JP4065110B2 - Copper or copper alloy surface treatment method and printed wiring board manufacturing method - Google Patents
Copper or copper alloy surface treatment method and printed wiring board manufacturing method Download PDFInfo
- Publication number
- JP4065110B2 JP4065110B2 JP2001182155A JP2001182155A JP4065110B2 JP 4065110 B2 JP4065110 B2 JP 4065110B2 JP 2001182155 A JP2001182155 A JP 2001182155A JP 2001182155 A JP2001182155 A JP 2001182155A JP 4065110 B2 JP4065110 B2 JP 4065110B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- surface treatment
- compound
- water
- azole compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】
【発明の属する技術分野】
本発明は、プリント配線板のランドなどを構成する銅または銅合金（以下、単に銅という）の表面処理剤、特に水溶性プリフラックス前処理用の表面処理剤、表面処理法、及びそれを用いるプリント配線板の製造法に関する。
【０００２】
【従来の技術】
プリント配線板のランド（電子部品がはんだ付けされる外層回路パターンの一部）を酸化などから保護し、はんだ付け性を保持するための表面処理として、水溶性プリフラックスによる処理が行なわれている。この処理は、他の処理法に比べて低コスト、環境に与える負荷が小さいなどの利点を有する。
水溶性プリフラックスとは、例えば特許第２９２３５９６号に記載されているようにアゾール化合物を含有する酸性水溶液であり、銅表面にこの水溶液を接触させることにより、銅表面にアゾール化合物が付着して保護被膜となる。
【０００３】
水溶性プリフラックスによる処理工程は、（１）まず処理される外層回路パターンの銅表面をマイクロエッチングして、酸化物などを除去して表面を清浄にし、（２）ついで５％（重量％、以下同様）程度の塩酸で洗浄して銅表面に付着しているマイクロエッチング剤由来の防錆成分を除去したのち、（３）水溶性プリフラックス中に浸漬するという構成が一般的である。
しかしながら、アゾール化合物の付着は種々の要因に影響されるので、その付着量を制御することが困難であり、必要な付着量の得られない場合がある。アゾール化合物の付着量が少ない場合には、充分な保護効果がえられず、プリント配線板に電子部品を複数回リフローはんだ付けするような場合にはんだ付け不良が生じるようになる。なお、前記（２）の工程の塩酸による洗浄は、アゾール化合物の付着量を向上させる効果があるが不充分である。
また、マイクロエッチングしたのち温水で処理すると、アゾール化合物の付着量が向上することも知られているが、その効果は温度と処理時間に依存し、処理装置の材料を耐熱性の高い材料に変更しなければならないなどの問題がある。
【０００４】
【発明が解決しようとする課題】
そのため、アゾール化合物の付着量を増加させ、また、安定させることができる方法が望まれている。
したがって、本発明は、従来技術の欠点を克服し、簡単な方法で銅表面の防錆被膜であるアゾール化合物の付着量を増加させ、更に安定させることができる、銅または銅合金の表面処理剤、表面処理法及びそれを用いたプリント配線板の製造法を提供することを目的とする。
【０００５】
【課題を解決するための手段】
本発明者らは、前記課題を解決するべく鋭意検討を重ねた結果、銅または銅合金からなる外層回路パターンの表面をマイクロエッチングし、酸化物を除去して表面を清浄にし、有機酸銅からなる銅（II）化合物を０．００５〜１５重量％含有する水溶液からなる表面処理剤と接触させた後、アゾール化合物を含有する酸性の水溶性プリフラックスで処理すると、銅表面の防錆被膜であるアゾール化合物の付着量を増加させ、かつ安定させることができることを見出した。即ち、本発明は、下記構成により達成される。
【０００６】
