ATE376032T1 - Additionsvernetzbare silikonzusammensetzung gelartiger konsistenz - Google Patents

Additionsvernetzbare silikonzusammensetzung gelartiger konsistenz

Info

Publication number
ATE376032T1
ATE376032T1 AT02718590T AT02718590T ATE376032T1 AT E376032 T1 ATE376032 T1 AT E376032T1 AT 02718590 T AT02718590 T AT 02718590T AT 02718590 T AT02718590 T AT 02718590T AT E376032 T1 ATE376032 T1 AT E376032T1
Authority
AT
Austria
Prior art keywords
sub
units
sup
sio
consistency
Prior art date
Application number
AT02718590T
Other languages
English (en)
Inventor
Masayoshi Terada
Hiroji Enami
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Application granted granted Critical
Publication of ATE376032T1 publication Critical patent/ATE376032T1/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0091Complexes with metal-heteroatom-bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/541Silicon-containing compounds containing oxygen
    • C08K5/5415Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/56Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70Siloxanes defined by use of the MDTQ nomenclature
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cosmetics (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
AT02718590T 2001-04-26 2002-04-15 Additionsvernetzbare silikonzusammensetzung gelartiger konsistenz ATE376032T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001128722A JP4875251B2 (ja) 2001-04-26 2001-04-26 シリコーンゲル組成物

Publications (1)

Publication Number Publication Date
ATE376032T1 true ATE376032T1 (de) 2007-11-15

Family

ID=18977379

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02718590T ATE376032T1 (de) 2001-04-26 2002-04-15 Additionsvernetzbare silikonzusammensetzung gelartiger konsistenz

Country Status (8)

Country Link
US (1) US6881807B2 (de)
EP (1) EP1381650B1 (de)
JP (1) JP4875251B2 (de)
KR (1) KR100863148B1 (de)
AT (1) ATE376032T1 (de)
DE (1) DE60223009T2 (de)
TW (1) TW593546B (de)
WO (1) WO2002088252A1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0212324D0 (en) * 2002-05-29 2002-07-10 Dow Corning Silicon composition
JP4520137B2 (ja) * 2002-12-10 2010-08-04 信越化学工業株式会社 一液型オルガノポリシロキサンゲル組成物
JP4703374B2 (ja) * 2005-11-04 2011-06-15 信越化学工業株式会社 シリコーンゲル組成物
US7767754B2 (en) * 2005-11-08 2010-08-03 Momentive Performance Materials Inc. Silicone composition and process of making same
US7479522B2 (en) * 2005-11-09 2009-01-20 Momentive Performance Materials Inc. Silicone elastomer composition
DE102006022880B4 (de) 2006-05-15 2010-09-30 Kettenbach Gmbh & Co. Kg Mehrstufiges Verfahren zur Sterilisation von aushärtbaren, medizinischen Mehrkomponenten-Abformmaterialien
JP5148088B2 (ja) * 2006-08-25 2013-02-20 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP2010120979A (ja) * 2008-11-17 2010-06-03 Taika:Kk 熱伝導性シリコーンゲル硬化物
JP2010144130A (ja) * 2008-12-22 2010-07-01 Taika:Kk 硬化性オルガノポリシロキサン組成物
US8925626B2 (en) * 2011-04-08 2015-01-06 Dow Corning Toray Co., Ltd. Composition for forming film
JP5477365B2 (ja) * 2011-12-02 2014-04-23 日立金属株式会社 光コネクタ
CN104937035B (zh) 2012-12-12 2018-11-16 3M创新有限公司 可室温固化的硅氧烷基凝胶
DE102013013984A1 (de) * 2013-08-23 2015-02-26 Elantas Gmbh Silikongel mit verringerter Schadgasemission
JP6473440B2 (ja) * 2013-08-28 2019-02-20 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
WO2015034029A1 (en) 2013-09-03 2015-03-12 Dow Corning Toray Co., Ltd. Silicone gel composition and use thereof
JP6023894B2 (ja) 2013-10-17 2016-11-09 信越化学工業株式会社 シリコーンゲル組成物及びシリコーンゲル硬化物
US10155852B2 (en) 2014-01-27 2018-12-18 Dow Corning Toray Co., Ltd. Silicone gel composition
US10461045B2 (en) * 2015-11-27 2019-10-29 Mitsubishi Electric Corporation Power semiconductor device
CN107502279B (zh) * 2017-08-11 2020-11-06 汕头市骏码凯撒有限公司 一种耐高温触变性led封装胶及其制备方法
JP7074093B2 (ja) * 2019-02-07 2022-05-24 信越化学工業株式会社 剥離性シリコーンゲル組成物
EP4055085A1 (de) * 2019-11-08 2022-09-14 Henkel AG & Co. KGaA Hochtemperaturbeständiger zweikomponentiger silikonklebstoff
EP4181183B1 (de) 2020-07-13 2025-12-03 Dow Toray Co., Ltd. Silikongelzusammensetzung, gehärtetes produkt daraus und verwendung davon
CN115926742A (zh) * 2022-12-02 2023-04-07 江苏中恒电子新材料有限公司 一种用于仪器仪表防水的有机硅凝胶及其制备方法
WO2024121942A1 (ja) 2022-12-06 2024-06-13 ダウ・東レ株式会社 オルガノポリシロキサン組成物、その硬化物、電子部品封止剤、電子部品、および半導体チップの保護方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4743474A (en) 1983-08-05 1988-05-10 Dow Corning Corporation Coating process and moisture-curable organopolysiloxane compositions therefor
JP2522721B2 (ja) 1990-08-01 1996-08-07 信越化学工業株式会社 オルガノポリシロキサン組成物及びそのゲル硬化物
US5432280A (en) 1992-07-03 1995-07-11 Shin-Etsu Chemical Co., Ltd. Gel-forming silicone composition
JP2711621B2 (ja) * 1992-07-16 1998-02-10 信越化学工業株式会社 耐熱性シリコーンゴム組成物
JPH06145525A (ja) * 1992-11-05 1994-05-24 Toray Dow Corning Silicone Co Ltd 硬化性オルガノポリシロキサン組成物
JP2739407B2 (ja) * 1993-02-09 1998-04-15 信越化学工業株式会社 低弾性率シリコーンゲル組成物及びそのゲル状硬化物
EP0661335A1 (de) 1993-12-27 1995-07-05 Dow Corning Corporation In Anwesenheit von Säure enthaltende Lötflussmittel Vernetzbare Organosiloxane Zusammensetzungen
JP3028744B2 (ja) * 1994-02-28 2000-04-04 信越化学工業株式会社 シリコーンコーティング加工基材及びエアバッグ基材
JPH0853622A (ja) * 1994-06-07 1996-02-27 Shin Etsu Chem Co Ltd シリコーンゲル組成物
JP3277749B2 (ja) * 1995-04-03 2002-04-22 信越化学工業株式会社 シリコーンゲル組成物及びポッティング材
JP3576639B2 (ja) * 1995-05-29 2004-10-13 東レ・ダウコーニング・シリコーン株式会社 熱伝導性シリコーンゴム組成物
JP3638746B2 (ja) * 1997-01-30 2005-04-13 東レ・ダウコーニング・シリコーン株式会社 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
JP3718350B2 (ja) * 1998-08-10 2005-11-24 富士高分子工業株式会社 熱伝導性・電気絶縁性シリコーンゴム組成物およびシリコーンゲル組成物
JP3700908B2 (ja) * 1998-09-25 2005-09-28 東レ・ダウコーニング株式会社 シリコーン系接着性シート

