|
KR100455379B1
(ko)
*
|
2002-02-21 |
2004-11-06 |
삼성전자주식회사 |
플래시 메모리 장치의 제조방법
|
|
US6734055B1
(en)
*
|
2002-11-15 |
2004-05-11 |
Taiwan Semiconductor Manufactoring Company |
Multi-level (4 state/2-bit) stacked gate flash memory cell
|
|
KR100823694B1
(ko)
*
|
2002-11-21 |
2008-04-21 |
삼성전자주식회사 |
불휘발성 메모리 장치의 플로팅 게이트 구조물의 형성 방법
|
|
KR100481871B1
(ko)
*
|
2002-12-20 |
2005-04-11 |
삼성전자주식회사 |
플로팅 게이트를 갖는 비휘발성 기억 셀 및 그 형성방법
|
|
US6706599B1
(en)
*
|
2003-03-20 |
2004-03-16 |
Motorola, Inc. |
Multi-bit non-volatile memory device and method therefor
|
|
US7183163B2
(en)
*
|
2003-04-07 |
2007-02-27 |
Silicon Storage Technology, Inc. |
Method of manufacturing an isolation-less, contact-less array of bi-directional read/program non-volatile floating gate memory cells with independent controllable control gates
|
|
US7613041B2
(en)
*
|
2003-06-06 |
2009-11-03 |
Chih-Hsin Wang |
Methods for operating semiconductor device and semiconductor memory device
|
|
US7759719B2
(en)
*
|
2004-07-01 |
2010-07-20 |
Chih-Hsin Wang |
Electrically alterable memory cell
|
|
US7550800B2
(en)
*
|
2003-06-06 |
2009-06-23 |
Chih-Hsin Wang |
Method and apparatus transporting charges in semiconductor device and semiconductor memory device
|
|
US7105406B2
(en)
*
|
2003-06-20 |
2006-09-12 |
Sandisk Corporation |
Self aligned non-volatile memory cell and process for fabrication
|
|
US7009244B2
(en)
*
|
2003-07-02 |
2006-03-07 |
Integrated Memory Technologies, Inc. |
Scalable flash EEPROM memory cell with notched floating gate and graded source region
|
|
US6890821B2
(en)
*
|
2003-07-11 |
2005-05-10 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Method and system for forming source regions in memory devices
|
|
US6911704B2
(en)
*
|
2003-10-14 |
2005-06-28 |
Advanced Micro Devices, Inc. |
Memory cell array with staggered local inter-connect structure
|
|
US6960506B2
(en)
*
|
2003-11-13 |
2005-11-01 |
Macronix International Co., Ltd. |
Method of fabricating a memory device having a self-aligned contact
|
|
DE10356285A1
(de)
|
2003-11-28 |
2005-06-30 |
Infineon Technologies Ag |
Integrierter Halbleiterspeicher und Verfahren zum Herstellen eines integrierten Halbleiterspeichers
|
|
KR100526478B1
(ko)
*
|
2003-12-31 |
2005-11-08 |
동부아남반도체 주식회사 |
반도체 소자 및 그 제조방법
|
|
US7315056B2
(en)
*
|
2004-06-07 |
2008-01-01 |
Silicon Storage Technology, Inc. |
Semiconductor memory array of floating gate memory cells with program/erase and select gates
|
|
US20080203464A1
(en)
*
|
2004-07-01 |
2008-08-28 |
Chih-Hsin Wang |
Electrically alterable non-volatile memory and array
|
|
KR100591768B1
(ko)
*
|
2004-07-12 |
2006-06-26 |
삼성전자주식회사 |
메모리 소자들 및 그 형성 방법들
|
|
JP2006032950A
(ja)
*
|
2004-07-12 |
2006-02-02 |
Samsung Electronics Co Ltd |
メモリ素子及びその形成方法
|
|
KR100621553B1
(ko)
|
2004-09-22 |
2006-09-19 |
삼성전자주식회사 |
비휘발성 메모리 소자 및 그 제조방법
|
|
JP2006093707A
(ja)
*
|
2004-09-22 |
2006-04-06 |
Samsung Electronics Co Ltd |
半導体素子及びその製造方法
|
|
KR100598047B1
(ko)
*
|
2004-09-30 |
2006-07-07 |
삼성전자주식회사 |
비휘발성 메모리 소자 및 그 제조 방법
|
|
KR100645063B1
(ko)
*
|
2005-03-14 |
2006-11-10 |
삼성전자주식회사 |
비휘발성 기억장치 및 그 제조방법
|
|
US7411244B2
(en)
*
|
2005-06-28 |
2008-08-12 |
Chih-Hsin Wang |
Low power electrically alterable nonvolatile memory cells and arrays
|
|
US7265013B2
(en)
*
|
2005-09-19 |
2007-09-04 |
International Business Machines Corporation |
Sidewall image transfer (SIT) technologies
|
|
CN100446186C
(zh)
*
|
2006-10-09 |
2008-12-24 |
上海华虹Nec电子有限公司 |
用于分栅结构闪存的浮栅制作方法
|
|
US8138524B2
(en)
|
2006-11-01 |
2012-03-20 |
Silicon Storage Technology, Inc. |
Self-aligned method of forming a semiconductor memory array of floating memory cells with source side erase, and a memory array made thereby
|
|
US7641226B2
(en)
*
|
2006-11-01 |
2010-01-05 |
Autoliv Development Ab |
Side airbag module with an internal guide fin
|
|
US8072023B1
(en)
|
2007-11-12 |
2011-12-06 |
Marvell International Ltd. |
