JP2002026069A5 - - Google Patents

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Publication number
JP2002026069A5
JP2002026069A5 JP2000199458A JP2000199458A JP2002026069A5 JP 2002026069 A5 JP2002026069 A5 JP 2002026069A5 JP 2000199458 A JP2000199458 A JP 2000199458A JP 2000199458 A JP2000199458 A JP 2000199458A JP 2002026069 A5 JP2002026069 A5 JP 2002026069A5
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JP
Japan
Prior art keywords
semiconductor element
mounting
semiconductor
circuit board
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000199458A
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English (en)
Japanese (ja)
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JP2002026069A (ja
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Publication date
Application filed filed Critical
Priority to JP2000199458A priority Critical patent/JP2002026069A/ja
Priority claimed from JP2000199458A external-priority patent/JP2002026069A/ja
Publication of JP2002026069A publication Critical patent/JP2002026069A/ja
Publication of JP2002026069A5 publication Critical patent/JP2002026069A5/ja
Pending legal-status Critical Current

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JP2000199458A 2000-06-30 2000-06-30 半導体素子の実装方法 Pending JP2002026069A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000199458A JP2002026069A (ja) 2000-06-30 2000-06-30 半導体素子の実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000199458A JP2002026069A (ja) 2000-06-30 2000-06-30 半導体素子の実装方法

Publications (2)

Publication Number Publication Date
JP2002026069A JP2002026069A (ja) 2002-01-25
JP2002026069A5 true JP2002026069A5 (enExample) 2005-07-07

Family

ID=18697473

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000199458A Pending JP2002026069A (ja) 2000-06-30 2000-06-30 半導体素子の実装方法

Country Status (1)

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JP (1) JP2002026069A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005150221A (ja) * 2003-11-12 2005-06-09 Seiko Epson Corp 半導体装置、半導体ウエハおよびその製造方法
JP2006073843A (ja) * 2004-09-03 2006-03-16 Nec Electronics Corp 半導体装置およびその製造方法
JP5374815B2 (ja) * 2006-09-28 2013-12-25 富士ゼロックス株式会社 画像表示媒体
WO2013057617A1 (en) * 2011-10-21 2013-04-25 Koninklijke Philips Electronics N.V. Low warpage wafer bonding through use of slotted substrates
JP6004561B2 (ja) 2012-03-30 2016-10-12 国立研究開発法人産業技術総合研究所 炭化珪素半導体素子の製造方法
JP6770356B2 (ja) * 2016-07-11 2020-10-14 浜松ホトニクス株式会社 ファブリペロー干渉フィルタ及び光検出装置
JP6770840B2 (ja) * 2016-07-11 2020-10-21 浜松ホトニクス株式会社 ファブリペロー干渉フィルタ及び光検出装置
US11054560B2 (en) * 2016-07-11 2021-07-06 Hamamatsu Photonics K.K Fabry-Perot interference filter and light-detecting device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02240942A (ja) * 1989-03-14 1990-09-25 Sharp Corp 半導体装置
JPH06310626A (ja) * 1993-04-20 1994-11-04 Hitachi Ltd 半導体チップ及び半導体集積回路装置
JP2000164628A (ja) * 1998-11-30 2000-06-16 Fujitsu Ten Ltd 電子部品及びフェイスダウン実装構造
JP2001338932A (ja) * 2000-05-29 2001-12-07 Canon Inc 半導体装置及び半導体装置の製造方法

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