本発明の銅または銅合金の表面処理法は、銅または銅合金からなる外層回路パターンの表面をマイクロエッチングし、酸化物を除去して表面を清浄にし、有機酸銅からなる銅（ＩＩ）化合物を０．００５〜１５重量％含有する水溶液からなる表面処理剤と接触させた後、アゾール化合物を含有する酸性の水溶性プリフラックスで処理することを特徴とする。
【０００７】
前記銅（ＩＩ）化合物を２０〜４０℃で銅または銅合金の表面と接触させることが好ましい。
【０００８】
本発明のプリント配線板の製造法は、銅または銅合金からなる外層回路パターンの表面をマイクロエッチングし、酸化物を除去して表面を清浄にし、有機酸銅からなる銅（ＩＩ）化合物を０．００５〜１５重量％含有する水溶液からなる表面処理剤と接触させた後、アゾール化合物を含有する酸性の水溶性プリフラックスで処理することを特徴とする。
【０００９】
【発明の実施の形態】
以下に、本発明について、詳細に記載する。
本発明に用いられる水溶液に配合される銅（II）化合物は、銅表面を酸化するための成分である。銅の表面が酸化銅に変わることにより、水溶性プリフラックスで処理した際のアゾール化合物の付着量が増加する。
酸化銅がアゾール化合物の付着量を増加させる作用は明確ではないが、酸化銅が酸性の水溶性プリフラックスと接触した際に溶解し、溶出した銅が、銅表面に付着積層しやすいアゾール銅錯体となるためと推定される。
【００１０】
前記銅（II）化合物は、有機酸銅（II）であってもよく、無機酸銅（II）であってもよい。前記有機酸銅（II）の具体例としては、例えば酢酸銅（II）、蟻酸銅（II）、プロピオン酸銅（II）、吉草酸銅（II）、グルコン酸銅（II）、酒石酸銅（II）などがあげられる。
また、前記無機機酸銅（II）の具体例としては、例えば硫酸銅（II）、硝酸銅（II）、ピロリン酸銅（II）、フッ化銅（II）、塩化銅（II）、臭化銅（II）水酸化銅（II）、炭酸銅（II）などがあげられる。
【００１１】
前記銅（II）化合物のうちでは、酸化力が強すぎず、また酸化力の濃度依存性が小さく、銅表面を安定して酸化することができるという点から、酢酸銅（II）、蟻酸銅（II）、プロピオン酸銅（II）、吉草酸銅（II）のような炭素数５以下の炭化水素基を有する有機酸銅（II）が好ましい。
前記銅（II）化合物は、２種以上を併用してもよい。
【００１２】
本発明の表面処理剤中の銅（II）化合物の濃度は０．００５〜１５％、好ましくは０．０１〜５％である。前記濃度が０．００５％未満では銅表面の酸化が不充分になりやすく、１５％を超えると銅表面の酸化が進行しすぎて、黒く変色し、商品価値が低下するなどの問題が生じやすい。
【００１３】
本発明の表面処理剤には、さらに必要に応じて酢酸、ギ酸などの有機酸、エチレンジアミン４酢酸２ナトリウムなどのキレート成分、微量（数ｐｐｍ〜数十ｐｐｍ）のハロゲンなど、種々の添加剤を配合してもよい。
【００１４】
本発明の表面処理剤は、前記銅（II）化合物およびその他の成分を水に溶解させることにより容易に調整することができる。前記水としては、一般の水道水を用いてもよいが、イオン交換水などのイオン性物質や不純物を除去した水が好ましい。
【００１５】
本発明の表面処理剤によって処理される銅表面に特に限定はないが、例えば銅箔、無電解銅めっき膜、電解銅めっき膜、銅スパッタリング膜などの表面があげられる。
【００１６】
前記銅表面は、マイクロエッチング剤により、酸化物やその他の汚染物が除去された清浄な表面であることが好ましい。前記マイクロエッチング剤としては、例えば硫酸・過酸化水素タイプエッチング剤、過硫酸塩タイプエッチング剤、塩化銅タイプエッチング剤、塩化鉄タイプエッチング液、アルカリ性エッチング液などや、メック（株）製のＣＺ−８１００などがあげられる。
【００１７】
前記表面処理剤を銅表面に接触させる方法としては、例えばスプレー法、シャワー法、浸漬法などが用いられ、その後、水洗、乾燥させればよい。その際の表面処理剤の温度は２０〜４０℃が好ましい。前記温度が高すぎると銅表面の酸化が進行しすぎる傾向があり、一方低すぎると酸化が不充分になりがちである。
また、銅表面と表面処理剤との接触時間は５〜３０秒間程度が好ましい。
【００１８】
次に、酸化された銅表面を水溶性プリフラックスで処理する。
【００１９】
前記水溶性プリフラックスは、アゾール化合物を含有する酸性水溶液である。
