JP2001007045A5 - - Google Patents

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Publication number
JP2001007045A5
JP2001007045A5 JP1999179233A JP17923399A JP2001007045A5 JP 2001007045 A5 JP2001007045 A5 JP 2001007045A5 JP 1999179233 A JP1999179233 A JP 1999179233A JP 17923399 A JP17923399 A JP 17923399A JP 2001007045 A5 JP2001007045 A5 JP 2001007045A5
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JP
Japan
Prior art keywords
laser
heat treatment
optical system
intensity distribution
substrate
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JP1999179233A
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English (en)
Japanese (ja)
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JP2001007045A (ja
JP3562389B2 (ja
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Priority claimed from JP17923399A external-priority patent/JP3562389B2/ja
Priority to JP17923399A priority Critical patent/JP3562389B2/ja
Priority to CA002312223A priority patent/CA2312223A1/en
Priority to CNB001187449A priority patent/CN1146027C/zh
Priority to DE60027820T priority patent/DE60027820T2/de
Priority to US09/599,645 priority patent/US6437284B1/en
Priority to TW089112338A priority patent/TW469539B/zh
Priority to EP00113378A priority patent/EP1063049B1/en
Priority to KR10-2000-0035042A priority patent/KR100371986B1/ko
Publication of JP2001007045A publication Critical patent/JP2001007045A/ja
Publication of JP3562389B2 publication Critical patent/JP3562389B2/ja
Application granted granted Critical
Publication of JP2001007045A5 publication Critical patent/JP2001007045A5/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP17923399A 1999-06-25 1999-06-25 レーザ熱処理装置 Expired - Lifetime JP3562389B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP17923399A JP3562389B2 (ja) 1999-06-25 1999-06-25 レーザ熱処理装置
EP00113378A EP1063049B1 (en) 1999-06-25 2000-06-23 Apparatus with an optical system for laser heat treatment and method for producing semiconductor devices by using the same
CNB001187449A CN1146027C (zh) 1999-06-25 2000-06-23 光学系统及其装置和使用该光学系统制造半导体装置的方法
DE60027820T DE60027820T2 (de) 1999-06-25 2000-06-23 Vorrichtung mit einem optischen System zur Laserwärmebehandlung und ein diese Vorrichtung verwendendes Verfahren zur Herstellung von Halbleiteranordnungen
US09/599,645 US6437284B1 (en) 1999-06-25 2000-06-23 Optical system and apparatus for laser heat treatment and method for producing semiconductor devices by using the same
TW089112338A TW469539B (en) 1999-06-25 2000-06-23 Optical system for laser heat treatment, laser heat treating apparatus, and method for producing semiconductor devices by using the same
CA002312223A CA2312223A1 (en) 1999-06-25 2000-06-23 Optical system and apparatus for laser heat treatment and method for producing semiconductor devices by using the same
KR10-2000-0035042A KR100371986B1 (ko) 1999-06-25 2000-06-24 레이저 열처리용 광학장치, 레이저 열처리 장치 및 반도체의 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17923399A JP3562389B2 (ja) 1999-06-25 1999-06-25 レーザ熱処理装置

Publications (3)

Publication Number Publication Date
JP2001007045A JP2001007045A (ja) 2001-01-12
JP3562389B2 JP3562389B2 (ja) 2004-09-08
JP2001007045A5 true JP2001007045A5 (https=) 2004-10-28

Family

ID=16062280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17923399A Expired - Lifetime JP3562389B2 (ja) 1999-06-25 1999-06-25 レーザ熱処理装置

Country Status (8)

Country Link
US (1) US6437284B1 (https=)
EP (1) EP1063049B1 (https=)
JP (1) JP3562389B2 (https=)
KR (1) KR100371986B1 (https=)
CN (1) CN1146027C (https=)
CA (1) CA2312223A1 (https=)
DE (1) DE60027820T2 (https=)
TW (1) TW469539B (https=)

Families Citing this family (100)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6555449B1 (en) 1996-05-28 2003-04-29 Trustees Of Columbia University In The City Of New York Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidfication
DE19931751A1 (de) * 1999-07-08 2001-01-11 Zeiss Carl Fa Vorrichtung zur Reduzierung der Peakleistung einer Pulslaser-Lichtquelle
US6635588B1 (en) * 2000-06-12 2003-10-21 Ultratech Stepper, Inc. Method for laser thermal processing using thermally induced reflectivity switch
CN100355026C (zh) 2000-10-06 2007-12-12 三菱电机株式会社 多晶态硅膜的制造方法和制造装置
JP2002141301A (ja) 2000-11-02 2002-05-17 Mitsubishi Electric Corp レーザアニーリング用光学系とこれを用いたレーザアニーリング装置
AU2002307442A1 (en) * 2001-04-23 2002-11-05 Dee E. Willden Wedge-shaped lensless laser focusing device
US6897477B2 (en) 2001-06-01 2005-05-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method thereof, and display device
KR100885904B1 (ko) * 2001-08-10 2009-02-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 레이저 어닐링장치 및 반도체장치의 제작방법
JP3977038B2 (ja) * 2001-08-27 2007-09-19 株式会社半導体エネルギー研究所 レーザ照射装置およびレーザ照射方法
JP3980465B2 (ja) * 2001-11-09 2007-09-26 株式会社半導体エネルギー研究所 半導体装置の作製方法
TWI291729B (en) 2001-11-22 2007-12-21 Semiconductor Energy Lab A semiconductor fabricating apparatus
KR100967824B1 (ko) 2001-11-30 2010-07-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치의 제작방법
US7133737B2 (en) 2001-11-30 2006-11-07 Semiconductor Energy Laboratory Co., Ltd. Program for controlling laser apparatus and recording medium for recording program for controlling laser apparatus and capable of being read out by computer
US7214573B2 (en) 2001-12-11 2007-05-08 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device that includes patterning sub-islands
US7113527B2 (en) 2001-12-21 2006-09-26 Semiconductor Energy Laboratory Co., Ltd. Method and apparatus for laser irradiation and manufacturing method of semiconductor device
US7005601B2 (en) * 2002-04-18 2006-02-28 Applied Materials, Inc. Thermal flux processing by scanning
AU2003272222A1 (en) 2002-08-19 2004-03-03 The Trustees Of Columbia University In The City Of New York Process and system for laser crystallization processing of film regions on a substrate to minimize edge areas, and structure of such film regions
TWI331803B (en) 2002-08-19 2010-10-11 Univ Columbia A single-shot semiconductor processing system and method having various irradiation patterns
JP4278940B2 (ja) * 2002-09-09 2009-06-17 株式会社 液晶先端技術開発センター 結晶化装置および結晶化方法
JP2004134785A (ja) * 2002-09-19 2004-04-30 Semiconductor Energy Lab Co Ltd ビームホモジナイザおよびレーザ照射装置、並びに半導体装置の作製方法
EP1400832B1 (en) 2002-09-19 2014-10-22 Semiconductor Energy Laboratory Co., Ltd. Beam homogenizer and laser irradiation apparatus and method of manufacturing semiconductor device
US7097709B2 (en) * 2002-11-27 2006-08-29 Mitsubishi Denki Kabushiki Kaisha Laser annealing apparatus
TWI300950B (en) * 2002-11-29 2008-09-11 Adv Lcd Tech Dev Ct Co Ltd Semiconductor structure, semiconductor device, and method and apparatus for manufacturing the same
JP2004260144A (ja) * 2003-02-06 2004-09-16 Mitsubishi Electric Corp レーザアニーリング方法および装置
KR101191837B1 (ko) 2003-02-19 2012-10-18 더 트러스티스 오브 콜롬비아 유니버시티 인 더 시티 오브 뉴욕 순차적 측면 고상화 기술을 이용하여 결정화되는 복수의 반도체 박막을 가공하는 방법 및 장치
US7327916B2 (en) 2003-03-11 2008-02-05 Semiconductor Energy Laboratory Co., Ltd. Beam Homogenizer, laser irradiation apparatus, and method of manufacturing a semiconductor device
JP4494045B2 (ja) * 2003-03-11 2010-06-30 株式会社半導体エネルギー研究所 ビームホモジナイザ及びレーザ照射装置、並びに半導体装置の作製方法
SG137674A1 (en) 2003-04-24 2007-12-28 Semiconductor Energy Lab Beam homogenizer, laser irradiation apparatus, and method for manufacturing semiconductor device
