|
US6888240B2
(en)
|
2001-04-30 |
2005-05-03 |
Intel Corporation |
High performance, low cost microelectronic circuit package with interposer
|
|
US6894399B2
(en)
|
2001-04-30 |
2005-05-17 |
Intel Corporation |
Microelectronic device having signal distribution functionality on an interfacial layer thereof
|
|
US7071024B2
(en)
|
2001-05-21 |
2006-07-04 |
Intel Corporation |
Method for packaging a microelectronic device using on-die bond pad expansion
|
|
US7183658B2
(en)
*
|
2001-09-05 |
2007-02-27 |
Intel Corporation |
Low cost microelectronic circuit package
|
|
JP3645511B2
(ja)
*
|
2001-10-09 |
2005-05-11 |
株式会社ルネサステクノロジ |
半導体装置の製造方法
|
|
US8455994B2
(en)
*
|
2002-01-31 |
2013-06-04 |
Imbera Electronics Oy |
Electronic module with feed through conductor between wiring patterns
|
|
FI115285B
(fi)
*
|
2002-01-31 |
2005-03-31 |
Imbera Electronics Oy |
Menetelmä komponentin upottamiseksi alustaan ja kontaktin muodostamiseksi
|
|
FI119215B
(fi)
*
|
2002-01-31 |
2008-08-29 |
Imbera Electronics Oy |
Menetelmä komponentin upottamiseksi alustaan ja elektroniikkamoduuli
|
|
US6964881B2
(en)
*
|
2002-08-27 |
2005-11-15 |
Micron Technology, Inc. |
Multi-chip wafer level system packages and methods of forming same
|
|
US6855953B2
(en)
*
|
2002-12-20 |
2005-02-15 |
Itt Manufacturing Enterprises, Inc. |
Electronic circuit assembly having high contrast fiducial
|
|
US7263677B1
(en)
*
|
2002-12-31 |
2007-08-28 |
Cadence Design Systems, Inc. |
Method and apparatus for creating efficient vias between metal layers in semiconductor designs and layouts
|
|
US8704359B2
(en)
|
2003-04-01 |
2014-04-22 |
Ge Embedded Electronics Oy |
Method for manufacturing an electronic module and an electronic module
|
|
US8222723B2
(en)
|
2003-04-01 |
2012-07-17 |
Imbera Electronics Oy |
Electric module having a conductive pattern layer
|
|
FI115601B
(fi)
*
|
2003-04-01 |
2005-05-31 |
Imbera Electronics Oy |
Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli
|
|
CN1302541C
(zh)
*
|
2003-07-08 |
2007-02-28 |
敦南科技股份有限公司 |
具有柔性电路板的芯片封装基板及其制造方法
|
|
FI20031201A7
(fi)
*
|
2003-08-26 |
2005-02-27 |
Imbera Electronics Oy |
Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli
|
|
FI20031341L
(fi)
*
|
2003-09-18 |
2005-03-19 |
Imbera Electronics Oy |
Menetelmä elektroniikkamoduulin valmistamiseksi
|
|
TWI237883B
(en)
*
|
2004-05-11 |
2005-08-11 |
Via Tech Inc |
Chip embedded package structure and process thereof
|
|
FI117814B
(fi)
*
|
2004-06-15 |
2007-02-28 |
Imbera Electronics Oy |
Menetelmä elektroniikkamoduulin valmistamiseksi
|
|
TWI250596B
(en)
*
|
2004-07-23 |
2006-03-01 |
Ind Tech Res Inst |
Wafer-level chip scale packaging method
|
|
FI117812B
(fi)
*
|
2004-08-05 |
2007-02-28 |
Imbera Electronics Oy |
Komponentin sisältävän kerroksen valmistaminen
|
|
US8487194B2
(en)
*
|
2004-08-05 |
2013-07-16 |
Imbera Electronics Oy |
Circuit board including an embedded component
|
|
FI117369B
(fi)
*
|
2004-11-26 |
2006-09-15 |
Imbera Electronics Oy |
Menetelmä elektroniikkamoduulin valmistamiseksi
|
|
CN100541767C
(zh)
*
|
2005-01-28 |
2009-09-16 |
松下电器产业株式会社 |
电子元件封装的制造方法以及电子元件封装
|
|
FI122128B
(fi)
*
|
2005-06-16 |
2011-08-31 |
Imbera Electronics Oy |
Menetelmä piirilevyrakenteen valmistamiseksi
|
|
FI119714B
(fi)
|
2005-06-16 |
2009-02-13 |
Imbera Electronics Oy |
Piirilevyrakenne ja menetelmä piirilevyrakenteen valmistamiseksi
|
|
WO2006134220A1
(en)
|
2005-06-16 |
2006-12-21 |
Imbera Electronics Oy |
Method for manufacturing a circuit board structure, and a circuit board structure
|
|
US20100140778A1
(en)
*
|
2005-07-07 |
2010-06-10 |
Koninklijke Philips Electronics N.V. |
Package, method of manufacturing the same and use thereof
|
|
US20070012965A1
(en)
*
|
2005-07-15 |
2007-01-18 |
General Electric Company |
Photodetection system and module
|
|
JP4487875B2
(ja)
*
|
2005-07-20 |
2010-06-23 |
セイコーエプソン株式会社 |
電子基板の製造方法及び電気光学装置の製造方法並びに電子機器の製造方法
|
|
US9601474B2
(en)
*
|
2005-07-22 |
2017-03-21 |
Invensas Corporation |
Electrically stackable semiconductor wafer and chip packages
|
|
KR100785014B1
(ko)
*
|
2006-04-14 |
2007-12-12 |
삼성전자주식회사 |
Soi웨이퍼를 이용한 mems 디바이스 및 그 제조방법
|
|
JP5091600B2
(ja)
*
|
2006-09-29 |
2012-12-05 |
三洋電機株式会社 |
半導体モジュール、半導体モジュールの製造方法および携帯機器
|
|
US7579215B2
(en)
*
|
2007-03-30 |
2009-08-25 |
Motorola, Inc. |
Method for fabricating a low cost integrated circuit (IC) package
|
|
US9953910B2
(en)
*
|
2007-06-21 |
2018-04-24 |
General Electric Company |
Demountable interconnect structure
|
|
US20080318413A1
(en)
*
|
2007-06-21 |
2008-12-25 |
General Electric Company |
Method for making an interconnect structure and interconnect component recovery process
|
|
US20080318055A1
(en)
*
|
2007-06-21 |
2008-12-25 |
General Electric Company |
Recoverable electronic component
|
|
US9610758B2
(en)
*
|
2007-06-21 |
2017-04-04 |
General Electric Company |
Method of making demountable interconnect structure
|
|
US20080313894A1
(en)
*
|
2007-06-21 |
2008-12-25 |
General Electric Company |
Method for making an interconnect structure and low-temperature interconnect component recovery process
|
|
US20080318054A1
(en)
*
|
2007-06-21 |
2008-12-25 |
General Electric Company |
Low-temperature recoverable electronic component
|
|
US20090028491A1
(en)
|
2007-07-26 |
2009-01-29 |
General Electric Company |
Interconnect structure
|
|
CN101373748B
(zh)
*
|
2007-08-20 |
2011-06-15 |
宏茂微电子(上海)有限公司 |
晶圆级封装结构及其制作方法
|
|
JP4966156B2
(ja)
*
|
2007-10-23 |
2012-07-04 |
ソニーケミカル&インフォメーションデバイス株式会社 |
配線基板の受台及びこれを用いた配線基板の接続装置、接続方法
|
|
JP5459484B2
(ja)
*
|
2007-12-21 |
2014-04-02 |
株式会社東京精密 |
ダイシング装置及びダイシング方法
|
|
JP4840373B2
(ja)
*
|
2008-01-31 |
2011-12-21 |
カシオ計算機株式会社 |
半導体装置およびその製造方法
|
|
FI123205B
(fi)
|
2008-05-12 |
2012-12-31 |
Imbera Electronics Oy |
Piirimoduuli ja menetelmä piirimoduulin valmistamiseksi
|
|
JP5833926B2
(ja)
|
2008-10-30 |
2015-12-16 |
アーテー・ウント・エス・オーストリア・テヒノロギー・ウント・ジュステームテッヒニク・アクチェンゲゼルシャフトAt & S Austria Technologie & Systemtechnik Aktiengesellschaft |
電子構成部品をプリント回路基板に組み込むための方法
|
|
US7964974B2
(en)
|
2008-12-02 |
2011-06-21 |
General Electric Company |
Electronic chip package with reduced contact pad pitch
|
|
US8008781B2
(en)
|
2008-12-02 |
2011-08-30 |
General Electric Company |
Apparatus and method for reducing pitch in an integrated circuit
|
|
US7897481B2
(en)
*
|
2008-12-05 |
2011-03-01 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
High throughput die-to-wafer bonding using pre-alignment
|
|
WO2011065062A1
(ja)
*
|
2009-11-30 |
2011-06-03 |
シャープ株式会社 |
フレキシブル回路基板およびその製造方法
|
|
US8623689B2
(en)
*
|
2010-07-07 |
2014-01-07 |
Ineffable Cellular Limited Liability Company |
Package process of backside illumination image sensor
|
|
JP5554380B2
(ja)
*
|
2012-08-08 |
2014-07-23 |
富士通株式会社 |
半導体装置
|
|
JP5399542B2
(ja)
*
|
2012-08-08 |
2014-01-29 |
富士通株式会社 |
半導体装置の製造方法
|
|
JP5624698B1
(ja)
*
|
2012-12-21 |
2014-11-12 |
パナソニック株式会社 |
電子部品パッケージおよびその製造方法
|
|
US9595651B2
(en)
|
2012-12-21 |
2017-03-14 |
Panasonic Intellectual Property Management Co., Ltd. |
Electronic component package and method for manufacturing same
|
|
US9425122B2
(en)
|
2012-12-21 |
2016-08-23 |
Panasonic Intellectual Property Management Co., Ltd. |
Electronic component package and method for manufacturing the same
|
|
US9449944B2
(en)
|
2012-12-21 |
2016-09-20 |
Panasonic Intellectual Property Management Co., Ltd. |
Electronic component package and method for manufacturing same
|
|
JP5624699B1
(ja)
*
|
2012-12-21 |
2014-11-12 |
パナソニック株式会社 |
電子部品パッケージおよびその製造方法
|
|
DE102015214219A1
(de)
*
|
2015-07-28 |
2017-02-02 |
Osram Opto Semiconductors Gmbh |
Verfahren zur Herstellung eines Bauelements und ein Bauelement
|
|
JP2017073472A
(ja)
*
|
2015-10-07 |
2017-04-13 |
株式会社ディスコ |
半導体装置の製造方法
|
|
US10867959B2
(en)
*
|
2016-11-30 |
2020-12-15 |
Shenzhen Xiuyuan Electronic Technology Co., Ltd |
Integrated circuit packaging method and integrated packaged circuit
|
|
EP3557608A1
(en)
|
2018-04-19 |
2019-10-23 |
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft |
Packaged integrated circuit with interposing functionality and method for manufacturing such a packaged integrated circuit
|
|
EP3833164A1
(en)
|
2019-12-05 |
2021-06-09 |
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft |
Compensating misalignment of component carrier feature by modifying target design concerning correlated component carrier feature
|
|
US20240145258A1
(en)
*
|
2022-10-27 |
2024-05-02 |
Stmicroelectronics Pte Ltd |
Panel level semiconductor package and method of manufacturing the same
|