前記アゾール化合物としては、例えばイミダゾール、２−ウンデシルイミダゾール、２−フェニルイミダゾール、２，４−ジフェニルイミダゾール、トリアゾール、アミノトリアゾール、ピラゾール、ベンゾチアゾール、２−メルカプトベンゾチアゾール、ベンゾイミダゾール、２−ブチルベンゾイミダゾール、２−フェニルエチルベンゾイミダゾール、２−ナフチルベンゾイミダゾール、５−ニトロ−２−ノニルベンゾイミダゾール、５−クロロ−２−ノニルベンゾイミダゾール、２−アミノベンゾイミダゾール、ベンゾトリアゾール、ヒドロキシベンゾトリアゾール、カルボキシベンゾトリアゾールなどのアゾール化合物があげられる。
【００２０】
前記水溶性プリフラックスとしては、メック（株）製のメックシールなどの市販品を用いてもよい。
【００２１】
酸化された銅表面を水溶性プリフラックスで処理する方法としては、例えばスプレー法、シャワー法、浸漬法などが用いられ、その後、水洗、乾燥させればよい。その際の水溶性プリフラックスの温度は２５〜４０℃が好ましく、水溶性プリフラックスと銅表面との接触時間は３０〜６０秒間が好ましい。
【００２２】
以上のように、銅表面を、銅（II）化合物を０．００５〜１５％を含有する水溶液と接触させたのち、水溶性プリフラックスで処理することにより、銅表面に充分な量のアゾール化合物が付着し、また未着の部分や付着量の少ない部分がなくなり、銅表面の保護性能が向上する。
【００２３】
本発明は、銅表面をアゾール化合物で防錆する際に有用であり、特にプリント配線板外層回路パターンの表面処理に有用である。例えば、外層回路パターンが形成され、ソルダーマスクが形成されたプリント配線板のランドをマイクロエッチングしたのち本発明の表面処理剤で処理し、水溶性プリフラックスで処理することにより、ランド表面にアゾール化合物の均一な保護膜が形成され、はんだ付け性に優れたプリント配線板をうることができる。
【００２４】
【実施例】
次に実施例により、本発明をさらに具体的に説明する。
実施例１〜５および比較例１〜２
プリント配線板用両面銅張積層板（縦４ｃｍ、横４ｃｍ、銅の表面積３２ｃｍ2）の表面の銅を、ＣＢ−８０１（メック（株）製の硫酸・過酸化水素タイプのマイクロエッチング剤）にて約１μｍエッチングした。エッチング量（エッチング深さ）は、溶解した銅の重量と表面積と比重とから換算した値である。
次に、表１に示す組成の水溶液を調製し、この液中にエッチングされた積層板を２５℃で１０秒間浸漬した後、水洗し、乾燥した。
次に、アゾール化合物を含有する水溶性プリフラックス（メック（株）製のメックシールＣＬ−５８２４）の液中に２５℃で６０秒間浸漬した後、水洗、乾燥し、銅表面にアゾール化合物の被膜を形成した。
【００２５】
（アゾール化合物の付着量の測定）
下記紫外線吸収スペクトル法による吸光度を測定し、これをアゾール化合物の付着量とした。結果を表１に示す。
紫外線吸収スペクトル法によるアゾール化合物の付着量の測定：
特定面積（３２ｃｍ2）の銅表面に付着したアゾール化合物を３５％塩酸／メタノール（試薬１級）＝０．５／９９．５（重量比）の溶液に溶解させ、これを光路幅１０ｍｍの石英セルに入れて波長２７７ｎｍ付近の紫外線の吸光度を測定する。吸光度はアゾール化合物の溶解量、すなわちアゾール化合物の付着量に比例する。
【００２６】
（銅表面の保護性能）
前記アゾール化合物の被膜が形成された積層板を、４０℃、湿度９５％の恒温恒湿槽内に１６８時間保存し、銅表面の変色を観察した。加湿前の銅表面は光沢のあるピンクである。結果を表１に示す。
【００２７】
【表１】
表１に示されるように、本発明の表面処理をすることにより、未処理の場合（比較例１）に比べて約２．３〜３．５倍のアゾール化合物が付着していた。
また、加湿後の変色もみられなかった。
【００２９】
【発明の効果】
本発明の表面処理剤を銅または銅合金の表面に接触させることにより、銅表面の防錆被膜であるアゾール化合物の付着量を増加させ、かつ安定させることができる。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a surface treatment agent for copper or copper alloy (hereinafter simply referred to as copper) constituting a land of a printed wiring board, in particular, a surface treatment agent for water-soluble preflux pretreatment, a surface treatment method, and the same. The present invention relates to a method of manufacturing a printed wiring board.
