B1 (de) | 2009-04-22 |
ES2325805T3 (es) | 2009-09-18 |
EP1332238A1 (de) | 2003-08-06 |
US20050142376A1 (en) | 2005-06-30 |
DK2034039T3 (da) | 2012-10-01 |
DK1332238T3 (da) | 2009-07-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
BR0114432A (pt) | Folha metalizada processo para sua produção bem como sua utilização | |
DE3485829D1 (de) | Verfahren und vorrichtung zur kontinuierlichen herstellung eines isolierten substrates. | |
WO2001039288A8 (en) | Method for patterning devices | |
WO2001036704A3 (en) | Method and apparatus for forming carbonaceous film | |
DE3573806D1 (en) | Surface treatment process | |
WO2005039868A3 (de) | Strukturierung von elektrischen funktionsschichten mittels einer transferfolie und strukturierung des klebers | |
TW367602B (en) | Manufacturing method for semiconductor apparatus | |
EP2269837B8 (de) | Sicherheitselement und Verfahren zu seiner Herstellung | |
FR2888663B1 (fr) | Procede de diminution de la rugosite d'une couche epaisse d'isolant | |
KR101930140B1 (ko) | 전자 디바이스의 제조 방법 및 적층체 | |
WO2001091922A8 (en) | Process for production of ultrathin protective overcoats | |
DE69942748D1 (de) | Verfahren zur herstellung von filmen oder schichten | |
TW200605197A (en) | Structure formation | |
WO2001071734A3 (en) | Multi-layer tunneling device with a graded stoichiometry insulating layer | |
TW200626743A (en) | Process of using microwave deposition of metal oxide onto an organic substrate | |
TW200632117A (en) | Method of mounting substrate in film deposition apparatus and method of depositing film | |
ATE244637T1 (de) | Verfahren zur bereichsweisen übertragung der dekorlage einer transferfolie auf ein substrat sowie hierfür geeignete transferfolie | |
ATE414186T1 (de) | Vorrichtung zum beidseitigen beschichten von substraten mit einer hydrophoben schicht | |
WO2004094689A3 (en) | Volatile copper(i) complexes for deposition of copper films by atomic layer deposition | |
DE60206012D1 (de) | Verfahren zur Herstellung einer T-förmigen Elektrode | |
AU2003288486A1 (en) | Plating of multi-layer structures | |
MX167403B (es) | Tratamiento de plasma con vapores organicos para activar una adherencia del metal de pelicula de polipropileno | |
AU7267800A (en) | Method for producing a conductor pattern on a dielectric substrate | |
WO2009038061A1 (ja) | 複層フィルム及びその製造方法 | |
ES2183798T3 (es) | Procedimiento para la produccion de revestimientos delgados y dificilmente solubles. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 4A, 5A, 6A E 7A ANUIDADES. |
|
B08G | Application fees: restoration [chapter 8.7 patent gazette] | ||
B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 09/08/2001, OBSERVADAS AS CONDICOES LEGAIS. |
|
B21F | Lapse acc. art. 78, item iv - on non-payment of the annual fees in time |
Free format text: REFERENTE A 13A ANUIDADE. PAGAR RESTAURACAO. |
|
B24J | Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12) |
Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2278 DE 02-09-2014 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |