JP2000103939A5 - - Google Patents
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- Publication number
- JP2000103939A5 JP2000103939A5 JP1998276344A JP27634498A JP2000103939A5 JP 2000103939 A5 JP2000103939 A5 JP 2000103939A5 JP 1998276344 A JP1998276344 A JP 1998276344A JP 27634498 A JP27634498 A JP 27634498A JP 2000103939 A5 JP2000103939 A5 JP 2000103939A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- epoxy resin
- carbon atoms
- molding material
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000003822 epoxy resin Substances 0.000 claims description 36
- 229920000647 polyepoxide Polymers 0.000 claims description 36
- 125000004432 carbon atoms Chemical group C* 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 26
- 238000000465 moulding Methods 0.000 claims description 26
- 238000007789 sealing Methods 0.000 claims description 21
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 20
- 125000000217 alkyl group Chemical group 0.000 claims description 18
- 125000003118 aryl group Chemical group 0.000 claims description 18
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 14
- 150000001875 compounds Chemical class 0.000 claims description 12
- 125000003700 epoxy group Chemical group 0.000 claims description 12
- 210000002356 Skeleton Anatomy 0.000 claims description 10
- 125000003545 alkoxy group Chemical group 0.000 claims description 10
- 229910052739 hydrogen Inorganic materials 0.000 claims description 10
- 239000001257 hydrogen Substances 0.000 claims description 10
- 125000002947 alkylene group Chemical group 0.000 claims description 8
- 125000003277 amino group Chemical group 0.000 claims description 8
- 125000004122 cyclic group Chemical group 0.000 claims description 8
- 125000004435 hydrogen atoms Chemical class [H]* 0.000 claims description 8
- 150000002989 phenols Chemical class 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 125000001424 substituent group Chemical group 0.000 claims description 8
- 239000011256 inorganic filler Substances 0.000 claims description 6
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 6
- 125000000732 arylene group Chemical group 0.000 claims description 5
- 150000001299 aldehydes Chemical class 0.000 claims description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 4
- MWWATHDPGQKSAR-UHFFFAOYSA-N Propyne Chemical group CC#C MWWATHDPGQKSAR-UHFFFAOYSA-N 0.000 claims description 3
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 3
- BLBVJHVRECUXKP-UHFFFAOYSA-N 2,3-dimethoxy-1,4-dimethylbenzene Chemical group COC1=C(C)C=CC(C)=C1OC BLBVJHVRECUXKP-UHFFFAOYSA-N 0.000 claims description 2
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-Vinylphenol Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 claims description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N Bis(4-hydroxyphenyl)methane Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N Bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N Bisphenol S Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims description 2
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical compound C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 claims description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N Diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims description 2
- 230000002378 acidificating Effects 0.000 claims description 2
- 125000002723 alicyclic group Chemical group 0.000 claims description 2
- 239000004844 aliphatic epoxy resin Substances 0.000 claims description 2
- 239000003054 catalyst Substances 0.000 claims description 2
- 230000005494 condensation Effects 0.000 claims description 2
- 238000009833 condensation Methods 0.000 claims description 2
- 239000007822 coupling agent Substances 0.000 claims description 2
- 150000002118 epoxides Chemical class 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 125000004464 hydroxyphenyl group Chemical group 0.000 claims description 2
- 150000004780 naphthols Chemical class 0.000 claims description 2
- 229920003986 novolac Polymers 0.000 claims description 2
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims description 2
- 125000004437 phosphorous atoms Chemical group 0.000 claims description 2
- 235000007586 terpenes Nutrition 0.000 claims description 2
- 125000006839 xylylene group Chemical group 0.000 claims description 2
- 239000000126 substance Substances 0.000 description 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27634498A JP3852221B2 (ja) | 1998-09-30 | 1998-09-30 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27634498A JP3852221B2 (ja) | 1998-09-30 | 1998-09-30 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004021442A Division JP3982505B2 (ja) | 2004-01-29 | 2004-01-29 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
| JP2006013660A Division JP2006111888A (ja) | 2006-01-23 | 2006-01-23 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000103939A JP2000103939A (ja) | 2000-04-11 |
| JP2000103939A5 true JP2000103939A5 (ko) | 2004-12-24 |
| JP3852221B2 JP3852221B2 (ja) | 2006-11-29 |
Family
ID=17568135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27634498A Expired - Fee Related JP3852221B2 (ja) | 1998-09-30 | 1998-09-30 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3852221B2 (ko) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3489025B2 (ja) * | 2000-01-14 | 2004-01-19 | 大塚化学ホールディングス株式会社 | エポキシ樹脂組成物及びそれを用いた電子部品 |
| JP2001316565A (ja) * | 2000-05-10 | 2001-11-16 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP4765150B2 (ja) * | 2000-05-29 | 2011-09-07 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
| JP2001335679A (ja) * | 2000-05-29 | 2001-12-04 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2001354839A (ja) * | 2000-06-15 | 2001-12-25 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2002003701A (ja) * | 2000-06-20 | 2002-01-09 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2002012741A (ja) * | 2000-06-27 | 2002-01-15 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP3957957B2 (ja) * | 2000-07-24 | 2007-08-15 | 京セラケミカル株式会社 | 封止用樹脂組成物および半導体封止装置 |
| JP3889206B2 (ja) * | 2000-07-24 | 2007-03-07 | 京セラケミカル株式会社 | 封止用樹脂組成物および半導体封止装置 |
| JP2002047393A (ja) * | 2000-08-01 | 2002-02-12 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| TW572964B (en) * | 2000-09-21 | 2004-01-21 | Chang Chun Plastics Co Ltd | Flame retarded epoxy resin composition |
| JP2002317101A (ja) * | 2001-04-23 | 2002-10-31 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP5061413B2 (ja) * | 2001-09-10 | 2012-10-31 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
| JP4899273B2 (ja) * | 2001-08-27 | 2012-03-21 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
| JP2002327105A (ja) * | 2001-05-07 | 2002-11-15 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP4880841B2 (ja) * | 2001-09-19 | 2012-02-22 | 太陽ホールディングス株式会社 | 粗化面形成用樹脂組成物を用いた多層プリント配線板 |
| KR100448164B1 (ko) * | 2001-12-07 | 2004-09-10 | 제일모직주식회사 | 난연성 열가소성 수지조성물 |
| KR100600597B1 (ko) * | 2001-12-28 | 2006-07-13 | 제일모직주식회사 | 반도체 봉지재용 에폭시 수지 조성물 |
| JP2005047995A (ja) * | 2003-07-30 | 2005-02-24 | Kaneka Corp | 難燃性を向上させた耐熱性樹脂組成物およびその利用 |
| TWI378938B (en) | 2006-01-13 | 2012-12-11 | Fushimi Pharmaceutical Co Ltd | Cyclic cyanato group-containing phosphazene compound and method for making such compound |
| JP2006111888A (ja) * | 2006-01-23 | 2006-04-27 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及び電子部品装置 |
| JP5692487B2 (ja) * | 2007-10-11 | 2015-04-01 | 株式会社伏見製薬所 | エポキシ化合物組成物 |
-
1998
- 1998-09-30 JP JP27634498A patent/JP3852221B2/ja not_active Expired - Fee Related
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