[0002]
[Prior art]
As a surface treatment to protect the land of the printed wiring board (a part of the outer layer circuit pattern to which the electronic component is soldered) from oxidation, etc., and to maintain the solderability, a treatment with a water-soluble preflux is performed. . This processing has advantages such as low cost and a small load on the environment as compared with other processing methods.
The water-soluble preflux is an acidic aqueous solution containing an azole compound as described in, for example, Japanese Patent No. 2923596. By contacting this aqueous solution with the copper surface, the azole compound adheres to the copper surface and protects it. It becomes a film.
[0003]
The treatment process using the water-soluble preflux is as follows: (1) First, the copper surface of the outer circuit pattern to be treated is microetched to remove oxides and the like to clean the surface, and (2) 5% (wt%, The same is true for the following, after washing with a moderate amount of hydrochloric acid to remove the anti-corrosive component derived from the microetching agent adhering to the copper surface, and (3) dipping in a water-soluble preflux.
However, since the adhesion of the azole compound is affected by various factors, it is difficult to control the amount of adhesion, and the necessary amount of adhesion may not be obtained. When the amount of azole compound attached is small, a sufficient protective effect cannot be obtained, and poor soldering occurs when an electronic component is reflow soldered to a printed wiring board a plurality of times. The cleaning with hydrochloric acid in the step (2) has an effect of improving the adhesion amount of the azole compound, but is insufficient.
It is also known that the amount of azole compound deposited improves when treated with warm water after microetching, but the effect depends on the temperature and treatment time, and the material of the treatment equipment is changed to a material with high heat resistance. There are problems such as having to do.
[0004]
[Problems to be solved by the invention]
Therefore, a method capable of increasing and stabilizing the amount of azole compound attached is desired.
Therefore, the present invention overcomes the drawbacks of the prior art and increases the amount of azole compound, which is a rust-preventing coating on the copper surface, by a simple method and can further stabilize the surface treatment agent for copper or copper alloy. An object of the present invention is to provide a surface treatment method and a method for producing a printed wiring board using the same.
[0005]
[Means for Solving the Problems]
As a result of intensive studies to solve the above problems, the present inventors have microetched the surface of the outer layer circuit pattern made of copper or a copper alloy, removed the oxide to clean the surface, and made from an organic acid copper. in consisting of copper (II) after the compound was contacted with the surface treatment agent comprising an aqueous solution containing 0.005% by weight, treated with OSP acidic containing azole compounds then, the copper surface antirust coating It has been found that the adhesion amount of a certain azole compound can be increased and stabilized. That is, the present invention is achieved by the following configuration.
[0006]
The copper or copper alloy surface treatment method of the present invention is a copper (II) compound made of organic acid copper by microetching the surface of the outer layer circuit pattern made of copper or copper alloy, removing the oxide to clean the surface. Is contacted with a surface treatment agent comprising an aqueous solution containing 0.005 to 15% by weight, and then treated with an acidic water-soluble preflux containing an azole compound.
[0007]
The copper (II) compound is preferably brought into contact with the surface of copper or a copper alloy at 20 to 40 ° C.
[0008]
In the method for producing a printed wiring board of the present invention, the surface of an outer layer circuit pattern made of copper or a copper alloy is microetched, the oxide is removed to clean the surface, and a copper (II) compound made of organic acid copper is reduced to 0. It is characterized by being treated with an acidic water-soluble preflux containing an azole compound after contacting with a surface treatment agent comprising an aqueous solution containing 0.005 to 15% by weight.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
The present invention is described in detail below.
The copper (II) compound blended in the aqueous solution used in the present invention is a component for oxidizing the copper surface. By changing the surface of copper to copper oxide, the amount of azole compound deposited when treated with a water-soluble preflux increases.