Also Published As

Publication number Publication date
JP2002322364A (ja) 2002-11-08
EP1381650B1 (de) 2007-10-17
DE60223009T2 (de) 2008-07-31
TW593546B (en) 2004-06-21
DE60223009D1 (de) 2007-11-29
KR20040015156A (ko) 2004-02-18
US20040147702A1 (en) 2004-07-29
EP1381650A1 (de) 2004-01-21
JP4875251B2 (ja) 2012-02-15
US6881807B2 (en) 2005-04-19
WO2002088252A1 (en) 2002-11-07
KR100863148B1 (ko) 2008-10-13

Similar Documents

Publication Publication Date Title
ATE376032T1 (de) Additionsvernetzbare silikonzusammensetzung gelartiger konsistenz
KR840000609A (ko) 저온성 실리콘 겔
CA1080388A (en) Self-adhering silicone compositions and preparations thereof
DE602004009791D1 (de) Siloxan-harz basierte anti-reflektionsbeschichtung mit hoher nassätzgeschwindigkeit
MY134509A (en) Curable organopolysiloxane composition and a semiconductor device made with the use of this composition
TW200513497A (en) Silicone composition which can be crosslinked to give an adhesive gel
TW200728404A (en) Thermally stable transparent silicone resin compositions and methods for their preparation and use
ATE463537T1 (de) Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung
EP0955328A3 (de) Vakuum verteilbare Siloxanzusammensetzungen
KR960031509A (ko) 열경화성 실리콘 수지
KR930016518A (ko) 조절 제거형 실리콘 감압 접착제
JP4644129B2 (ja) 硬化性シリコーンゴム組成物及びその硬化物
BR0112421A (pt) Polìmero de poliuretano sililado, e, método de fabricação do mesmo
KR960041281A (ko) 열전도성 실리콘 고무 조성물
TW200823266A (en) Curable silicone rubber composition and cured products thereof
CA2477970A1 (en) High fracture toughness hydrosilyation cured silicone resin
KR20160130273A (ko) 단결정 알루미나 충전 다이 부착 페이스트
JPWO2018066572A1 (ja) 新規レジン−リニアオルガノポリシロキサンブロックコポリマー、その用途、およびその製造方法
EP0934981A3 (de) Additionshärbare Silikonmischungen
CN102234429B (zh) 有机硅树脂用组合物
KR880001768A (ko) 불소화된 열안정성 폴리오가노실록산 조성물
JP2005179681A (ja) 付加架橋性シリコーン樹脂組成物、これからなる成形体および前記組成物の使用
TW200510484A (en) Mold release agent composition for polyorganosiloxane adhesive and mold release plate using the composition
KR950025073A (ko) 열 안정성 실리콘 러버를 얻는 부가 가교 조성물
ATE342569T1 (de) Herstellung einer leitfähigen flüssigen silikongummizusammensetzung

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties