JP2002371370A - Agent and method for surface treating copper or copper alloy, and method for manufacturing printed circuit board - Google Patents
Agent and method for surface treating copper or copper alloy, and method for manufacturing printed circuit boardInfo
- Publication number
- JP2002371370A JP2002371370A JP2001182155A JP2001182155A JP2002371370A JP 2002371370 A JP2002371370 A JP 2002371370A JP 2001182155 A JP2001182155 A JP 2001182155A JP 2001182155 A JP2001182155 A JP 2001182155A JP 2002371370 A JP2002371370 A JP 2002371370A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- water
- agent
- compound
- azole compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Chemical Treatment Of Metals (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント配線板の
ランドなどを構成する銅または銅合金（以下、単に銅と
いう）の表面処理剤、特に水溶性プリフラックス前処理
用の表面処理剤、表面処理法、及びそれを用いるプリン
ト配線板の製造法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface treatment agent for copper or copper alloy (hereinafter, simply referred to as copper) constituting a land of a printed wiring board, particularly a surface treatment agent for pretreatment of a water-soluble preflux, The present invention relates to a processing method and a method for manufacturing a printed wiring board using the same.
【０００２】[0002]
【従来の技術】プリント配線板のランド（電子部品がは
んだ付けされる外層回路パターンの一部）を酸化などか
ら保護し、はんだ付け性を保持するための表面処理とし
て、水溶性プリフラックスによる処理が行なわれてい
る。この処理は、他の処理法に比べて低コスト、環境に
与える負荷が小さいなどの利点を有する。水溶性プリフ
ラックスとは、例えば特許第２９２３５９６号に記載さ
れているようにアゾール化合物を含有する酸性水溶液で
あり、銅表面にこの水溶液を接触させることにより、銅
表面にアゾール化合物が付着して保護被膜となる。2. Description of the Related Art As a surface treatment for protecting a land of a printed wiring board (a part of an outer layer circuit pattern to which an electronic component is soldered) from oxidation or the like and maintaining solderability, treatment with a water-soluble pre-flux is performed. Is being done. This processing has advantages such as lower cost and less load on the environment than other processing methods. The water-soluble preflux is an acidic aqueous solution containing an azole compound as described in, for example, Japanese Patent No. 2923596. When the aqueous solution is brought into contact with the copper surface, the azole compound adheres to the copper surface and is protected. It becomes a film.
【０００３】水溶性プリフラックスによる処理工程は、
（１）まず処理される外層回路パターンの銅表面をマイ
クロエッチングして、酸化物などを除去して表面を清浄
にし、（２）ついで５％（重量％、以下同様）程度の塩
酸で洗浄して銅表面に付着しているマイクロエッチング
剤由来の防錆成分を除去したのち、（３）水溶性プリフ
ラックス中に浸漬するという構成が一般的である。しか
しながら、アゾール化合物の付着は種々の要因に影響さ
れるので、その付着量を制御することが困難であり、必
要な付着量の得られない場合がある。アゾール化合物の
付着量が少ない場合には、充分な保護効果がえられず、
プリント配線板に電子部品を複数回リフローはんだ付け
するような場合にはんだ付け不良が生じるようになる。
なお、前記（２）の工程の塩酸による洗浄は、アゾール
化合物の付着量を向上させる効果があるが不充分であ
る。また、マイクロエッチングしたのち温水で処理する
と、アゾール化合物の付着量が向上することも知られて
いるが、その効果は温度と処理時間に依存し、処理装置
の材料を耐熱性の高い材料に変更しなければならないな
どの問題がある。[0003] The treatment process using a water-soluble pre-flux
(1) First, the copper surface of the outer circuit pattern to be treated is microetched to remove oxides and the like to clean the surface, and (2) then washed with hydrochloric acid of about 5% (% by weight, the same applies hereinafter). After removing the rust-preventive component derived from the microetching agent adhering to the copper surface by immersion in (3) a water-soluble preflux, it is common. However, since the adhesion of the azole compound is affected by various factors, it is difficult to control the adhesion amount, and a necessary adhesion amount may not be obtained. If the amount of the azole compound is small, a sufficient protective effect cannot be obtained,
In the case where an electronic component is reflow-soldered to a printed wiring board a plurality of times, defective soldering occurs.
The washing with hydrochloric acid in the step (2) has an effect of improving the amount of the azole compound attached, but is insufficient. It is also known that treatment with warm water after micro-etching increases the amount of azole compound attached, but the effect depends on temperature and processing time, and the material of the processing equipment is changed to a material with high heat resistance. There is a problem that must be done.
【０００４】[0004]
【発明が解決しようとする課題】そのため、アゾール化
合物の付着量を増加させ、また、安定させることができ
る方法が望まれている。したがって、本発明は、従来技
術の欠点を克服し、簡単な方法で銅表面の防錆被膜であ
るアゾール化合物の付着量を増加させ、更に安定させる
ことができる、銅または銅合金の表面処理剤、表面処理
法及びそれを用いたプリント配線板の製造法を提供する
ことを目的とする。Therefore, there is a need for a method capable of increasing and stabilizing the amount of the azole compound attached. Therefore, the present invention overcomes the drawbacks of the prior art, increases the amount of the azole compound that is a rust preventive coating on the copper surface in a simple manner, and further stabilizes the copper or copper alloy surface treatment agent. It is an object of the present invention to provide a surface treatment method and a method for manufacturing a printed wiring board using the same.
【０００５】[0005]
【課題を解決するための手段】本発明者らは、前記課題
を解決するべく鋭意検討を重ねた結果、銅または銅合金
の表面を銅（II）化合物を０．００５〜１５重量％含有
する水溶液からなる表面処理剤と接触させると、その後
水溶性プリフラックスで処理した際に、銅表面の防錆被
膜であるアゾール化合物の付着量を増加させ、かつ安定
させることができることを見出した。即ち、本発明は、
下記構成により達成される。The present inventors have conducted intensive studies to solve the above-mentioned problems, and as a result, have found that the surface of copper or a copper alloy contains 0.005 to 15% by weight of a copper (II) compound. It has been found that, when brought into contact with a surface treating agent composed of an aqueous solution, the amount of the azole compound, which is a rust-preventive coating on the copper surface, can be increased and stabilized when subsequently treated with a water-soluble preflux. That is, the present invention
This is achieved by the following configuration.
【０００６】（１） 銅（II）化合物を０．００５〜１
５重量％含有する水溶液からなる銅または銅合金の表面
処理剤。(1) A copper (II) compound is used in an amount of 0.005 to 1
A surface treating agent for copper or copper alloy comprising an aqueous solution containing 5% by weight.
【０００７】（２） 銅または銅合金の表面を、銅（I
I）化合物を０．００５〜１５重量％含有する水溶液と
接触さたのち、水溶性プリフラックスで処理することを
特徴とする銅または銅合金の表面処理法。(2) The surface of copper or copper alloy is coated with copper (I
I) A surface treatment method for copper or a copper alloy, which comprises contacting with an aqueous solution containing 0.005 to 15% by weight of a compound and then treating with a water-soluble preflux.
【０００８】（３） 銅または銅合金からなる外層回路
パターンの表面を、銅（II）化合物を０．００５〜１５
重量％含有する水溶液と接触さたのち、水溶性プリフラ
ックスで処理することを特徴とするプリント配線板の製
造法。(3) The surface of the outer layer circuit pattern made of copper or copper alloy is coated with a copper (II) compound in an amount of 0.005 to 15
A method for producing a printed wiring board, comprising contacting with an aqueous solution containing a weight percent and treating with a water-soluble preflux.
【０００９】[0009]
【発明の実施の形態】以下に、本発明について、詳細に
記載する。本発明に用いられる水溶液に配合される銅
（II）化合物は、銅表面を酸化するための成分である。
銅の表面が酸化銅に変わることにより、水溶性プリフラ
ックスで処理した際のアゾール化合物の付着量が増加す
る。酸化銅がアゾール化合物の付着量を増加させる作用
は明確ではないが、酸化銅が酸性の水溶性プリフラック
スと接触した際に溶解し、溶出した銅が、銅表面に付着
積層しやすいアゾール銅錯体となるためと推定される。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail. The copper (II) compound blended in the aqueous solution used in the present invention is a component for oxidizing the copper surface.
When the surface of copper is changed to copper oxide, the amount of the azole compound attached when treated with a water-soluble preflux increases. The effect of copper oxide to increase the amount of azole compound attached is not clear, but copper oxide dissolves when copper oxide comes in contact with acidic water-soluble pre-flux, and eluted copper adheres to the copper surface and easily deposits on copper surface. It is estimated that
【００１０】前記銅（II）化合物は、有機酸銅（II）で
あってもよく、無機酸銅（II）であってもよい。前記有
機酸銅（II）の具体例としては、例えば酢酸銅（II）、
蟻酸銅（II）、プロピオン酸銅（II）、吉草酸銅（I
I）、グルコン酸銅（II）、酒石酸銅（II）などがあげ
られる。また、前記無機機酸銅（II）の具体例として
は、例えば硫酸銅（II）、硝酸銅（II）、ピロリン酸銅
（II）、フッ化銅（II）、塩化銅（II）、臭化銅（II）
水酸化銅（II）、炭酸銅（II）などがあげられる。The copper (II) compound may be an organic acid copper (II) or an inorganic acid copper (II). Specific examples of the organic acid copper (II) include, for example, copper acetate (II),
Copper formate (II), copper propionate (II), copper valerate (I
I), copper (II) gluconate, copper (II) tartrate and the like. Specific examples of the inorganic copper (II) oxide include, for example, copper (II) sulfate, copper (II) nitrate, copper (II) pyrophosphate, copper (II) fluoride, copper (II) chloride, and odor. Copper (II) oxide
Examples thereof include copper (II) hydroxide and copper (II) carbonate.
【００１１】前記銅（II）化合物のうちでは、酸化力が
強すぎず、また酸化力の濃度依存性が小さく、銅表面を
安定して酸化することができるという点から、酢酸銅
（II）、蟻酸銅（II）、プロピオン酸銅（II）、吉草酸
銅（II）のような炭素数５以下の炭化水素基を有する有
機酸銅（II）が好ましい。前記銅（II）化合物は、２種
以上を併用してもよい。Among the above-mentioned copper (II) compounds, copper (II) acetate has a high oxidizing power, is less dependent on the concentration of the oxidizing power, and can stably oxidize the copper surface. And organic acid copper (II) having a hydrocarbon group having 5 or less carbon atoms, such as copper (II) formate, copper (II) propionate, and copper (II) valerate. Two or more copper (II) compounds may be used in combination.
【００１２】本発明の表面処理剤中の銅（II）化合物の
濃度は０．００５〜１５％、好ましくは０．０１〜５％
である。前記濃度が０．００５％未満では銅表面の酸化
が不充分になりやすく、１５％を超えると銅表面の酸化
が進行しすぎて、黒く変色し、商品価値が低下するなど
の問題が生じやすい。The concentration of the copper (II) compound in the surface treating agent of the present invention is 0.005 to 15%, preferably 0.01 to 5%.
It is. If the concentration is less than 0.005%, the oxidation of the copper surface tends to be insufficient, and if it exceeds 15%, the oxidation of the copper surface proceeds excessively, discoloring to black and lowering the commercial value tends to cause problems. .
【００１３】本発明の表面処理剤には、さらに必要に応
じて酢酸、ギ酸などの有機酸、エチレンジアミン４酢酸
２ナトリウムなどのキレート成分、微量（数ｐｐｍ〜数
十ｐｐｍ）のハロゲンなど、種々の添加剤を配合しても
よい。The surface-treating agent of the present invention may further contain, if necessary, various organic acids such as acetic acid and formic acid, chelating components such as disodium ethylenediaminetetraacetate, and trace amounts (several ppm to tens of ppm) of halogen. Additives may be blended.
【００１４】本発明の表面処理剤は、前記銅（II）化合
物およびその他の成分を水に溶解させることにより容易
に調整することができる。前記水としては、一般の水道
水を用いてもよいが、イオン交換水などのイオン性物質
や不純物を除去した水が好ましい。The surface treating agent of the present invention can be easily adjusted by dissolving the copper (II) compound and other components in water. As the water, general tap water may be used, but water from which ionic substances and impurities are removed such as ion-exchanged water is preferable.
【００１５】本発明の表面処理剤によって処理される銅
表面に特に限定はないが、例えば銅箔、無電解銅めっき
膜、電解銅めっき膜、銅スパッタリング膜などの表面が
あげられる。The surface of the copper treated by the surface treating agent of the present invention is not particularly limited, and examples thereof include surfaces of a copper foil, an electroless copper plating film, an electrolytic copper plating film, a copper sputtering film and the like.
【００１６】前記銅表面は、マイクロエッチング剤によ
り、酸化物やその他の汚染物が除去された清浄な表面で
あることが好ましい。前記マイクロエッチング剤として
は、例えば硫酸・過酸化水素タイプエッチング剤、過硫
酸塩タイプエッチング剤、塩化銅タイプエッチング剤、
塩化鉄タイプエッチング液、アルカリ性エッチング液な
どや、メック（株）製のＣＺ−８１００などがあげられ
る。The copper surface is preferably a clean surface from which oxides and other contaminants have been removed by a microetching agent. Examples of the microetching agent include a sulfuric acid / hydrogen peroxide type etching agent, a persulfate type etching agent, a copper chloride type etching agent,
Examples thereof include an iron chloride type etching solution and an alkaline etching solution, and CZ-8100 manufactured by Mec Co., Ltd.
【００１７】前記表面処理剤を銅表面に接触させる方法
としては、例えばスプレー法、シャワー法、浸漬法など
が用いられ、その後、水洗、乾燥させればよい。その際
の表面処理剤の温度は２０〜４０℃が好ましい。前記温
度が高すぎると銅表面の酸化が進行しすぎる傾向があ
り、一方低すぎると酸化が不充分になりがちである。ま
た、銅表面と表面処理剤との接触時間は５〜３０秒間程
度が好ましい。As a method for bringing the surface treating agent into contact with the copper surface, for example, a spray method, a shower method, an immersion method and the like are used, and thereafter, it may be washed with water and dried. The temperature of the surface treatment agent at that time is preferably 20 to 40 ° C. If the temperature is too high, the oxidation of the copper surface tends to proceed excessively, while if it is too low, the oxidation tends to be insufficient. The contact time between the copper surface and the surface treatment agent is preferably about 5 to 30 seconds.
【００１８】次に、酸化された銅表面を水溶性プリフラ
ックスで処理する。Next, the oxidized copper surface is treated with a water-soluble preflux.
【００１９】前記水溶性プリフラックスは、アゾール化
合物を含有する酸性水溶液である。前記アゾール化合物
としては、例えばイミダゾール、２−ウンデシルイミダ
ゾール、２−フェニルイミダゾール、２，４−ジフェニ
ルイミダゾール、トリアゾール、アミノトリアゾール、
ピラゾール、ベンゾチアゾール、２−メルカプトベンゾ
チアゾール、ベンゾイミダゾール、２−ブチルベンゾイ
ミダゾール、２−フェニルエチルベンゾイミダゾール、
２−ナフチルベンゾイミダゾール、５−ニトロ−２−ノ
ニルベンゾイミダゾール、５−クロロ−２−ノニルベン
ゾイミダゾール、２−アミノベンゾイミダゾール、ベン
ゾトリアゾール、ヒドロキシベンゾトリアゾール、カル
ボキシベンゾトリアゾールなどのアゾール化合物があげ
られる。The water-soluble preflux is an acidic aqueous solution containing an azole compound. Examples of the azole compound include imidazole, 2-undecylimidazole, 2-phenylimidazole, 2,4-diphenylimidazole, triazole, aminotriazole,
Pyrazole, benzothiazole, 2-mercaptobenzothiazole, benzimidazole, 2-butylbenzimidazole, 2-phenylethylbenzimidazole,
Azole compounds such as 2-naphthylbenzimidazole, 5-nitro-2-nonylbenzimidazole, 5-chloro-2-nonylbenzimidazole, 2-aminobenzimidazole, benzotriazole, hydroxybenzotriazole, and carboxybenzotriazole.
【００２０】前記水溶性プリフラックスとしては、メッ
ク（株）製のメックシールなどの市販品を用いてもよ
い。As the water-soluble preflux, a commercially available product such as Mec Seal manufactured by Mec Co., Ltd. may be used.
【００２１】酸化された銅表面を水溶性プリフラックス
で処理する方法としては、例えばスプレー法、シャワー
法、浸漬法などが用いられ、その後、水洗、乾燥させれ
ばよい。その際の水溶性プリフラックスの温度は２５〜
４０℃が好ましく、水溶性プリフラックスと銅表面との
接触時間は３０〜６０秒間が好ましい。As a method of treating the oxidized copper surface with a water-soluble preflux, for example, a spray method, a shower method, an immersion method or the like is used, and then, it may be washed with water and dried. In this case, the temperature of the water-soluble pre-flux is 25 to
The temperature is preferably 40 ° C., and the contact time between the water-soluble preflux and the copper surface is preferably 30 to 60 seconds.
【００２２】以上のように、銅表面を、銅（II）化合物
を０．００５〜１５％を含有する水溶液と接触させたの
ち、水溶性プリフラックスで処理することにより、銅表
面に充分な量のアゾール化合物が付着し、また未着の部
分や付着量の少ない部分がなくなり、銅表面の保護性能
が向上する。As described above, the copper surface is brought into contact with an aqueous solution containing 0.005 to 15% of a copper (II) compound, and then treated with a water-soluble preflux, whereby a sufficient amount of The azole compound adheres, and the unadhered portion and the portion having a small amount of adhesion are eliminated, and the performance of protecting the copper surface is improved.
【００２３】本発明は、銅表面をアゾール化合物で防錆
する際に有用であり、特にプリント配線板外層回路パタ
ーンの表面処理に有用である。例えば、外層回路パター
ンが形成され、ソルダーマスクが形成されたプリント配
線板のランドをマイクロエッチングしたのち本発明の表
面処理剤で処理し、水溶性プリフラックスで処理するこ
とにより、ランド表面にアゾール化合物の均一な保護膜
が形成され、はんだ付け性に優れたプリント配線板をう
ることができる。INDUSTRIAL APPLICABILITY The present invention is useful for preventing rust on the copper surface with an azole compound, and is particularly useful for surface treatment of an outer layer circuit pattern of a printed wiring board. For example, the outer layer circuit pattern is formed, the land of the printed wiring board on which the solder mask is formed is microetched, then treated with the surface treatment agent of the present invention, and treated with a water-soluble preflux, whereby the azole compound is applied to the land surface. Thus, a printed wiring board having excellent solderability can be obtained.
