TW200934333A - Method of manufacturing circuit boards of embedded elements - Google Patents
Method of manufacturing circuit boards of embedded elements Download PDFInfo
- Publication number
- TW200934333A TW200934333A TW97102107A TW97102107A TW200934333A TW 200934333 A TW200934333 A TW 200934333A TW 97102107 A TW97102107 A TW 97102107A TW 97102107 A TW97102107 A TW 97102107A TW 200934333 A TW200934333 A TW 200934333A
- Authority
- TW
- Taiwan
- Prior art keywords
- metal layer
- layer
- carrier plate
- manufacturing
- component
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 44
- 229910052751 metal Inorganic materials 0.000 claims abstract description 44
- 238000000034 method Methods 0.000 claims description 10
- 239000003990 capacitor Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 238000000059 patterning Methods 0.000 abstract description 3
- 239000003292 glue Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- HSMPDPBYAYSOBC-UHFFFAOYSA-N khellin Chemical compound O1C(C)=CC(=O)C2=C1C(OC)=C1OC=CC1=C2OC HSMPDPBYAYSOBC-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97102107A TW200934333A (en) | 2008-01-18 | 2008-01-18 | Method of manufacturing circuit boards of embedded elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97102107A TW200934333A (en) | 2008-01-18 | 2008-01-18 | Method of manufacturing circuit boards of embedded elements |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200934333A true TW200934333A (en) | 2009-08-01 |
| TWI354521B TWI354521B (enExample) | 2011-12-11 |
Family
ID=44866236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97102107A TW200934333A (en) | 2008-01-18 | 2008-01-18 | Method of manufacturing circuit boards of embedded elements |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200934333A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI417970B (zh) * | 2009-09-04 | 2013-12-01 | 欣興電子股份有限公司 | 封裝結構及其製法 |
-
2008
- 2008-01-18 TW TW97102107A patent/TW200934333A/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI417970B (zh) * | 2009-09-04 | 2013-12-01 | 欣興電子股份有限公司 | 封裝結構及其製法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI354521B (enExample) | 2011-12-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6324067B1 (en) | Printed wiring board and assembly of the same | |
| JP5997260B2 (ja) | 印刷回路基板及びその製造方法 | |
| JP6880429B2 (ja) | 素子内蔵型印刷回路基板及びその製造方法 | |
| JP4143609B2 (ja) | 配線基板の製造方法 | |
| JP4756710B2 (ja) | 屈曲式リジットプリント配線板およびその製造方法 | |
| JP2001291802A (ja) | 配線基板及びその製造方法ならびに半導体装置 | |
| JP6084283B2 (ja) | 部品内蔵基板及びその製造方法 | |
| US10548229B2 (en) | Method for producing a foil arrangement and corresponding foil arrangement | |
| TW200934333A (en) | Method of manufacturing circuit boards of embedded elements | |
| CN105230139A (zh) | 元器件内置基板及其制造方法 | |
| JP2004031476A (ja) | 電子部品内蔵多層プリント基板及びその製造方法 | |
| JP4899409B2 (ja) | 多層プリント配線基板及びその製造方法 | |
| JP4019717B2 (ja) | 部品内蔵多層配線モジュール基板及びその製造方法 | |
| KR20070079794A (ko) | 인쇄회로기판의 제조방법 | |
| JP2004214393A (ja) | 多層配線基板の製造方法 | |
| TW201006320A (en) | Circuit board structure of embedded component | |
| TWI224389B (en) | Semiconductor package substrate with embedded resistors and method for fabricating the same | |
| JPH08335783A (ja) | 印刷配線板の製造方法 | |
| JP2004241719A (ja) | 層間絶縁樹脂シートと多層配線基板 | |
| JP2005032739A (ja) | 電子部品埋込み用の窪みを備える多層プリント配線板及びその製造方法 | |
| JP2023042086A (ja) | 電子デバイス及び電子デバイスの製造方法 | |
| JPH1070365A (ja) | 多層回路基板の製造方法 | |
| WO2012164720A1 (ja) | 部品内蔵基板及びその製造方法 | |
| KR20040046626A (ko) | 다층 인쇄 회로 기판을 제조하는 방법 | |
| WO2011135670A1 (ja) | 部品内蔵基板の製造方法及びこれを用いた部品内蔵基板 |