TW593546B - Silicone gel composition - Google Patents

Silicone gel composition Download PDF

Info

Publication number
TW593546B
TW593546B TW091106774A TW91106774A TW593546B TW 593546 B TW593546 B TW 593546B TW 091106774 A TW091106774 A TW 091106774A TW 91106774 A TW91106774 A TW 91106774A TW 593546 B TW593546 B TW 593546B
Authority
TW
Taiwan
Prior art keywords
component
gel composition
units
silicone gel
groups
Prior art date
Application number
TW091106774A
Other languages
English (en)
Chinese (zh)
Inventor
Masayoshi Terada
Hiroji Enami
Original Assignee
Dow Corning Toray Silicone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Silicone filed Critical Dow Corning Toray Silicone
Application granted granted Critical
Publication of TW593546B publication Critical patent/TW593546B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cosmetics (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
TW091106774A 2001-04-26 2002-04-03 Silicone gel composition TW593546B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001128722A JP4875251B2 (ja) 2001-04-26 2001-04-26 シリコーンゲル組成物

Publications (1)

Publication Number Publication Date
TW593546B true TW593546B (en) 2004-06-21

Family

ID=18977379

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091106774A TW593546B (en) 2001-04-26 2002-04-03 Silicone gel composition

Country Status (8)

Country Link
US (1) US6881807B2 (enExample)
EP (1) EP1381650B1 (enExample)
JP (1) JP4875251B2 (enExample)
KR (1) KR100863148B1 (enExample)
AT (1) ATE376032T1 (enExample)
DE (1) DE60223009T2 (enExample)
TW (1) TW593546B (enExample)
WO (1) WO2002088252A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103443223A (zh) * 2011-04-08 2013-12-11 道康宁东丽株式会社 被膜形成用组合物
TWI666267B (zh) * 2014-01-27 2019-07-21 日商道康寧東麗股份有限公司 聚矽氧凝膠組合物

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0212324D0 (en) * 2002-05-29 2002-07-10 Dow Corning Silicon composition
JP4520137B2 (ja) * 2002-12-10 2010-08-04 信越化学工業株式会社 一液型オルガノポリシロキサンゲル組成物
JP4703374B2 (ja) * 2005-11-04 2011-06-15 信越化学工業株式会社 シリコーンゲル組成物
US7767754B2 (en) * 2005-11-08 2010-08-03 Momentive Performance Materials Inc. Silicone composition and process of making same
US7479522B2 (en) * 2005-11-09 2009-01-20 Momentive Performance Materials Inc. Silicone elastomer composition
DE102006022880B4 (de) 2006-05-15 2010-09-30 Kettenbach Gmbh & Co. Kg Mehrstufiges Verfahren zur Sterilisation von aushärtbaren, medizinischen Mehrkomponenten-Abformmaterialien
JP5148088B2 (ja) * 2006-08-25 2013-02-20 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP2010120979A (ja) * 2008-11-17 2010-06-03 Taika:Kk 熱伝導性シリコーンゲル硬化物
JP2010144130A (ja) * 2008-12-22 2010-07-01 Taika:Kk 硬化性オルガノポリシロキサン組成物
JP5477365B2 (ja) * 2011-12-02 2014-04-23 日立金属株式会社 光コネクタ
CN104937035B (zh) 2012-12-12 2018-11-16 3M创新有限公司 可室温固化的硅氧烷基凝胶
DE102013013984A1 (de) * 2013-08-23 2015-02-26 Elantas Gmbh Silikongel mit verringerter Schadgasemission
JP6473440B2 (ja) * 2013-08-28 2019-02-20 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
WO2015034029A1 (en) 2013-09-03 2015-03-12 Dow Corning Toray Co., Ltd. Silicone gel composition and use thereof
JP6023894B2 (ja) 2013-10-17 2016-11-09 信越化学工業株式会社 シリコーンゲル組成物及びシリコーンゲル硬化物
US10461045B2 (en) * 2015-11-27 2019-10-29 Mitsubishi Electric Corporation Power semiconductor device
CN107502279B (zh) * 2017-08-11 2020-11-06 汕头市骏码凯撒有限公司 一种耐高温触变性led封装胶及其制备方法
JP7074093B2 (ja) * 2019-02-07 2022-05-24 信越化学工業株式会社 剥離性シリコーンゲル組成物
EP4055085A1 (en) * 2019-11-08 2022-09-14 Henkel AG & Co. KGaA High temperature resistant dual component silicone adhesive
EP4181183B1 (en) 2020-07-13 2025-12-03 Dow Toray Co., Ltd. Silicone gel composition, cured product thereof, and use therefor
CN115926742A (zh) * 2022-12-02 2023-04-07 江苏中恒电子新材料有限公司 一种用于仪器仪表防水的有机硅凝胶及其制备方法
WO2024121942A1 (ja) 2022-12-06 2024-06-13 ダウ・東レ株式会社 オルガノポリシロキサン組成物、その硬化物、電子部品封止剤、電子部品、および半導体チップの保護方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4743474A (en) 1983-08-05 1988-05-10 Dow Corning Corporation Coating process and moisture-curable organopolysiloxane compositions therefor
JP2522721B2 (ja) 1990-08-01 1996-08-07 信越化学工業株式会社 オルガノポリシロキサン組成物及びそのゲル硬化物
US5432280A (en) 1992-07-03 1995-07-11 Shin-Etsu Chemical Co., Ltd. Gel-forming silicone composition
JP2711621B2 (ja) * 1992-07-16 1998-02-10 信越化学工業株式会社 耐熱性シリコーンゴム組成物
JPH06145525A (ja) * 1992-11-05 1994-05-24 Toray Dow Corning Silicone Co Ltd 硬化性オルガノポリシロキサン組成物
JP2739407B2 (ja) * 1993-02-09 1998-04-15 信越化学工業株式会社 低弾性率シリコーンゲル組成物及びそのゲル状硬化物
EP0661335A1 (en) 1993-12-27 1995-07-05 Dow Corning Corporation Organosiloxane compositions capable of curing against acid-containing solder fluxes
JP3028744B2 (ja) * 1994-02-28 2000-04-04 信越化学工業株式会社 シリコーンコーティング加工基材及びエアバッグ基材
JPH0853622A (ja) * 1994-06-07 1996-02-27 Shin Etsu Chem Co Ltd シリコーンゲル組成物
JP3277749B2 (ja) * 1995-04-03 2002-04-22 信越化学工業株式会社 シリコーンゲル組成物及びポッティング材
JP3576639B2 (ja) * 1995-05-29 2004-10-13 東レ・ダウコーニング・シリコーン株式会社 熱伝導性シリコーンゴム組成物
JP3638746B2 (ja) * 1997-01-30 2005-04-13 東レ・ダウコーニング・シリコーン株式会社 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
JP3718350B2 (ja) * 1998-08-10 2005-11-24 富士高分子工業株式会社 熱伝導性・電気絶縁性シリコーンゴム組成物およびシリコーンゲル組成物
JP3700908B2 (ja) * 1998-09-25 2005-09-28 東レ・ダウコーニング株式会社 シリコーン系接着性シート

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103443223A (zh) * 2011-04-08 2013-12-11 道康宁东丽株式会社 被膜形成用组合物
TWI666267B (zh) * 2014-01-27 2019-07-21 日商道康寧東麗股份有限公司 聚矽氧凝膠組合物

Also Published As

Publication number Publication date
JP2002322364A (ja) 2002-11-08
EP1381650B1 (en) 2007-10-17
DE60223009T2 (de) 2008-07-31
DE60223009D1 (de) 2007-11-29
KR20040015156A (ko) 2004-02-18
ATE376032T1 (de) 2007-11-15
US20040147702A1 (en) 2004-07-29
EP1381650A1 (en) 2004-01-21
JP4875251B2 (ja) 2012-02-15
US6881807B2 (en) 2005-04-19
WO2002088252A1 (en) 2002-11-07
KR100863148B1 (ko) 2008-10-13

Similar Documents

Publication Publication Date Title
TW593546B (en) Silicone gel composition
CN101981129B (zh) 可固化的有机基聚硅氧烷组合物及其固化产物
JP5247979B2 (ja) 透明な硬化物を与えるポリオルガノシロキサン組成物
JP5136963B2 (ja) 硬化性シリコーンゴム組成物及び半導体装置
CN106068307B (zh) 室温固化性聚有机硅氧烷组合物和电气·电子设备
EP2892953B1 (en) Curable silicone composition and cured product thereof
CN101395212A (zh) 可固化的有机硅树脂组合物及其固化体
JP5248032B2 (ja) ケイ素含有化合物、硬化性組成物及び硬化物
KR950009160B1 (ko) 실리콘고무 조성물
JP7554845B2 (ja) 増加したチキソトロピー指数を有する硬化型熱伝導性ポリシロキサン組成物
JP4644129B2 (ja) 硬化性シリコーンゴム組成物及びその硬化物
JPH02218755A (ja) 硬化性オルガノポリシロキサン組成物
TWI883002B (zh) 黏晶用聚矽氧組成物、其硬化物及光半導體裝置
CN103571209A (zh) 加成固化型硅酮组合物、及半导体装置
TWI714561B (zh) 有機聚矽氧烷、其製造方法及可固化聚矽氧組合物
WO2015136820A1 (ja) 硬化性樹脂組成物
TWI857062B (zh) 導熱聚矽氧組成物
JPH11222555A (ja) 光半導体絶縁被覆保護剤
JP3704286B2 (ja) 酸化チタン充填付加反応硬化型シリコーンゴム組成物及びその硬化物
CN113015775A (zh) 粘接性聚有机硅氧烷组合物
KR100599365B1 (ko) 산화티탄 충전 부가반응 경화형 실리콘 고무 조성물 및 그경화물
JP2003165906A (ja) シリコーンゲル組成物およびシリコーンゲル
CN112011187A (zh) 加成固化型有机硅树脂组合物、该组合物的制备方法及光学半导体装置
TWI801654B (zh) 加成硬化型聚矽氧組成物及半導體裝置
CN115315487A (zh) 固化性液态有机硅组合物、其固化物、包含该组合物的光学填充剂、以及包含由该固化物形成的层的显示装置