JP2000282033A5 - - Google Patents
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- Publication number
- JP2000282033A5 JP2000282033A5 JP1999342802A JP34280299A JP2000282033A5 JP 2000282033 A5 JP2000282033 A5 JP 2000282033A5 JP 1999342802 A JP1999342802 A JP 1999342802A JP 34280299 A JP34280299 A JP 34280299A JP 2000282033 A5 JP2000282033 A5 JP 2000282033A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- metal layer
- metal surface
- treating agent
- aqueous solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 description 28
- 239000003795 chemical substances by application Substances 0.000 description 10
- 239000007864 aqueous solution Substances 0.000 description 7
- -1 tetrazole compound Chemical class 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- 239000012756 surface treatment agent Substances 0.000 description 5
- UGUHFDPGDQDVGX-UHFFFAOYSA-N 1,2,3-thiadiazole Chemical compound C1=CSN=N1 UGUHFDPGDQDVGX-UHFFFAOYSA-N 0.000 description 4
- KJUGUADJHNHALS-UHFFFAOYSA-N 1H-tetrazole Substances C=1N=NNN=1 KJUGUADJHNHALS-UHFFFAOYSA-N 0.000 description 2
- JAAIPIWKKXCNOC-UHFFFAOYSA-N 1h-tetrazol-1-ium-5-thiolate Chemical compound SC1=NN=NN1 JAAIPIWKKXCNOC-UHFFFAOYSA-N 0.000 description 2
- VLLMWSRANPNYQX-UHFFFAOYSA-N thiadiazole Chemical compound C1=CSN=N1.C1=CSN=N1 VLLMWSRANPNYQX-UHFFFAOYSA-N 0.000 description 2
- 150000007514 bases Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34280299A JP2000282033A (ja) | 1999-01-25 | 1999-12-02 | 金属表面処理剤及び金属層の表面処理方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11-15134 | 1999-01-25 | ||
| JP1513499 | 1999-01-25 | ||
| JP34280299A JP2000282033A (ja) | 1999-01-25 | 1999-12-02 | 金属表面処理剤及び金属層の表面処理方法 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007237140A Division JP2008045215A (ja) | 1999-01-25 | 2007-09-12 | 金属表面処理剤及び金属層の表面処理方法 |
| JP2007237141A Division JP2008063662A (ja) | 1999-01-25 | 2007-09-12 | 金属表面処理剤及び金属層の表面処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000282033A JP2000282033A (ja) | 2000-10-10 |
| JP2000282033A5 true JP2000282033A5 (enExample) | 2008-01-17 |
Family
ID=26351234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34280299A Pending JP2000282033A (ja) | 1999-01-25 | 1999-12-02 | 金属表面処理剤及び金属層の表面処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000282033A (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4489409B2 (ja) * | 2003-11-10 | 2010-06-23 | 大日本印刷株式会社 | Ｉｃカード用ｉｃモジュールの形成方法とｉｃカード用ｉｃモジュール |
| CN101498002B (zh) * | 2004-02-05 | 2011-06-22 | 日矿金属株式会社 | 金属的表面处理方法、表面处理过的金属表面以及印制布线基板 |
| JP4706690B2 (ja) | 2007-11-05 | 2011-06-22 | パナソニック電工株式会社 | 回路基板及びその製造方法 |
| TWI453301B (zh) * | 2007-11-08 | 2014-09-21 | Enthone | 浸鍍銀塗層上的自組分子 |
| DE102007059726B4 (de) * | 2007-12-12 | 2010-01-07 | Excor Korrosionsforschung Gmbh | Dampfphasen-Korrosionsinhibitoren, Verfahren zu deren Herstellung und deren Verwendung |
| JP5463539B2 (ja) * | 2008-10-31 | 2014-04-09 | 国立大学法人東京工業大学 | 導電性の液体中における電極の電流測定方法及び電流測定装置 |
| JP5464284B1 (ja) | 2013-01-10 | 2014-04-09 | 株式会社オートネットワーク技術研究所 | コネクタ端子及びコネクタ端子の製造方法 |
| JP6248265B2 (ja) * | 2014-04-15 | 2017-12-20 | 株式会社Ｊｏｌｅｄ | 薄膜トランジスタ基板の製造方法 |
| JP6149811B2 (ja) * | 2014-06-27 | 2017-06-21 | 住友金属鉱山株式会社 | Ｌｅｄパッケージ用金属部材の製造方法 |
| JP7608918B2 (ja) * | 2021-03-24 | 2025-01-07 | 株式会社オートネットワーク技術研究所 | 電気接続部材用材料および電気接続部材 |
| CN113106460B (zh) * | 2021-04-15 | 2022-09-20 | 深圳市钝化技术有限公司 | 一种耐高温可导电的铜合金保护剂及制备方法和铜合金钝化方法 |
-
1999
- 1999-12-02 JP JP34280299A patent/JP2000282033A/ja active Pending
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