Although the action of copper oxide to increase the amount of azole compound attached is not clear, azole copper complex that dissolves when copper oxide comes into contact with an acidic water-soluble preflux and the eluted copper adheres to the copper surface and is easy to stack It is estimated that
[0010]
The copper (II) compound may be an organic acid copper (II) or an inorganic acid copper (II). Specific examples of the organic acid copper (II) include, for example, copper (II) acetate, copper (II) formate, copper (II) propionate, copper (II) valerate, copper (II) gluconate, copper tartrate ( II).
Specific examples of the inorganic machine acid copper (II) include, for example, copper sulfate (II), copper nitrate (II), copper pyrophosphate (II), copper fluoride (II), copper chloride (II), odor Examples thereof include copper (II) chloride, copper (II) hydroxide, and copper (II) carbonate.
[0011]
Among the copper (II) compounds, the oxidizing power is not too strong, the concentration dependence of the oxidizing power is small, and the copper surface can be stably oxidized, so copper (II) acetate and copper formate Organic acid copper (II) having a hydrocarbon group having 5 or less carbon atoms such as copper (II), copper propionate (II), and copper (II) valerate is preferred.
Two or more kinds of the copper (II) compounds may be used in combination.
[0012]
The concentration of the copper (II) compound in the surface treating agent of the present invention is 0.005 to 15%, preferably 0.01 to 5%. If the concentration is less than 0.005%, oxidation of the copper surface tends to be insufficient, and if it exceeds 15%, oxidation of the copper surface proceeds excessively, causing the color to change to black and the commercial value to decrease. .
[0013]
The surface treatment agent of the present invention may further contain various additives such as organic acids such as acetic acid and formic acid, chelating components such as disodium ethylenediaminetetraacetate, and trace amounts (several ppm to several tens of ppm) of halogen. You may mix | blend.
[0014]
The surface treating agent of the present invention can be easily adjusted by dissolving the copper (II) compound and other components in water. As the water, general tap water may be used, but water from which ionic substances and impurities such as ion-exchanged water have been removed is preferable.
[0015]
Although there is no limitation in particular in the copper surface processed by the surface treating agent of this invention, Surfaces, such as copper foil, an electroless copper plating film | membrane, an electrolytic copper plating film | membrane, a copper sputtering film | membrane, are mention | raise | lifted, for example.
[0016]
The copper surface is preferably a clean surface from which oxides and other contaminants have been removed by a microetching agent. Examples of the microetching agent include sulfuric acid / hydrogen peroxide type etching agent, persulfate type etching agent, copper chloride type etching agent, iron chloride type etching solution, alkaline etching solution, etc., and CZ- manufactured by MEC Co., Ltd. 8100 and the like.
[0017]
As a method of bringing the surface treatment agent into contact with the copper surface, for example, a spray method, a shower method, a dipping method, or the like is used, and then it may be washed with water and dried. The temperature of the surface treatment agent at that time is preferably 20 to 40 ° C. If the temperature is too high, the copper surface tends to oxidize too much, while if it is too low, the oxidation tends to be insufficient.
The contact time between the copper surface and the surface treatment agent is preferably about 5 to 30 seconds.
[0018]
Next, the oxidized copper surface is treated with a water-soluble preflux.
[0019]
The water-soluble preflux is an acidic aqueous solution containing an azole compound.
Examples of the azole compound include imidazole, 2-undecylimidazole, 2-phenylimidazole, 2,4-diphenylimidazole, triazole, aminotriazole, pyrazole, benzothiazole, 2-mercaptobenzothiazole, benzimidazole, and 2-butylbenzo. Imidazole, 2-phenylethylbenzimidazole, 2-naphthylbenzimidazole, 5-nitro-2-nonylbenzimidazole, 5-chloro-2-nonylbenzimidazole, 2-aminobenzimidazole, benzotriazole, hydroxybenzotriazole, carboxybenzo Examples thereof include azole compounds such as triazole.
[0020]
As the water-soluble preflux, a commercially available product such as MEC seal manufactured by MEC Co., Ltd. may be used.
[0021]
As a method of treating the oxidized copper surface with a water-soluble preflux, for example, a spray method, a shower method, a dipping method, or the like is used, and then it may be washed with water and dried. The temperature of the water-soluble preflux at that time is preferably 25 to 40 ° C., and the contact time between the water-soluble preflux and the copper surface is preferably 30 to 60 seconds.
