TWI354521B - - Google Patents
Download PDFInfo
- Publication number
- TWI354521B TWI354521B TW97102107A TW97102107A TWI354521B TW I354521 B TWI354521 B TW I354521B TW 97102107 A TW97102107 A TW 97102107A TW 97102107 A TW97102107 A TW 97102107A TW I354521 B TWI354521 B TW I354521B
- Authority
- TW
- Taiwan
- Prior art keywords
- metal layer
- layer
- circuit board
- carrier plate
- component
- Prior art date
Links
- 239000002184 metal Substances 0.000 claims description 38
- 229910052751 metal Inorganic materials 0.000 claims description 38
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 4
- 239000011707 mineral Substances 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97102107A TW200934333A (en) | 2008-01-18 | 2008-01-18 | Method of manufacturing circuit boards of embedded elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97102107A TW200934333A (en) | 2008-01-18 | 2008-01-18 | Method of manufacturing circuit boards of embedded elements |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200934333A TW200934333A (en) | 2009-08-01 |
| TWI354521B true TWI354521B (enExample) | 2011-12-11 |
Family
ID=44866236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97102107A TW200934333A (en) | 2008-01-18 | 2008-01-18 | Method of manufacturing circuit boards of embedded elements |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200934333A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI417970B (zh) * | 2009-09-04 | 2013-12-01 | 欣興電子股份有限公司 | 封裝結構及其製法 |
-
2008
- 2008-01-18 TW TW97102107A patent/TW200934333A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW200934333A (en) | 2009-08-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI334747B (en) | Circuit board structure having embedded electronic components | |
| CN104756615B (zh) | 印刷电路板 | |
| TWI296492B (en) | Un-symmetric circuit board and method for fabricating the same | |
| TWI336226B (en) | Circuit board structure with capacitor embedded therein and method for fabricating the same | |
| TWI246379B (en) | Method for forming printed circuit board | |
| TW201029133A (en) | Printed circuit board structure and fabrication method thereof | |
| TW201141338A (en) | Printed circuit board and method of manufacturing the same | |
| JP6084283B2 (ja) | 部品内蔵基板及びその製造方法 | |
| TWI354521B (enExample) | ||
| TWI304719B (en) | Circuit board structure having embedded compacitor and fabrication method thereof | |
| JP2000151112A (ja) | 配線基板及びその製造方法 | |
| JP2000232018A (ja) | チップ型電子部品及びその製造方法 | |
| TWI327879B (enExample) | ||
| JP4285362B2 (ja) | 電子部品の実装構造および電子部品の製造方法 | |
| TWI251455B (en) | A manufacturing method of a multi-layer circuit board with embedded passive components | |
| CN108464061A (zh) | 元件内置基板及元件内置基板的制造方法 | |
| TW200922427A (en) | Multilayer circuit board with embedded electronic component and manufacturing method thereof | |
| TWI299247B (en) | Substrate with surface process structure and method for manufacturing the same | |
| TWI260189B (en) | Method of fabricating a device-containing substrate | |
| TW200840430A (en) | The structure of electric part inserted into electric circuit board and the insertion method | |
| TW201006320A (en) | Circuit board structure of embedded component | |
| TWI236761B (en) | Chip-buried type modulization of circuit board | |
| TWI224389B (en) | Semiconductor package substrate with embedded resistors and method for fabricating the same | |
| JP4019717B2 (ja) | 部品内蔵多層配線モジュール基板及びその製造方法 | |
| TW201138581A (en) | Circuit board structure and fabrication method thereof |