JP2001151867A5 - - Google Patents
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- Publication number
- JP2001151867A5 JP2001151867A5 JP1999339933A JP33993399A JP2001151867A5 JP 2001151867 A5 JP2001151867 A5 JP 2001151867A5 JP 1999339933 A JP1999339933 A JP 1999339933A JP 33993399 A JP33993399 A JP 33993399A JP 2001151867 A5 JP2001151867 A5 JP 2001151867A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- molding material
- resin molding
- sealing
- following general
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 claims description 29
- 229920000647 polyepoxide Polymers 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 16
- 238000000465 moulding Methods 0.000 claims description 16
- 238000007789 sealing Methods 0.000 claims description 16
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 125000004435 hydrogen atoms Chemical group [H]* 0.000 claims description 7
- 235000010290 biphenyl Nutrition 0.000 claims description 5
- 239000004305 biphenyl Substances 0.000 claims description 5
- 125000004432 carbon atoms Chemical group C* 0.000 claims description 5
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 5
- 150000002430 hydrocarbons Chemical group 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 4
- 125000004122 cyclic group Chemical group 0.000 claims description 4
- 239000011256 inorganic filler Substances 0.000 claims description 3
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 3
- 239000007822 coupling agent Substances 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- -1 2,3-epoxypropoxy Chemical group 0.000 description 1
- HRSLYNJTMYIRHM-UHFFFAOYSA-N 2-[[4-[3,5-dimethyl-4-(oxiran-2-ylmethoxy)phenyl]-2,6-dimethylphenoxy]methyl]oxirane Chemical group CC1=CC(C=2C=C(C)C(OCC3OC3)=C(C)C=2)=CC(C)=C1OCC1CO1 HRSLYNJTMYIRHM-UHFFFAOYSA-N 0.000 description 1
- OZRVXYJWUUMVOW-UHFFFAOYSA-N 2-[[4-[4-(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C1OC1COC(C=C1)=CC=C1C(C=C1)=CC=C1OCC1CO1 OZRVXYJWUUMVOW-UHFFFAOYSA-N 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N 4,4'-Biphenol Chemical compound C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 125000004437 phosphorous atoms Chemical group 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33993399A JP2001151867A (ja) | 1999-11-30 | 1999-11-30 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33993399A JP2001151867A (ja) | 1999-11-30 | 1999-11-30 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
Related Child Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004028138A Division JP2004143466A (ja) | 2004-02-04 | 2004-02-04 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
| JP2004028111A Division JP2004143465A (ja) | 2004-02-04 | 2004-02-04 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
| JP2006013632A Division JP2006161055A (ja) | 2006-01-23 | 2006-01-23 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001151867A JP2001151867A (ja) | 2001-06-05 |
| JP2001151867A5 true JP2001151867A5 (ko) | 2005-01-06 |
Family
ID=18332141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33993399A Pending JP2001151867A (ja) | 1999-11-30 | 1999-11-30 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001151867A (ko) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001316565A (ja) * | 2000-05-10 | 2001-11-16 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2001354839A (ja) * | 2000-06-15 | 2001-12-25 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2002012741A (ja) * | 2000-06-27 | 2002-01-15 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2003012897A (ja) * | 2001-06-27 | 2003-01-15 | Hitachi Chem Co Ltd | 摩擦材用樹脂組成物 |
| JP2003012890A (ja) * | 2001-07-03 | 2003-01-15 | Kyocera Chemical Corp | 封止用樹脂組成物および電子部品封止装置 |
| KR100600597B1 (ko) * | 2001-12-28 | 2006-07-13 | 제일모직주식회사 | 반도체 봉지재용 에폭시 수지 조성물 |
| KR100679491B1 (ko) | 2005-02-03 | 2007-02-06 | 주식회사 케이씨씨 | 반도체소자 봉지용 친환경 에폭시수지 조성물 |
| US20090023351A1 (en) * | 2006-02-21 | 2009-01-22 | Keiko Kashihara | Flame-retardant resin composition, prepreg, resin sheet, and molding |
| JP6095150B2 (ja) * | 2010-10-12 | 2017-03-15 | 株式会社伏見製薬所 | 樹脂組成物 |
| CN105153234B (zh) * | 2014-06-13 | 2018-01-30 | 广东生益科技股份有限公司 | 一种苯氧基环三磷腈活性酯、无卤树脂组合物及其用途 |
| US20160244471A1 (en) * | 2014-06-13 | 2016-08-25 | Shengyi Technology Co., Ltd. | Phenoxycyclotriphosphazene active ester, halogen-free resin composition and uses thereof |
-
1999
- 1999-11-30 JP JP33993399A patent/JP2001151867A/ja active Pending
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