JP2001085567A5 - - Google Patents
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- Publication number
- JP2001085567A5 JP2001085567A5 JP2000208458A JP2000208458A JP2001085567A5 JP 2001085567 A5 JP2001085567 A5 JP 2001085567A5 JP 2000208458 A JP2000208458 A JP 2000208458A JP 2000208458 A JP2000208458 A JP 2000208458A JP 2001085567 A5 JP2001085567 A5 JP 2001085567A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- electroless plating
- base material
- plating layer
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007772 electroless plating Methods 0.000 description 44
- 238000000034 method Methods 0.000 description 33
- 238000009713 electroplating Methods 0.000 description 30
- 239000011347 resin Substances 0.000 description 30
- 229920005989 resin Polymers 0.000 description 30
- 239000000463 material Substances 0.000 description 25
- 238000005530 etching Methods 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 238000005422 blasting Methods 0.000 description 9
- 238000007747 plating Methods 0.000 description 9
- 230000003746 surface roughness Effects 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 6
- 238000003825 pressing Methods 0.000 description 5
- 238000000059 patterning Methods 0.000 description 4
- 238000010030 laminating Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000208458A JP4712940B2 (ja) | 1999-07-12 | 2000-07-10 | 電子部材の製造方法 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11-198203 | 1999-07-12 | ||
| JP19820399 | 1999-07-12 | ||
| JP1999198203 | 1999-07-12 | ||
| JP2000208458A JP4712940B2 (ja) | 1999-07-12 | 2000-07-10 | 電子部材の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001085567A JP2001085567A (ja) | 2001-03-30 |
| JP2001085567A5 true JP2001085567A5 (enExample) | 2007-06-14 |
| JP4712940B2 JP4712940B2 (ja) | 2011-06-29 |
Family
ID=26510838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000208458A Expired - Fee Related JP4712940B2 (ja) | 1999-07-12 | 2000-07-10 | 電子部材の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4712940B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3860000B2 (ja) | 2001-09-07 | 2006-12-20 | Necエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| TWI312166B (en) * | 2001-09-28 | 2009-07-11 | Toppan Printing Co Ltd | Multi-layer circuit board, integrated circuit package, and manufacturing method for multi-layer circuit board |
| KR100582425B1 (ko) | 2006-01-16 | 2006-05-23 | (주)플렉스컴 | 회로기판의 비어홀 필링방법 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4060905B2 (ja) * | 1997-04-02 | 2008-03-12 | 大日本印刷株式会社 | 半導体装置用回路部材とそれを用いた半導体装置、及びそれらの製造方法 |
| JP3688397B2 (ja) * | 1996-06-19 | 2005-08-24 | 日本アビオニクス株式会社 | メタルコアプリント配線板およびその製造方法 |
| JP3589794B2 (ja) * | 1996-06-25 | 2004-11-17 | 富士通株式会社 | 外部接続用電極の製造方法及び外部接続用電極及び 半導体装置 |
| JP3777687B2 (ja) * | 1996-12-12 | 2006-05-24 | 凸版印刷株式会社 | チップキャリア |
| JPH10296635A (ja) * | 1997-04-23 | 1998-11-10 | Toyota Motor Corp | ウエットブラスト装置 |
| JP3126331B2 (ja) * | 1997-10-29 | 2001-01-22 | イビデン株式会社 | パッケージ基板 |
| JP3444769B2 (ja) * | 1997-11-25 | 2003-09-08 | 東洋アルミニウム株式会社 | 集電体用アルミニウム箔とその製造方法、集電体、二次電池および電気二重層コンデンサ |
| JP3250519B2 (ja) * | 1998-05-08 | 2002-01-28 | 関西日本電気株式会社 | 配線基板の製造方法 |
| JP2000091719A (ja) * | 1998-07-16 | 2000-03-31 | Dainippon Printing Co Ltd | 絶縁被膜付き部材とそれを用いた配線基板、及び絶縁被膜付き部材の製造方法と配線基板の製造方法 |
-
2000
- 2000-07-10 JP JP2000208458A patent/JP4712940B2/ja not_active Expired - Fee Related
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