JP2002371370A5 - - Google Patents

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Publication number
JP2002371370A5
JP2002371370A5 JP2001182155A JP2001182155A JP2002371370A5 JP 2002371370 A5 JP2002371370 A5 JP 2002371370A5 JP 2001182155 A JP2001182155 A JP 2001182155A JP 2001182155 A JP2001182155 A JP 2001182155A JP 2002371370 A5 JP2002371370 A5 JP 2002371370A5
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JP
Japan
Prior art keywords
copper
compound
copper alloy
aqueous solution
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001182155A
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English (en)
Japanese (ja)
Other versions
JP4065110B2 (ja
JP2002371370A (ja
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Publication date
Application filed filed Critical
Priority to JP2001182155A priority Critical patent/JP4065110B2/ja
Priority claimed from JP2001182155A external-priority patent/JP4065110B2/ja
Publication of JP2002371370A publication Critical patent/JP2002371370A/ja
Publication of JP2002371370A5 publication Critical patent/JP2002371370A5/ja
Application granted granted Critical
Publication of JP4065110B2 publication Critical patent/JP4065110B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2001182155A 2001-06-15 2001-06-15 銅または銅合金の表面処理法およびプリント配線板の製造法 Expired - Fee Related JP4065110B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001182155A JP4065110B2 (ja) 2001-06-15 2001-06-15 銅または銅合金の表面処理法およびプリント配線板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001182155A JP4065110B2 (ja) 2001-06-15 2001-06-15 銅または銅合金の表面処理法およびプリント配線板の製造法

Publications (3)

Publication Number Publication Date
JP2002371370A JP2002371370A (ja) 2002-12-26
JP2002371370A5 true JP2002371370A5 (enExample) 2006-09-28
JP4065110B2 JP4065110B2 (ja) 2008-03-19

Family

ID=19022310

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001182155A Expired - Fee Related JP4065110B2 (ja) 2001-06-15 2001-06-15 銅または銅合金の表面処理法およびプリント配線板の製造法

Country Status (1)

Country Link
JP (1) JP4065110B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4546163B2 (ja) * 2004-06-10 2010-09-15 四国化成工業株式会社 銅または銅合金の表面処理剤及び半田付け方法
JP2006080473A (ja) * 2004-08-10 2006-03-23 Fujitsu Ltd 回路基板及びこれに用いる密着層用処理液
JP2009097034A (ja) * 2007-10-16 2009-05-07 Hitachi Chem Co Ltd 銅の表面処理法

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