JP2001026717A5 - - Google Patents

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Publication number
JP2001026717A5
JP2001026717A5 JP2000201004A JP2000201004A JP2001026717A5 JP 2001026717 A5 JP2001026717 A5 JP 2001026717A5 JP 2000201004 A JP2000201004 A JP 2000201004A JP 2000201004 A JP2000201004 A JP 2000201004A JP 2001026717 A5 JP2001026717 A5 JP 2001026717A5
Authority
JP
Japan
Prior art keywords
component
curable composition
group
monovalent hydrocarbon
hydrosilylation reaction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000201004A
Other languages
English (en)
Japanese (ja)
Other versions
JP5248720B2 (ja
JP2001026717A (ja
Filing date
Publication date
Priority claimed from US09/345,638 external-priority patent/US6310146B1/en
Application filed filed Critical
Publication of JP2001026717A publication Critical patent/JP2001026717A/ja
Publication of JP2001026717A5 publication Critical patent/JP2001026717A5/ja
Application granted granted Critical
Publication of JP5248720B2 publication Critical patent/JP5248720B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000201004A 1999-07-01 2000-07-03 高い強度及び耐破壊性を有するシルセスキオキサン樹脂並びにそれらの調製方法 Expired - Fee Related JP5248720B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/345638 1999-07-01
US09/345,638 US6310146B1 (en) 1999-07-01 1999-07-01 Silsesquioxane resin with high strength and fracture toughness and method for the preparation thereof

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012107532A Division JP2012144748A (ja) 1999-07-01 2012-05-09 高い強度及び耐破壊性を有するシルセスキオキサン樹脂並びにそれらの調製方法

Publications (3)

Publication Number Publication Date
JP2001026717A JP2001026717A (ja) 2001-01-30
JP2001026717A5 true JP2001026717A5 (https=) 2007-06-21
JP5248720B2 JP5248720B2 (ja) 2013-07-31

Family

ID=23355853

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2000201004A Expired - Fee Related JP5248720B2 (ja) 1999-07-01 2000-07-03 高い強度及び耐破壊性を有するシルセスキオキサン樹脂並びにそれらの調製方法
JP2012107532A Pending JP2012144748A (ja) 1999-07-01 2012-05-09 高い強度及び耐破壊性を有するシルセスキオキサン樹脂並びにそれらの調製方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012107532A Pending JP2012144748A (ja) 1999-07-01 2012-05-09 高い強度及び耐破壊性を有するシルセスキオキサン樹脂並びにそれらの調製方法

Country Status (4)

Country Link
US (1) US6310146B1 (https=)
EP (1) EP1065248B1 (https=)
JP (2) JP5248720B2 (https=)
DE (1) DE60004934T2 (https=)

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US6689859B2 (en) * 2002-03-05 2004-02-10 Dow Corning Corporation High fracture toughness hydrosilyation cured silicone resin
US6646039B2 (en) * 2002-03-05 2003-11-11 Dow Corning Corporation Hydrosilyation cured silicone resin containing colloidal silica and a process for producing the same
US6596821B1 (en) 2002-03-05 2003-07-22 Dow Corning Corporation Hydrosilyation cured silicone resins obtained by fractionation
US6660395B2 (en) 2002-03-12 2003-12-09 Dow Corning Corporation Silicone resin based composites interleaved for improved toughness
US7037592B2 (en) 2003-02-25 2006-05-02 Dow Coming Corporation Hybrid composite of silicone and organic resins
WO2005013361A1 (ja) * 2003-07-30 2005-02-10 The Kansai Electric Power Co., Inc. 高耐熱半導体装置
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CN100540275C (zh) * 2003-11-17 2009-09-16 陶氏康宁公司 固化有机硅树脂基底的压花方法
DE602005009971D1 (de) * 2004-11-19 2008-11-06 Dow Corning Zusammensetzung aus organohydrogenpolysiloxanharz und silizium
WO2006055231A1 (en) * 2004-11-19 2006-05-26 Dow Corning Corporation Silicone composition and cured silicone resin
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US8092910B2 (en) * 2005-02-16 2012-01-10 Dow Corning Toray Co., Ltd. Reinforced silicone resin film and method of preparing same
KR101271662B1 (ko) 2005-02-16 2013-06-05 다우 코닝 도레이 캄파니 리미티드 강화 실리콘 수지 필름 및 이의 제조방법
EP1893671B1 (en) * 2005-06-14 2009-12-23 Dow Corning Corporation Reinforced silicone resin film and method of preparing same
WO2007018756A1 (en) * 2005-08-04 2007-02-15 Dow Corning Corporation Reinforced silicone resin film and method of preparing same
JP2007063394A (ja) * 2005-08-31 2007-03-15 Asahi Kasei Corp かご状シルセスキオキサン重合体
US8912268B2 (en) 2005-12-21 2014-12-16 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
US8084532B2 (en) 2006-01-19 2011-12-27 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
JP5178532B2 (ja) * 2006-02-02 2013-04-10 ダウ・コーニング・コーポレイション シリコーン樹脂フィルム、その調製方法、およびナノ材料充填シリコーン組成物
WO2007097835A2 (en) * 2006-02-20 2007-08-30 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
EP2117836B1 (en) 2007-02-22 2012-11-07 Dow Corning Corporation Reinforced silicone resin films
JP2010519381A (ja) * 2007-02-22 2010-06-03 ダウ コーニング コーポレーション 強化シリコーン樹脂フィルムおよびその調製方法
WO2008103226A1 (en) 2007-02-22 2008-08-28 Dow Corning Corporation Reinforced silicone resin films
US20100143686A1 (en) * 2007-05-01 2010-06-10 Bizhong Zhu Nanomaterial-Filled Silicone Composition and Reinforced Silicone Resin Film
JP2009029881A (ja) * 2007-07-25 2009-02-12 Toyota Industries Corp 透明有機ガラスおよびその製造方法
US8242181B2 (en) * 2007-10-12 2012-08-14 Dow Corning Corporation Aluminum oxide dispersion and method of preparing same
CN102272231B (zh) 2008-11-19 2013-10-30 陶氏康宁公司 硅氧烷组合物和制备该硅氧烷组合物的方法
KR102471220B1 (ko) 2018-08-17 2022-11-25 와커 헤미 아게 가교성 오르가노실록산 조성물

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US6509423B1 (en) * 2001-08-21 2003-01-21 Dow Corning Corporation Silicone composition and cured silicone product
US6689859B2 (en) * 2002-03-05 2004-02-10 Dow Corning Corporation High fracture toughness hydrosilyation cured silicone resin
US6646039B2 (en) * 2002-03-05 2003-11-11 Dow Corning Corporation Hydrosilyation cured silicone resin containing colloidal silica and a process for producing the same
WO2003104329A1 (ja) * 2002-06-05 2003-12-18 ダウコーニングアジア株式会社 ポリシロキサンフィルム及びその製造方法

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