[0022]
As described above, after bringing the copper surface into contact with an aqueous solution containing 0.005 to 15% of the copper (II) compound, a sufficient amount of azole compound is formed on the copper surface by treating with a water-soluble preflux. In addition, there are no unattached parts or parts with a small amount of adhesion, and the protection performance of the copper surface is improved.
[0023]
The present invention is useful when rust-proofing a copper surface with an azole compound, and particularly useful for surface treatment of a printed wiring board outer layer circuit pattern. For example, the land of the printed circuit board on which the outer layer circuit pattern is formed and the solder mask is formed is micro-etched, then treated with the surface treatment agent of the present invention, and treated with a water-soluble preflux, whereby the azole compound is formed on the land surface. A uniform protective film is formed, and a printed wiring board excellent in solderability can be obtained.
[0024]
【Example】
Next, the present invention will be described more specifically with reference to examples.
Examples 1-5 and Comparative Examples 1-2
Copper on the surface of a double-sided copper-clad laminate (4 cm long, 4 cm wide, copper surface area 32 cm 2 ) for printed wiring board is used as CB-801 (a sulfuric acid / hydrogen peroxide type microetching agent manufactured by MEC Co., Ltd.). About 1 μm. The etching amount (etching depth) is a value converted from the weight, surface area, and specific gravity of the dissolved copper.
Next, an aqueous solution having the composition shown in Table 1 was prepared, and the laminated board etched in this liquid was immersed at 25 ° C. for 10 seconds, then washed with water and dried.
Next, after immersing in a solution of a water-soluble preflux containing azole compound (MEC Seal CL-5824, manufactured by MEC Co., Ltd.) at 25 ° C. for 60 seconds, it is washed with water and dried, and a coating of azole compound is formed on the copper surface. Formed.
[0025]
(Measurement of azole compound adhesion)
Absorbance was measured by the following ultraviolet absorption spectrum method, and this was defined as the amount of azole compound attached. The results are shown in Table 1.
Measurement of the amount of azole compound deposited by ultraviolet absorption spectroscopy:
The azole compound adhering to the copper surface of a specific area (32 cm 2 ) is dissolved in a solution of 35% hydrochloric acid / methanol (reagent grade 1) = 0.5 / 99.5 (weight ratio), and this is dissolved in quartz having an optical path width of 10 mm. It is put in a cell and the absorbance of ultraviolet rays having a wavelength of around 277 nm is measured. The absorbance is proportional to the dissolved amount of the azole compound, that is, the attached amount of the azole compound.
[0026]
(Copper surface protection performance)
The laminate on which the azole compound film was formed was stored in a constant temperature and humidity chamber at 40 ° C. and 95% humidity for 168 hours, and the discoloration of the copper surface was observed. The copper surface before humidification is glossy pink. The results are shown in Table 1.
[0027]
[Table 1]
As shown in Table 1, by the surface treatment of the present invention, about 2.3 to 3.5 times as much azole compound was adhered as compared with the case where it was not treated (Comparative Example 1).
Moreover, the discoloration after humidification was not seen.
[0029]
【The invention's effect】
By bringing the surface treatment agent of the present invention into contact with the surface of copper or a copper alloy, it is possible to increase and stabilize the adhesion amount of an azole compound which is a rust preventive coating on the copper surface.
Claims (3)
有機酸銅からなる銅（ＩＩ）化合物を０．００５〜１５重量％含有する水溶液からなる表面処理剤と接触させた後、
アゾール化合物を含有する酸性の水溶性プリフラックスで処理することを特徴とする銅または銅合金の表面処理法。 Micro-etch the surface of the outer layer circuit pattern made of copper or copper alloy, remove the oxide and clean the surface,
After contacting with a surface treatment agent comprising an aqueous solution containing 0.005 to 15% by weight of a copper (II) compound comprising an organic acid copper,
A surface treatment method for copper or a copper alloy, characterized by treating with an acidic water-soluble preflux containing an azole compound .
