TWI327879B - - Google Patents

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Publication number
TWI327879B
TWI327879B TW96125657A TW96125657A TWI327879B TW I327879 B TWI327879 B TW I327879B TW 96125657 A TW96125657 A TW 96125657A TW 96125657 A TW96125657 A TW 96125657A TW I327879 B TWI327879 B TW I327879B
Authority
TW
Taiwan
Prior art keywords
layer
circuit board
passive component
manufacturing
directly embedded
Prior art date
Application number
TW96125657A
Other languages
English (en)
Chinese (zh)
Other versions
TW200904272A (en
Inventor
Wilson Yang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW96125657A priority Critical patent/TW200904272A/zh
Publication of TW200904272A publication Critical patent/TW200904272A/zh
Application granted granted Critical
Publication of TWI327879B publication Critical patent/TWI327879B/zh

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  • Production Of Multi-Layered Print Wiring Board (AREA)
TW96125657A 2007-07-13 2007-07-13 Manufacturing method of electric circuit board with directly-embedded passive components TW200904272A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96125657A TW200904272A (en) 2007-07-13 2007-07-13 Manufacturing method of electric circuit board with directly-embedded passive components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96125657A TW200904272A (en) 2007-07-13 2007-07-13 Manufacturing method of electric circuit board with directly-embedded passive components

Publications (2)

Publication Number Publication Date
TW200904272A TW200904272A (en) 2009-01-16
TWI327879B true TWI327879B (enExample) 2010-07-21

Family

ID=44722312

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96125657A TW200904272A (en) 2007-07-13 2007-07-13 Manufacturing method of electric circuit board with directly-embedded passive components

Country Status (1)

Country Link
TW (1) TW200904272A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8036508B2 (en) * 2009-09-21 2011-10-11 Corning Incorporated Methods for passively aligning opto-electronic component assemblies on substrates
TWI449147B (zh) * 2011-11-02 2014-08-11 Tripod Technology Corp 內埋元件之多層基板的製造方法

Also Published As

Publication number Publication date
TW200904272A (en) 2009-01-16

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