JP4619035B2 (ja) * 2003-04-24 2011-01-26 株式会社半導体エネルギー研究所 ビームホモジナイザ及びレーザ照射装置、並びに半導体装置の作製方法
JP4660074B2 (ja) * 2003-05-26 2011-03-30 富士フイルム株式会社 レーザアニール装置
US7245802B2 (en) * 2003-08-04 2007-07-17 Semiconductor Energy Laboratory Co., Ltd. Beam homogenizer, laser irradiation apparatus and method for manufacturing semiconductor device
WO2005029551A2 (en) 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Processes and systems for laser crystallization processing of film regions on a substrate utilizing a line-type beam, and structures of such film regions
US7164152B2 (en) 2003-09-16 2007-01-16 The Trustees Of Columbia University In The City Of New York Laser-irradiated thin films having variable thickness
TWI351713B (en) 2003-09-16 2011-11-01 Univ Columbia Method and system for providing a single-scan, con
WO2005029546A2 (en) 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Method and system for providing a continuous motion sequential lateral solidification for reducing or eliminating artifacts, and a mask for facilitating such artifact reduction/elimination
US7318866B2 (en) * 2003-09-16 2008-01-15 The Trustees Of Columbia University In The City Of New York Systems and methods for inducing crystallization of thin films using multiple optical paths
US7311778B2 (en) 2003-09-19 2007-12-25 The Trustees Of Columbia University In The City Of New York Single scan irradiation for crystallization of thin films
JP2005129916A (ja) * 2003-09-30 2005-05-19 Semiconductor Energy Lab Co Ltd ビームホモジナイザ、レーザ照射装置、半導体装置の作製方法
US7169630B2 (en) 2003-09-30 2007-01-30 Semiconductor Energy Laboratory Co., Ltd. Beam homogenizer, laser irradiation apparatus, and method for manufacturing semiconductor device
JP3960295B2 (ja) * 2003-10-31 2007-08-15 住友電気工業株式会社 チルト誤差低減非球面ホモジナイザー
US8084866B2 (en) 2003-12-10 2011-12-27 Micron Technology, Inc. Microelectronic devices and methods for filling vias in microelectronic devices
US7091124B2 (en) 2003-11-13 2006-08-15 Micron Technology, Inc. Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
JP4416481B2 (ja) * 2003-11-18 2010-02-17 ギガフォトン株式会社 光学的パルス伸長器および露光用放電励起ガスレーザ装置
JP4838982B2 (ja) * 2004-01-30 2011-12-14 株式会社 日立ディスプレイズ レーザアニール方法およびレーザアニール装置
TWI272149B (en) 2004-02-26 2007-02-01 Ultratech Inc Laser scanning apparatus and methods for thermal processing
KR100514996B1 (ko) * 2004-04-19 2005-09-15 주식회사 이오테크닉스 레이저 가공 장치
US20050237895A1 (en) * 2004-04-23 2005-10-27 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus and method for manufacturing semiconductor device
US20050247894A1 (en) * 2004-05-05 2005-11-10 Watkins Charles M Systems and methods for forming apertures in microfeature workpieces
US7232754B2 (en) 2004-06-29 2007-06-19 Micron Technology, Inc. Microelectronic devices and methods for forming interconnects in microelectronic devices
SG120200A1 (en) 2004-08-27 2006-03-28 Micron Technology Inc Slanted vias for electrical circuits on circuit boards and other substrates
US7300857B2 (en) 2004-09-02 2007-11-27 Micron Technology, Inc. Through-wafer interconnects for photoimager and memory wafers
US7387954B2 (en) * 2004-10-04 2008-06-17 Semiconductor Energy Laboratory Co., Ltd. Beam homogenizer, laser irradiation apparatus, and method for manufacturing semiconductor device
WO2006046495A1 (en) * 2004-10-27 2006-05-04 Semiconductor Energy Laboratory Co., Ltd. Beam homogenizer, and laser irradiation method, laser irradiation apparatus, and laser annealing method of non-single crystalline semiconductor film using the same
US7645337B2 (en) 2004-11-18 2010-01-12 The Trustees Of Columbia University In The City Of New York Systems and methods for creating crystallographic-orientation controlled poly-silicon films
