ITMI20052124A1 - Dispositivo a semiconduttori di tipo ad integrazione e metodo di fabbricazione dello stesso - Google Patents
Dispositivo a semiconduttori di tipo ad integrazione e metodo di fabbricazione dello stessoInfo
- Publication number
- ITMI20052124A1 ITMI20052124A1 IT002124A ITMI20052124A ITMI20052124A1 IT MI20052124 A1 ITMI20052124 A1 IT MI20052124A1 IT 002124 A IT002124 A IT 002124A IT MI20052124 A ITMI20052124 A IT MI20052124A IT MI20052124 A1 ITMI20052124 A1 IT MI20052124A1
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- Prior art keywords
- semiconductor device
- protection film
- integration
- manufacture
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JP2003109984A (ja) * | 2001-09-28 | 2003-04-11 | Seiko Epson Corp | Ic搭載発振器 |
JP4170103B2 (ja) * | 2003-01-30 | 2008-10-22 | Necエレクトロニクス株式会社 | 半導体装置、および半導体装置の製造方法 |
US6864578B2 (en) * | 2003-04-03 | 2005-03-08 | International Business Machines Corporation | Internally reinforced bond pads |
JP4696532B2 (ja) * | 2004-05-20 | 2011-06-08 | 株式会社デンソー | パワー複合集積型半導体装置およびその製造方法 |
US7071575B2 (en) * | 2004-11-10 | 2006-07-04 | United Microelectronics Corp. | Semiconductor chip capable of implementing wire bonding over active circuits |
-
2005
- 2005-10-12 JP JP2005298076A patent/JP4674522B2/ja not_active Expired - Fee Related
- 2005-11-08 IT IT002124A patent/ITMI20052124A1/it unknown
- 2005-11-10 US US11/270,458 patent/US7420283B2/en not_active Expired - Fee Related
-
2008
- 2008-06-17 US US12/213,259 patent/US7579695B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20060097407A1 (en) | 2006-05-11 |
US20080258307A1 (en) | 2008-10-23 |
JP4674522B2 (ja) | 2011-04-20 |
JP2006165515A (ja) | 2006-06-22 |
US7420283B2 (en) | 2008-09-02 |
US7579695B2 (en) | 2009-08-25 |
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