JP2002322364A5 - - Google Patents
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- Publication number
- JP2002322364A5 JP2002322364A5 JP2001128722A JP2001128722A JP2002322364A5 JP 2002322364 A5 JP2002322364 A5 JP 2002322364A5 JP 2001128722 A JP2001128722 A JP 2001128722A JP 2001128722 A JP2001128722 A JP 2001128722A JP 2002322364 A5 JP2002322364 A5 JP 2002322364A5
- Authority
- JP
- Japan
- Prior art keywords
- mol
- silicone gel
- weight
- units
- sio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001296 polysiloxane Polymers 0.000 description 12
- 239000000203 mixture Substances 0.000 description 10
- 125000003342 alkenyl group Chemical group 0.000 description 6
- 125000001183 hydrocarbyl group Chemical group 0.000 description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 150000003961 organosilicon compounds Chemical class 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- -1 alkyl silicate Chemical compound 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001128722A JP4875251B2 (ja) | 2001-04-26 | 2001-04-26 | シリコーンゲル組成物 |
| TW091106774A TW593546B (en) | 2001-04-26 | 2002-04-03 | Silicone gel composition |
| KR1020037013990A KR100863148B1 (ko) | 2001-04-26 | 2002-04-15 | 부가 경화성 실리콘 겔 조성물 |
| DE60223009T DE60223009T2 (de) | 2001-04-26 | 2002-04-15 | Additionsvernetzbare silikonzusammensetzung gelartiger konsistenz |
| AT02718590T ATE376032T1 (de) | 2001-04-26 | 2002-04-15 | Additionsvernetzbare silikonzusammensetzung gelartiger konsistenz |
| US10/476,055 US6881807B2 (en) | 2001-04-26 | 2002-04-15 | Addition-curable silicone gel composition |
| EP02718590A EP1381650B1 (en) | 2001-04-26 | 2002-04-15 | Addition-curable silicone gel composition |
| PCT/JP2002/003744 WO2002088252A1 (en) | 2001-04-26 | 2002-04-15 | Addition-curable silicone gel composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001128722A JP4875251B2 (ja) | 2001-04-26 | 2001-04-26 | シリコーンゲル組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002322364A JP2002322364A (ja) | 2002-11-08 |
| JP2002322364A5 true JP2002322364A5 (enExample) | 2008-05-01 |
| JP4875251B2 JP4875251B2 (ja) | 2012-02-15 |
Family
ID=18977379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001128722A Expired - Lifetime JP4875251B2 (ja) | 2001-04-26 | 2001-04-26 | シリコーンゲル組成物 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6881807B2 (enExample) |
| EP (1) | EP1381650B1 (enExample) |
| JP (1) | JP4875251B2 (enExample) |
| KR (1) | KR100863148B1 (enExample) |
| AT (1) | ATE376032T1 (enExample) |
| DE (1) | DE60223009T2 (enExample) |
| TW (1) | TW593546B (enExample) |
| WO (1) | WO2002088252A1 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0212324D0 (en) * | 2002-05-29 | 2002-07-10 | Dow Corning | Silicon composition |
| JP4520137B2 (ja) * | 2002-12-10 | 2010-08-04 | 信越化学工業株式会社 | 一液型オルガノポリシロキサンゲル組成物 |
| JP4703374B2 (ja) * | 2005-11-04 | 2011-06-15 | 信越化学工業株式会社 | シリコーンゲル組成物 |
| US7767754B2 (en) * | 2005-11-08 | 2010-08-03 | Momentive Performance Materials Inc. | Silicone composition and process of making same |
| US7479522B2 (en) * | 2005-11-09 | 2009-01-20 | Momentive Performance Materials Inc. | Silicone elastomer composition |
| DE102006022880B4 (de) * | 2006-05-15 | 2010-09-30 | Kettenbach Gmbh & Co. Kg | Mehrstufiges Verfahren zur Sterilisation von aushärtbaren, medizinischen Mehrkomponenten-Abformmaterialien |
| JP5148088B2 (ja) * | 2006-08-25 | 2013-02-20 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
| JP2010120979A (ja) * | 2008-11-17 | 2010-06-03 | Taika:Kk | 熱伝導性シリコーンゲル硬化物 |
| JP2010144130A (ja) * | 2008-12-22 | 2010-07-01 | Taika:Kk | 硬化性オルガノポリシロキサン組成物 |
| WO2012137977A1 (ja) * | 2011-04-08 | 2012-10-11 | 東レ・ダウコーニング株式会社 | 被膜形成用組成物 |
| JP5477365B2 (ja) * | 2011-12-02 | 2014-04-23 | 日立金属株式会社 | 光コネクタ |
| CN104937035B (zh) | 2012-12-12 | 2018-11-16 | 3M创新有限公司 | 可室温固化的硅氧烷基凝胶 |
| DE102013013984A1 (de) * | 2013-08-23 | 2015-02-26 | Elantas Gmbh | Silikongel mit verringerter Schadgasemission |
| KR101772859B1 (ko) | 2013-08-28 | 2017-08-30 | 다우 코닝 도레이 캄파니 리미티드 | 경화성 실리콘 조성물, 이의 경화물, 및 광반도체 장치 |
| WO2015034029A1 (en) | 2013-09-03 | 2015-03-12 | Dow Corning Toray Co., Ltd. | Silicone gel composition and use thereof |
| EP3059286B1 (en) | 2013-10-17 | 2020-08-26 | Shin-Etsu Chemical Co., Ltd. | Silicone gel composition, and silicone gel cured product |
| CN106103594B (zh) * | 2014-01-27 | 2019-06-28 | 陶氏东丽株式会社 | 有机硅凝胶组合物 |
| US10461045B2 (en) * | 2015-11-27 | 2019-10-29 | Mitsubishi Electric Corporation | Power semiconductor device |
| CN107502279B (zh) * | 2017-08-11 | 2020-11-06 | 汕头市骏码凯撒有限公司 | 一种耐高温触变性led封装胶及其制备方法 |
| JP7074093B2 (ja) * | 2019-02-07 | 2022-05-24 | 信越化学工業株式会社 | 剥離性シリコーンゲル組成物 |
| CN114651032A (zh) * | 2019-11-08 | 2022-06-21 | 汉高股份有限及两合公司 | 耐高温双组分有机硅粘合剂 |
| CN115885015B (zh) | 2020-07-13 | 2024-04-05 | 陶氏东丽株式会社 | 有机硅凝胶组合物、其固化物及其用途 |
| CN115926742A (zh) * | 2022-12-02 | 2023-04-07 | 江苏中恒电子新材料有限公司 | 一种用于仪器仪表防水的有机硅凝胶及其制备方法 |
| CN120153034A (zh) | 2022-12-06 | 2025-06-13 | 陶氏东丽株式会社 | 有机聚硅氧烷组合物、其固化物、电子部件密封剂、电子部件以及半导体芯片的保护方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4743474A (en) * | 1983-08-05 | 1988-05-10 | Dow Corning Corporation | Coating process and moisture-curable organopolysiloxane compositions therefor |
| JP2522721B2 (ja) * | 1990-08-01 | 1996-08-07 | 信越化学工業株式会社 | オルガノポリシロキサン組成物及びそのゲル硬化物 |
| US5432280A (en) * | 1992-07-03 | 1995-07-11 | Shin-Etsu Chemical Co., Ltd. | Gel-forming silicone composition |
| JP2711621B2 (ja) * | 1992-07-16 | 1998-02-10 | 信越化学工業株式会社 | 耐熱性シリコーンゴム組成物 |
| JPH06145525A (ja) * | 1992-11-05 | 1994-05-24 | Toray Dow Corning Silicone Co Ltd | 硬化性オルガノポリシロキサン組成物 |
| JP2739407B2 (ja) * | 1993-02-09 | 1998-04-15 | 信越化学工業株式会社 | 低弾性率シリコーンゲル組成物及びそのゲル状硬化物 |
| EP0661335A1 (en) | 1993-12-27 | 1995-07-05 | Dow Corning Corporation | Organosiloxane compositions capable of curing against acid-containing solder fluxes |
| JP3028744B2 (ja) * | 1994-02-28 | 2000-04-04 | 信越化学工業株式会社 | シリコーンコーティング加工基材及びエアバッグ基材 |
| JPH0853622A (ja) * | 1994-06-07 | 1996-02-27 | Shin Etsu Chem Co Ltd | シリコーンゲル組成物 |
| JP3277749B2 (ja) * | 1995-04-03 | 2002-04-22 | 信越化学工業株式会社 | シリコーンゲル組成物及びポッティング材 |
| JP3576639B2 (ja) * | 1995-05-29 | 2004-10-13 | 東レ・ダウコーニング・シリコーン株式会社 | 熱伝導性シリコーンゴム組成物 |
| JP3638746B2 (ja) * | 1997-01-30 | 2005-04-13 | 東レ・ダウコーニング・シリコーン株式会社 | 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル |
| JP3718350B2 (ja) * | 1998-08-10 | 2005-11-24 | 富士高分子工業株式会社 | 熱伝導性・電気絶縁性シリコーンゴム組成物およびシリコーンゲル組成物 |
| JP3700908B2 (ja) * | 1998-09-25 | 2005-09-28 | 東レ・ダウコーニング株式会社 | シリコーン系接着性シート |
-
2001
- 2001-04-26 JP JP2001128722A patent/JP4875251B2/ja not_active Expired - Lifetime
-
2002
- 2002-04-03 TW TW091106774A patent/TW593546B/zh active
- 2002-04-15 US US10/476,055 patent/US6881807B2/en not_active Expired - Lifetime
- 2002-04-15 KR KR1020037013990A patent/KR100863148B1/ko not_active Expired - Lifetime
- 2002-04-15 EP EP02718590A patent/EP1381650B1/en not_active Expired - Lifetime
- 2002-04-15 DE DE60223009T patent/DE60223009T2/de not_active Expired - Lifetime
- 2002-04-15 AT AT02718590T patent/ATE376032T1/de not_active IP Right Cessation
- 2002-04-15 WO PCT/JP2002/003744 patent/WO2002088252A1/en not_active Ceased
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