US8093530B2 (en) * 2004-11-19 2012-01-10 Canon Kabushiki Kaisha Laser cutting apparatus and laser cutting method
US8221544B2 (en) 2005-04-06 2012-07-17 The Trustees Of Columbia University In The City Of New York Line scan sequential lateral solidification of thin films
JP2006295068A (ja) * 2005-04-14 2006-10-26 Sony Corp 照射装置
EP1722449B1 (de) * 2005-05-12 2008-10-22 Innovavent GmbH Verwendung eines Scheibenlasers zur Kristallisation von Siliziumschichten
US7795134B2 (en) 2005-06-28 2010-09-14 Micron Technology, Inc. Conductive interconnect structures and formation methods using supercritical fluids
KR101250629B1 (ko) * 2005-08-16 2013-04-03 더 트러스티이스 오브 콜롬비아 유니버시티 인 더 시티 오브 뉴욕 고주파 레이저를 사용하는 박막의 균일한 순차적 측면 고상화를 위한 시스템 및 방법
US7262134B2 (en) 2005-09-01 2007-08-28 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
US7622377B2 (en) * 2005-09-01 2009-11-24 Micron Technology, Inc. Microfeature workpiece substrates having through-substrate vias, and associated methods of formation
US7863187B2 (en) 2005-09-01 2011-01-04 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
WO2007067541A2 (en) 2005-12-05 2007-06-14 The Trustees Of Columbia University In The City Of New York Systems and methods for processing a film, and thin films
US7749899B2 (en) 2006-06-01 2010-07-06 Micron Technology, Inc. Microelectronic workpieces and methods and systems for forming interconnects in microelectronic workpieces
US8803027B2 (en) * 2006-06-05 2014-08-12 Cymer, Llc Device and method to create a low divergence, high power laser beam for material processing applications
US7629249B2 (en) 2006-08-28 2009-12-08 Micron Technology, Inc. Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
US7902643B2 (en) 2006-08-31 2011-03-08 Micron Technology, Inc. Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
JP2008068270A (ja) * 2006-09-12 2008-03-27 Disco Abrasive Syst Ltd レーザー加工装置
KR100878159B1 (ko) * 2007-04-19 2009-01-13 주식회사 코윈디에스티 레이저 가공장치
US7573930B2 (en) 2007-06-14 2009-08-11 Innovavent Gmbh Anamorphotic solid-sate laser
US20090046757A1 (en) * 2007-08-16 2009-02-19 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus, laser irradiation method, and manufacturing method of semiconductor device
SG150410A1 (en) 2007-08-31 2009-03-30 Micron Technology Inc Partitioned through-layer via and associated systems and methods
US8614471B2 (en) 2007-09-21 2013-12-24 The Trustees Of Columbia University In The City Of New York Collections of laterally crystallized semiconductor islands for use in thin film transistors
JP5385289B2 (ja) 2007-09-25 2014-01-08 ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク 横方向に結晶化した薄膜上に作製される薄膜トランジスタデバイスにおいて高い均一性を生成する方法
DE102007052782B4 (de) * 2007-11-02 2017-02-16 Saint-Gobain Glass France S.A. Verfahren zur Veränderung der Eigenschaften einer TCO-Schicht
WO2009067688A1 (en) 2007-11-21 2009-05-28 The Trustees Of Columbia University In The City Of New York Systems and methods for preparing epitaxially textured polycrystalline films
US8012861B2 (en) 2007-11-21 2011-09-06 The Trustees Of Columbia University In The City Of New York Systems and methods for preparing epitaxially textured polycrystalline films
KR20100105606A (ko) 2007-11-21 2010-09-29 더 트러스티이스 오브 콜롬비아 유니버시티 인 더 시티 오브 뉴욕 에피택셜하게 텍스쳐화된 후막의 제조를 위한 시스템 및 방법
US7884015B2 (en) 2007-12-06 2011-02-08 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
US8569155B2 (en) 2008-02-29 2013-10-29 The Trustees Of Columbia University In The City Of New York Flash lamp annealing crystallization for large area thin films
KR100908325B1 (ko) * 2008-07-11 2009-07-17 주식회사 코윈디에스티 레이저 가공방법
KR20110094022A (ko) 2008-11-14 2011-08-19 더 트러스티이스 오브 콜롬비아 유니버시티 인 더 시티 오브 뉴욕 박막 결정화를 위한 시스템 및 방법
KR20170082649A (ko) * 2009-03-20 2017-07-14 코닝 인코포레이티드 정밀 레이저 스코어링
KR20100107253A (ko) * 2009-03-25 2010-10-05 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
US8440581B2 (en) 2009-11-24 2013-05-14 The Trustees Of Columbia University In The City Of New York Systems and methods for non-periodic pulse sequential lateral solidification
US9087696B2 (en) 2009-11-03 2015-07-21 The Trustees Of Columbia University In The City Of New York Systems and methods for non-periodic pulse partial melt film processing
US9646831B2 (en) 2009-11-03 2017-05-09 The Trustees Of Columbia University In The City Of New York Advanced excimer laser annealing for thin films
JP5891504B2 (ja) * 2011-03-08 2016-03-23 株式会社Joled 薄膜トランジスタアレイ装置の製造方法
US9214346B2 (en) * 2012-04-18 2015-12-15 Applied Materials, Inc. Apparatus and method to reduce particles in advanced anneal process
FR3063395B1 (fr) * 2017-02-28 2021-05-28 Centre Nat Rech Scient Source laser pour l'emission d'un groupe d'impulsions
CN109520898A (zh) * 2019-01-22 2019-03-26 河北工业大学 一种柱透镜变换的激光粒度测试方法
US11560987B2 (en) * 2019-11-20 2023-01-24 Nichia Corporation Light source device
CN112916873B (zh) * 2021-01-26 2022-01-28 上海交通大学 基于脉冲激光驱动的微滴三维打印系统及方法
WO2023070615A1 (en) * 2021-10-30 2023-05-04 Yangtze Memory Technologies Co., Ltd. Methods for thermal treatment of a semiconductor layer in semiconductor device
WO2025220773A1 (ko) * 2024-04-19 2025-10-23 주식회사 이오테크닉스 레이저 장치 및 이를 포함하는 가공 장치
KR102932994B1 (ko) * 2024-04-22 2026-03-04 신호텍 주식회사 레이저 광학 시스템
KR102946121B1 (ko) * 2024-04-22 2026-03-31 신호텍 주식회사 레이저 빔 성형 장치
KR102948666B1 (ko) * 2024-04-22 2026-04-03 김윤호 레이저 광학 장치
CN118768736A (zh) * 2024-07-12 2024-10-15 中南大学 一种基于线状超快激光焊接透明材料的新方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS583478B2 (ja) * 1978-03-03 1983-01-21 株式会社日立製作所 レ−ザ加熱方法および装置
US4327972A (en) * 1979-10-22 1982-05-04 Coulter Electronics, Inc. Redirecting surface for desired intensity profile
JPS58127318A (ja) * 1982-01-25 1983-07-29 Nippon Telegr & Teleph Corp <Ntt> 絶縁層上への単結晶膜形成方法
JPS6161657A (ja) 1984-09-03 1986-03-29 Matsushita Electric Ind Co Ltd イオン風式空気清浄機
US4744615A (en) * 1986-01-29 1988-05-17 International Business Machines Corporation Laser beam homogenizer
US4793694A (en) * 1986-04-23 1988-12-27 Quantronix Corporation Method and apparatus for laser beam homogenization
JPS63314862A (ja) * 1987-06-17 1988-12-22 Nec Corp 薄膜トランジスタの製造方法
DE3829728A1 (de) * 1987-09-02 1989-03-23 Lambda Physik Forschung Verfahren und vorrichtung zum homogenisieren der intensitaetsverteilung im querschnit eines laserstrahls
DE3818504A1 (de) * 1988-05-31 1991-01-03 Fraunhofer Ges Forschung Verfahren und vorrichtung fuer die kristallisation duenner halbleiterschichten auf einem substratmaterial
JPH02175090A (ja) * 1988-12-27 1990-07-06 Isamu Miyamoto レーザビーム成形装置
JPH0433791A (ja) * 1990-05-29 1992-02-05 Matsushita Electric Ind Co Ltd レーザ加工装置
JP3149450B2 (ja) * 1991-04-04 2001-03-26 セイコーエプソン株式会社 薄膜トランジスタの製造方法及び製造装置
JPH06124913A (ja) * 1992-06-26 1994-05-06 Semiconductor Energy Lab Co Ltd レーザー処理方法
WO1995026517A1 (en) * 1992-11-10 1995-10-05 United States Department Of Energy Laser beam pulse formatting method
US5529951A (en) * 1993-11-02 1996-06-25 Sony Corporation Method of forming polycrystalline silicon layer on substrate by large area excimer laser irradiation
US5733641A (en) * 1996-05-31 1998-03-31 Xerox Corporation Buffered substrate for semiconductor devices
JPH10244392A (ja) * 1997-03-04 1998-09-14 Semiconductor Energy Lab Co Ltd レーザー照射装置
JP3402124B2 (ja) 1997-06-04 2003-04-28 住友重機械工業株式会社 ビームホモジナイザ及び半導体薄膜作製方法
JP3484481B2 (ja) 1997-06-19 2004-01-06 住友重機械工業株式会社 ビームホモジナイザ及びそれを用いた半導体薄膜の製造方法

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