有機酸銅からなる銅（ＩＩ）化合物を０．００５〜１５重量％含有する水溶液からなる表面処理剤と接触させた後、
アゾール化合物を含有する酸性の水溶性プリフラックスで処理することを特徴とするプリント配線板の製造法。 Micro-etch the surface of the outer layer circuit pattern made of copper or copper alloy , remove the oxide and clean the surface,
After contacting with a surface treatment agent comprising an aqueous solution containing 0.005 to 15% by weight of a copper (II) compound comprising an organic acid copper ,
A method for producing a printed wiring board, which comprises treating with an acidic water-soluble preflux containing an azole compound .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001182155A JP4065110B2 (en) | 2001-06-15 | 2001-06-15 | Copper or copper alloy surface treatment method and printed wiring board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001182155A JP4065110B2 (en) | 2001-06-15 | 2001-06-15 | Copper or copper alloy surface treatment method and printed wiring board manufacturing method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002371370A JP2002371370A (en) | 2002-12-26 |
| JP2002371370A5 JP2002371370A5 (en) | 2006-09-28 |
| JP4065110B2 true JP4065110B2 (en) | 2008-03-19 |
Family
ID=19022310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001182155A Expired - Fee Related JP4065110B2 (en) | 2001-06-15 | 2001-06-15 | Copper or copper alloy surface treatment method and printed wiring board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4065110B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4546163B2 (en) * | 2004-06-10 | 2010-09-15 | 四国化成工業株式会社 | Copper or copper alloy surface treatment agent and soldering method |
| JP2006080473A (en) * | 2004-08-10 | 2006-03-23 | Fujitsu Ltd | Circuit board and process liquid for closely adhered layer |
| JP2009097034A (en) * | 2007-10-16 | 2009-05-07 | Hitachi Chem Co Ltd | Copper surface treatment method |
-
2001
- 2001-06-15 JP JP2001182155A patent/JP4065110B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002371370A (en) | 2002-12-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0670379B1 (en) | Method for microetching copper or copper alloy surfaces | |
| US5439783A (en) | Composition for treating copper or copper alloys | |
| US5807493A (en) | Microetching method for copper or copper alloy | |
| JP4881916B2 (en) | Surface roughening agent | |
| CA1196560A (en) | Metal stripping composition and process | |
| JPH08255968A (en) | Manufacturing of printed-circuit board | |
| JPH0151548B2 (en) | ||
| EP0855454A1 (en) | Microetching composition for copper or copper alloy | |
| CN111020585A (en) | Coarsening micro-etching solution of hydrogen sulfate peroxide system and application thereof | |
| JP4364252B2 (en) | Substrate manufacturing method and copper surface treating agent used therefor | |
| CN107971655B (en) | High-heat-resistance organic solder flux and application thereof | |
| KR101616731B1 (en) | Metal surface treatment aqueous solution and method for inhibiting whiskers on a metal surface | |
| JPH0480117B2 (en) | ||
| JP5020312B2 (en) | Method to improve solderability of copper surface | |
| EP1331287A2 (en) | Treating metal surfaces with a modified oxide replacement composition | |
| EP1179973B1 (en) | Composition for circuit board manufacture | |
| JP4242915B2 (en) | Copper surface treatment agent and surface treatment method | |
| JP4065110B2 (en) | Copper or copper alloy surface treatment method and printed wiring board manufacturing method | |
| JP2001348684A (en) | Surface-roughening agent for aluminum of aluminum alloy and surface-roughening method using the agent | |
| JP4431860B2 (en) | Surface treatment agent for copper and copper alloys | |
| CN114833491B (en) | Copper surface selective organic soldering flux and use method thereof | |
| JP2004218021A (en) | Surface treatment agent for microetching copper and copper alloy, and roughening treatment method for surface of copper and copper alloy | |
| CN114833491A (en) | Copper surface selective organic solderability preservative and use method thereof | |
| JPS61261484A (en) | Post-treatment after etching with hydrogen peroxide and sulfuric acid | |
| TH34026A (en) | Copper treatment with a protective agent |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20060425 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060703 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060703 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20060703 |
|
| RD05 | Notification of revocation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7425 Effective date: 20060703 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20060703 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060703 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20071029 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20071101 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071120 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20071129 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20071220 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20071228 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 4065110 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110111 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110111 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120111 Year of fee payment: 4 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120111 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130111 Year of fee payment: 5 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130111 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130111 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140111 Year of fee payment: 6 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |