JP2002026069A - 半導体素子の実装方法 - Google Patents

半導体素子の実装方法

Info

Publication number
JP2002026069A
JP2002026069A JP2000199458A JP2000199458A JP2002026069A JP 2002026069 A JP2002026069 A JP 2002026069A JP 2000199458 A JP2000199458 A JP 2000199458A JP 2000199458 A JP2000199458 A JP 2000199458A JP 2002026069 A JP2002026069 A JP 2002026069A
Authority
JP
Japan
Prior art keywords
semiconductor element
circuit board
mounting
electrode
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000199458A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002026069A5 (enExample
Inventor
Norito Tsukahara
法人 塚原
Hiroyuki Otani
博之 大谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2000199458A priority Critical patent/JP2002026069A/ja
Publication of JP2002026069A publication Critical patent/JP2002026069A/ja
Publication of JP2002026069A5 publication Critical patent/JP2002026069A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W74/15—

Landscapes

  • Drying Of Semiconductors (AREA)
  • Wire Bonding (AREA)
JP2000199458A 2000-06-30 2000-06-30 半導体素子の実装方法 Pending JP2002026069A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000199458A JP2002026069A (ja) 2000-06-30 2000-06-30 半導体素子の実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000199458A JP2002026069A (ja) 2000-06-30 2000-06-30 半導体素子の実装方法

Publications (2)

Publication Number Publication Date
JP2002026069A true JP2002026069A (ja) 2002-01-25
JP2002026069A5 JP2002026069A5 (enExample) 2005-07-07

Family

ID=18697473

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000199458A Pending JP2002026069A (ja) 2000-06-30 2000-06-30 半導体素子の実装方法

Country Status (1)

Country Link
JP (1) JP2002026069A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005150221A (ja) * 2003-11-12 2005-06-09 Seiko Epson Corp 半導体装置、半導体ウエハおよびその製造方法
JP2006073843A (ja) * 2004-09-03 2006-03-16 Nec Electronics Corp 半導体装置およびその製造方法
JP2008083579A (ja) * 2006-09-28 2008-04-10 Fuji Xerox Co Ltd 画像表示媒体
JP2013211496A (ja) * 2012-03-30 2013-10-10 National Institute Of Advanced Industrial & Technology 炭化珪素半導体素子の製造方法
KR20140079499A (ko) * 2011-10-21 2014-06-26 코닌클리케 필립스 엔.브이. 슬롯을 낸 기판들을 사용한 저 뒤틀림의 웨이퍼 접합
US20180011232A1 (en) * 2016-07-11 2018-01-11 Hamamatsu Photonics K.K. Fabry-perot interference filter and light-detecting device
JP2018010038A (ja) * 2016-07-11 2018-01-18 浜松ホトニクス株式会社 ファブリペロー干渉フィルタ及び光検出装置
JP2018010037A (ja) * 2016-07-11 2018-01-18 浜松ホトニクス株式会社 ファブリペロー干渉フィルタ及び光検出装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02240942A (ja) * 1989-03-14 1990-09-25 Sharp Corp 半導体装置
JPH06310626A (ja) * 1993-04-20 1994-11-04 Hitachi Ltd 半導体チップ及び半導体集積回路装置
JP2000164628A (ja) * 1998-11-30 2000-06-16 Fujitsu Ten Ltd 電子部品及びフェイスダウン実装構造
JP2001338932A (ja) * 2000-05-29 2001-12-07 Canon Inc 半導体装置及び半導体装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02240942A (ja) * 1989-03-14 1990-09-25 Sharp Corp 半導体装置
JPH06310626A (ja) * 1993-04-20 1994-11-04 Hitachi Ltd 半導体チップ及び半導体集積回路装置
JP2000164628A (ja) * 1998-11-30 2000-06-16 Fujitsu Ten Ltd 電子部品及びフェイスダウン実装構造
JP2001338932A (ja) * 2000-05-29 2001-12-07 Canon Inc 半導体装置及び半導体装置の製造方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005150221A (ja) * 2003-11-12 2005-06-09 Seiko Epson Corp 半導体装置、半導体ウエハおよびその製造方法
JP2006073843A (ja) * 2004-09-03 2006-03-16 Nec Electronics Corp 半導体装置およびその製造方法
JP2008083579A (ja) * 2006-09-28 2008-04-10 Fuji Xerox Co Ltd 画像表示媒体
KR20140079499A (ko) * 2011-10-21 2014-06-26 코닌클리케 필립스 엔.브이. 슬롯을 낸 기판들을 사용한 저 뒤틀림의 웨이퍼 접합
KR102020001B1 (ko) 2011-10-21 2019-09-09 루미리즈 홀딩 비.브이. 슬롯을 낸 기판들을 사용한 저 뒤틀림의 웨이퍼 접합
JP2013211496A (ja) * 2012-03-30 2013-10-10 National Institute Of Advanced Industrial & Technology 炭化珪素半導体素子の製造方法
US9728606B2 (en) 2012-03-30 2017-08-08 Fuji Electric Co., Ltd. Silicon carbide semiconductor element and fabrication method thereof
US20180011232A1 (en) * 2016-07-11 2018-01-11 Hamamatsu Photonics K.K. Fabry-perot interference filter and light-detecting device
JP2018010038A (ja) * 2016-07-11 2018-01-18 浜松ホトニクス株式会社 ファブリペロー干渉フィルタ及び光検出装置
JP2018010037A (ja) * 2016-07-11 2018-01-18 浜松ホトニクス株式会社 ファブリペロー干渉フィルタ及び光検出装置
US11054560B2 (en) 2016-07-11 2021-07-06 Hamamatsu Photonics K.K Fabry-Perot interference filter and light-detecting device

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