Isolation for non-volatile memory cell array
|
|
US8120088B1
(en)
|
2007-12-07 |
2012-02-21 |
Marvell International Ltd. |
Non-volatile memory cell and array
|
|
CN101770991B
(zh)
*
|
2010-01-12 |
2013-12-04 |
上海宏力半导体制造有限公司 |
分栅型埋入式浮栅的非易失性存储器及其制造方法
|
|
CN101777519B
(zh)
*
|
2010-01-12 |
2013-09-25 |
上海宏力半导体制造有限公司 |
分栅型非易失性存储器及其制造方法
|
|
DE102011000818A1
(de)
*
|
2011-02-18 |
2012-08-23 |
United Monolithic Semiconductors Gmbh |
Verfahren zur Herstellung eines Halbleiterbauelements
|
|
US8711636B2
(en)
|
2011-05-13 |
2014-04-29 |
Silicon Storage Technology, Inc. |
Method of operating a split gate flash memory cell with coupling gate
|
|
CN103579362B
(zh)
*
|
2012-07-30 |
2018-03-27 |
联华电子股份有限公司 |
半导体装置及其制作方法
|
|
US20140110777A1
(en)
|
2012-10-18 |
2014-04-24 |
United Microelectronics Corp. |
Trench gate metal oxide semiconductor field effect transistor and fabricating method thereof
|
|
CN102983080B
(zh)
*
|
2012-12-26 |
2017-02-08 |
上海华虹宏力半导体制造有限公司 |
改进分栅存储器的擦除及编程性能的方法
|
|
US9379121B1
(en)
*
|
2015-01-05 |
2016-06-28 |
Silicon Storage Technology, Inc. |
Split gate non-volatile flash memory cell having metal gates and method of making same
|
|
US10141321B2
(en)
*
|
2015-10-21 |
2018-11-27 |
Silicon Storage Technology, Inc. |
Method of forming flash memory with separate wordline and erase gates
|
|
CN107305892B
(zh)
*
|
2016-04-20 |
2020-10-02 |
硅存储技术公司 |
使用两个多晶硅沉积步骤来形成三栅极非易失性闪存单元对的方法
|
|
CN110010606B
(zh)
|
2018-01-05 |
2023-04-07 |
硅存储技术公司 |
衬底沟槽中具有浮栅的双位非易失性存储器单元
|
|
CN110021602B
(zh)
|
2018-01-05 |
2023-04-07 |
硅存储技术公司 |
在专用沟槽中具有浮栅的非易失性存储器单元
|
|
US10418451B1
(en)
*
|
2018-05-09 |
2019-09-17 |
Silicon Storage Technology, Inc. |
Split-gate flash memory cell with varying insulation gate oxides, and method of forming same
|
|
US10838652B2
(en)
|
2018-08-24 |
2020-11-17 |
Silicon Storage Technology, Inc. |
Programming of memory cell having gate capacitively coupled to floating gate
|
|
US10998325B2
(en)
|
2018-12-03 |
2021-05-04 |
Silicon Storage Technology, Inc. |
Memory cell with floating gate, coupling gate and erase gate, and method of making same
|
|
CN112185970B
(zh)
*
|
2019-07-02 |
2024-05-28 |
硅存储技术公司 |
形成分裂栅存储器单元的方法
|
|
CN112185815B
(zh)
|
2019-07-04 |
2024-07-23 |
硅存储技术公司 |
形成分裂栅闪存存储器单元的方法
|
|
US10991433B2
(en)
|
2019-09-03 |
2021-04-27 |
Silicon Storage Technology, Inc. |
Method of improving read current stability in analog non-volatile memory by limiting time gap between erase and program
|
|
US11309042B2
(en)
|
2020-06-29 |
2022-04-19 |
Silicon Storage Technology, Inc. |
Method of improving read current stability in analog non-volatile memory by program adjustment for memory cells exhibiting random telegraph noise
|
|
CN113327926B
(zh)
*
|
2021-05-27 |
2023-07-04 |
福建省晋华集成电路有限公司 |
动态随机存取存储器及其制作方法
|
|
US12080355B2
(en)
|
2021-06-02 |
2024-09-03 |
Silicon Storage Technology, Inc. |
Method of improving read current stability in analog non-volatile memory by post-program tuning for memory cells exhibiting random telegraph noise
|
|
US11769558B2
(en)
|
2021-06-08 |
2023-09-26 |
Silicon Storage Technology, Inc. |
Method of reducing random telegraph noise in non-volatile memory by grouping and screening memory cells
|
|
CN113611745B
(zh)
*
|
2021-07-30 |
2024-05-14 |
上海华虹宏力半导体制造有限公司 |
半导体器件的制造方法
|
|
WO2025122183A1
(en)
|
2023-12-04 |
2025-06-12 |
Silicon Storage Technology, Inc. |
Program speed compensation for non-volatile memory cells
|
|
WO2025151138A1
(en)
|
2024-01-12 |
2025-07-17 |
Silicon Storage Technology, Inc. |
Coarse and fine programming of non-volatile memory cells
|
|
WO2025188339A1
(en)
|
2024-03-08 |
2025-09-12 |
Silicon Storage Technology, Inc. |
Sequential erase for tuning the program state of non-volatile memory cells
|
|
WO2025198607A1
(en)
|
2024-03-20 |
2025-09-25 |
Silicon Storage Technology, Inc. |
Semiconductor device with non-planar mosfet device die and planar mosfet device die
|