【００２４】[0024]
【実施例】次に実施例により、本発明をさらに具体的に
説明する。 実施例１〜５および比較例１〜２ プリント配線板用両面銅張積層板（縦４ｃｍ、横４ｃ
ｍ、銅の表面積３２ｃｍ 2）の表面の銅を、ＣＢ−８０
１（メック（株）製の硫酸・過酸化水素タイプのマイク
ロエッチング剤）にて約１μｍエッチングした。エッチ
ング量（エッチング深さ）は、溶解した銅の重量と表面
積と比重とから換算した値である。次に、表１に示す組
成の水溶液を調製し、この液中にエッチングされた積層
板を２５℃で１０秒間浸漬した後、水洗し、乾燥した。
次に、アゾール化合物を含有する水溶性プリフラックス
（メック（株）製のメックシールＣＬ−５８２４）の液
中に２５℃で６０秒間浸漬した後、水洗、乾燥し、銅表
面にアゾール化合物の被膜を形成した。EXAMPLES Next, the present invention will be described in more detail with reference to Examples.
explain. Examples 1 to 5 and Comparative Examples 1 and 2 Double-sided copper-clad laminates for printed wiring boards (length 4 cm, width 4 c)
m, copper surface area 32cm Two) Surface copper, CB-80
1 (Sulfuric acid / hydrogen peroxide type microphone manufactured by Mec Co., Ltd.)
(About 1 μm). Etch
The amount of etching (etching depth) depends on the weight of the dissolved copper and the surface.
It is a value converted from the product and the specific gravity. Next, the set shown in Table 1
Aqueous solution is prepared and the layer is etched in this solution.
After immersing the plate at 25 ° C. for 10 seconds, the plate was washed with water and dried.
Next, a water-soluble preflux containing an azole compound
(Mec Seal CL-5824 manufactured by Mec Co., Ltd.)
After immersion in water at 25 ° C for 60 seconds, wash and dry
An azole compound film was formed on the surface.
【００２５】（アゾール化合物の付着量の測定）下記紫
外線吸収スペクトル法による吸光度を測定し、これをア
ゾール化合物の付着量とした。結果を表１に示す。紫外
線吸収スペクトル法によるアゾール化合物の付着量の測
定：特定面積（３２ｃｍ2）の銅表面に付着したアゾー
ル化合物を３５％塩酸／メタノール（試薬１級）＝０．
５／９９．５（重量比）の溶液に溶解させ、これを光路
幅１０ｍｍの石英セルに入れて波長２７７ｎｍ付近の紫
外線の吸光度を測定する。吸光度はアゾール化合物の溶
解量、すなわちアゾール化合物の付着量に比例する。(Measurement of Amount of Azole Compound Attached) Absorbance was measured by the following ultraviolet absorption spectrum method, and this was defined as the amount of the azole compound attached. Table 1 shows the results. Measurement of Amount of Azole Compound Attached by Ultraviolet Absorption Spectroscopy: An azole compound attached to a copper surface of a specific area (32 cm 2 ) was treated with 35% hydrochloric acid / methanol (reagent first grade) = 0.
The solution is dissolved in a 5 / 99.5 (weight ratio) solution, placed in a quartz cell having an optical path width of 10 mm, and the absorbance of ultraviolet light having a wavelength of about 277 nm is measured. The absorbance is proportional to the dissolved amount of the azole compound, that is, the amount of the adhered azole compound.
【００２６】（銅表面の保護性能）前記アゾール化合物
の被膜が形成された積層板を、４０℃、湿度９５％の恒
温恒湿槽内に１６８時間保存し、銅表面の変色を観察し
た。加湿前の銅表面は光沢のあるピンクである。結果を
表１に示す。(Protection Performance of Copper Surface) The laminate on which the coating of the azole compound was formed was stored in a constant temperature / humidity bath at 40 ° C. and 95% humidity for 168 hours, and discoloration of the copper surface was observed. The copper surface before humidification is shiny pink. Table 1 shows the results.
【００２７】[0027]
【表１】 [Table 1]
【００２８】表１に示されるように、本発明の表面処理
をすることにより、未処理の場合（比較例１）に比べて
約２．３〜３．５倍のアゾール化合物が付着していた。
また、加湿後の変色もみられなかった。As shown in Table 1, the surface treatment of the present invention resulted in about 2.3 to 3.5 times the amount of the azole compound adhered to the untreated (Comparative Example 1). .
No discoloration after humidification was observed.
【００２９】[0029]
【発明の効果】本発明の表面処理剤を銅または銅合金の
表面に接触させることにより、銅表面の防錆被膜である
アゾール化合物の付着量を増加させ、かつ安定させるこ
とができる。By bringing the surface treating agent of the present invention into contact with the surface of copper or a copper alloy, it is possible to increase and stabilize the amount of the azole compound which is a rust preventive film on the copper surface.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 矢熊 紀子 兵庫県尼崎市東初島町１番地 メック株式 会社内 Ｆターム(参考） 4K026 AA06 BA08 BB08 BB10 CA16 CA18 CA32 CA33 CA34 CA36 CA37 DA03 EB05 5E319 CD00 GG20 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Noriko Yakuma 1 Higashi-Hatsushima-cho, Amagasaki-shi, Hyogo FEC term (reference) 4K026 AA06 BA08 BB08 BB10 CA16 CA18 CA32 CA33 CA34 CA36 CA37 DA03 EB05 5E319 CD00 GG20
Claims (3)
％含有する水溶液からなる銅または銅合金の表面処理
剤。1. A copper or copper alloy surface treating agent comprising an aqueous solution containing 0.005 to 15% by weight of a copper (II) compound.
物を０．００５〜１５重量％含有する水溶液と接触さた
のち、水溶性プリフラックスで処理することを特徴とす
る銅または銅合金の表面処理法。2. The method according to claim 1, wherein the surface of the copper or copper alloy is brought into contact with an aqueous solution containing 0.005 to 15% by weight of a copper (II) compound and then treated with a water-soluble preflux. Alloy surface treatment method.
ンの表面を、銅（II）化合物を０．００５〜１５重量％
含有する水溶液と接触さたのち、水溶性プリフラックス
で処理することを特徴とするプリント配線板の製造法。3. A copper (II) compound containing 0.005 to 15% by weight of the surface of the outer circuit pattern made of copper or copper alloy.
A method for producing a printed wiring board, comprising contacting with a contained aqueous solution and treating with a water-soluble preflux.
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| JP2001182155A JP4065110B2 (en) | 2001-06-15 | 2001-06-15 | Copper or copper alloy surface treatment method and printed wiring board manufacturing method |
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| JP2001182155A JP4065110B2 (en) | 2001-06-15 | 2001-06-15 | Copper or copper alloy surface treatment method and printed wiring board manufacturing method |
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| JP2002371370A true JP2002371370A (en) | 2002-12-26 |
| JP2002371370A5 JP2002371370A5 (en) | 2006-09-28 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005349439A (en) * | 2004-06-10 | 2005-12-22 | Shikoku Chem Corp | Surface treating agent for copper or copper alloy and soldering method |
| JP2006080473A (en) * | 2004-08-10 | 2006-03-23 | Fujitsu Ltd | Circuit board and process liquid for closely adhered layer |
| JP2009097034A (en) * | 2007-10-16 | 2009-05-07 | Hitachi Chem Co Ltd | Copper surface treatment method |
-
2001
- 2001-06-15 JP JP2001182155A patent/JP4065110B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005349439A (en) * | 2004-06-10 | 2005-12-22 | Shikoku Chem Corp | Surface treating agent for copper or copper alloy and soldering method |
| JP4546163B2 (en) * | 2004-06-10 | 2010-09-15 | 四国化成工業株式会社 | Copper or copper alloy surface treatment agent and soldering method |
| JP2006080473A (en) * | 2004-08-10 | 2006-03-23 | Fujitsu Ltd | Circuit board and process liquid for closely adhered layer |
| JP2009097034A (en) * | 2007-10-16 | 2009-05-07 | Hitachi Chem Co Ltd | Copper surface treatment method |
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| Publication number | Publication date |
|---|---|
| JP4065110B2 (en) | 2008-03-19 |
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