TH34026A - Copper treatment with a protective agent - Google Patents

Abstract

DC60 (28/08/41) Pre-treatment method of copper surface. For protecting the skin from oxidation reactions (Combining with oxygen) by immersing the surface in the contained solution. Solderable organic surface preservatives, such as benzo triazole with the addition of zinc salts, are particularly useful in the manufacture of electronic printed circuit boards (PCBs) for covers. Prevents the copper surface during the soldering process, when the PCB is subjected to a zinc-salting temperature. To qualify Solderable characteristics of the copper surface (ie wetting and adhesion characteristics). Downstream copper surface treatment methods. For protecting the skin from oxidation reactions (Combining with oxygen) by immersing the surface in the contained solution. Organic skin protection agent Can be soldered such as benzothiazole with the addition of zinc salts, method is especially useful In the manufacture of electronic printed circuit boards (PCBs) for covers. Protect the copper surface. During the day Brazing when the PCB is subjected to a zinc-salting temperature provides additional advantages for its properties. Solderable characteristics of the gold face too (i.e. wetting and adhesion characteristics).

Claims (4)

1. Solution for copper surface treatment. Which contains at least one compound that Was selected from the chemical class Which was characterized by that it still contains zinc salts 2. The solution is stated in claim 1, which compounds at least One of the most chosen from The chemical class of azole is benzothiazole (BTA). 3.The solution is stated in claim 1 or 2, where zinc salt is zinc acetate Zn (CH 3 COO) 2 2H2O. 4. The solution described in claim 3 still contains organic acids. And the selected compound: