JP4065110B2 - 銅または銅合金の表面処理法およびプリント配線板の製造法 - Google Patents

銅または銅合金の表面処理法およびプリント配線板の製造法 Download PDF

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JP4065110B2
JP4065110B2 JP2001182155A JP2001182155A JP4065110B2 JP 4065110 B2 JP4065110 B2 JP 4065110B2 JP 2001182155 A JP2001182155 A JP 2001182155A JP 2001182155 A JP2001182155 A JP 2001182155A JP 4065110 B2 JP4065110 B2 JP 4065110B2
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copper
surface treatment
compound
water
azole compound
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JP2002371370A5 (enExample
JP2002371370A (ja
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稔 王谷
良昭 古川
紀子 矢熊
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MEC Co Ltd
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MEC Co Ltd
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  • Chemical Treatment Of Metals (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2001182155A 2001-06-15 2001-06-15 銅または銅合金の表面処理法およびプリント配線板の製造法 Expired - Fee Related JP4065110B2 (ja)

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JP2001182155A JP4065110B2 (ja) 2001-06-15 2001-06-15 銅または銅合金の表面処理法およびプリント配線板の製造法

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JP2001182155A JP4065110B2 (ja) 2001-06-15 2001-06-15 銅または銅合金の表面処理法およびプリント配線板の製造法

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JP2002371370A JP2002371370A (ja) 2002-12-26
JP2002371370A5 JP2002371370A5 (enExample) 2006-09-28
JP4065110B2 true JP4065110B2 (ja) 2008-03-19

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JP2001182155A Expired - Fee Related JP4065110B2 (ja) 2001-06-15 2001-06-15 銅または銅合金の表面処理法およびプリント配線板の製造法

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4546163B2 (ja) * 2004-06-10 2010-09-15 四国化成工業株式会社 銅または銅合金の表面処理剤及び半田付け方法
JP2006080473A (ja) * 2004-08-10 2006-03-23 Fujitsu Ltd 回路基板及びこれに用いる密着層用処理液
JP2009097034A (ja) * 2007-10-16 2009-05-07 Hitachi Chem Co Ltd 銅の表面処理法

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