CN100446186C - 用于分栅结构闪存的浮栅制作方法 - Google Patents
用于分栅结构闪存的浮栅制作方法 Download PDFInfo
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- CN100446186C CN100446186C CNB2006101169402A CN200610116940A CN100446186C CN 100446186 C CN100446186 C CN 100446186C CN B2006101169402 A CNB2006101169402 A CN B2006101169402A CN 200610116940 A CN200610116940 A CN 200610116940A CN 100446186 C CN100446186 C CN 100446186C
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CNB2006101169402A CN100446186C (zh) | 2006-10-09 | 2006-10-09 | 用于分栅结构闪存的浮栅制作方法 |
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CNB2006101169402A CN100446186C (zh) | 2006-10-09 | 2006-10-09 | 用于分栅结构闪存的浮栅制作方法 |
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CN101162691A CN101162691A (zh) | 2008-04-16 |
CN100446186C true CN100446186C (zh) | 2008-12-24 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101882576B (zh) * | 2009-05-06 | 2012-03-14 | 中芯国际集成电路制造(北京)有限公司 | 提高浮栅擦除效率的方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108257962A (zh) * | 2016-12-29 | 2018-07-06 | 无锡华润上华科技有限公司 | 闪存存储结构及其制造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5202850A (en) * | 1990-01-22 | 1993-04-13 | Silicon Storage Technology, Inc. | Single transistor non-volatile electrically alterable semiconductor memory device with a re-crystallized floating gate |
CN1239824A (zh) * | 1998-06-24 | 1999-12-29 | 世大积体电路股份有限公司 | 具有分离栅极与源极注射的快闪存储器及其制造方法 |
CN1362736A (zh) * | 2000-09-20 | 2002-08-07 | 硅存储技术公司 | 半导体存储器阵列的自对准方法和由此制造的存储器阵列 |
CN1378267A (zh) * | 2001-03-29 | 2002-11-06 | 华邦电子股份有限公司 | 改善分离栅极式闪存氧化层品质的方法 |
CN1464550A (zh) * | 2002-06-19 | 2003-12-31 | 南亚科技股份有限公司 | 快闪存储器的存储单元的制造方法 |
JP2004363122A (ja) * | 2003-05-30 | 2004-12-24 | Seiko Epson Corp | 不揮発性半導体記憶装置および不揮発性半導体記憶装置の製造方法 |
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2006
- 2006-10-09 CN CNB2006101169402A patent/CN100446186C/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5202850A (en) * | 1990-01-22 | 1993-04-13 | Silicon Storage Technology, Inc. | Single transistor non-volatile electrically alterable semiconductor memory device with a re-crystallized floating gate |
CN1239824A (zh) * | 1998-06-24 | 1999-12-29 | 世大积体电路股份有限公司 | 具有分离栅极与源极注射的快闪存储器及其制造方法 |
CN1362736A (zh) * | 2000-09-20 | 2002-08-07 | 硅存储技术公司 | 半导体存储器阵列的自对准方法和由此制造的存储器阵列 |
CN1378267A (zh) * | 2001-03-29 | 2002-11-06 | 华邦电子股份有限公司 | 改善分离栅极式闪存氧化层品质的方法 |
CN1464550A (zh) * | 2002-06-19 | 2003-12-31 | 南亚科技股份有限公司 | 快闪存储器的存储单元的制造方法 |
JP2004363122A (ja) * | 2003-05-30 | 2004-12-24 | Seiko Epson Corp | 不揮発性半導体記憶装置および不揮発性半導体記憶装置の製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101882576B (zh) * | 2009-05-06 | 2012-03-14 | 中芯国际集成电路制造(北京)有限公司 | 提高浮栅擦除效率的方法 |
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CN101162691A (zh) | 2008-04-16 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20131218 |
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Effective date of registration: 20131218 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Patentee after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Patentee before: Shanghai Huahong NEC Electronics Co., Ltd. |