IT991996B - Dispositivo e procedimento per il montaggio di dispositivi a semi conduttori - Google Patents

Dispositivo e procedimento per il montaggio di dispositivi a semi conduttori

Info

Publication number
IT991996B
IT991996B IT51785/73A IT5178573A IT991996B IT 991996 B IT991996 B IT 991996B IT 51785/73 A IT51785/73 A IT 51785/73A IT 5178573 A IT5178573 A IT 5178573A IT 991996 B IT991996 B IT 991996B
Authority
IT
Italy
Prior art keywords
interconnect pattern
assembly
film
lead frame
external lead
Prior art date
Application number
IT51785/73A
Other languages
English (en)
Italian (it)
Inventor
Wayne Noe Terry
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of IT991996B publication Critical patent/IT991996B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/438—Shapes or dispositions of side rails, e.g. having holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/468—Circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
IT51785/73A 1973-01-02 1973-08-01 Dispositivo e procedimento per il montaggio di dispositivi a semi conduttori IT991996B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US320349A US3859718A (en) 1973-01-02 1973-01-02 Method and apparatus for the assembly of semiconductor devices

Publications (1)

Publication Number Publication Date
IT991996B true IT991996B (it) 1975-08-30

Family

ID=23246002

Family Applications (1)

Application Number Title Priority Date Filing Date
IT51785/73A IT991996B (it) 1973-01-02 1973-08-01 Dispositivo e procedimento per il montaggio di dispositivi a semi conduttori

Country Status (14)

Country Link
US (1) US3859718A (enExample)
JP (2) JPS5751732B2 (enExample)
KR (1) KR780000595B1 (enExample)
BR (1) BR7309074D0 (enExample)
CA (1) CA1086430A (enExample)
DD (1) DD107812A5 (enExample)
DE (1) DE2363833C2 (enExample)
FR (1) FR2212642B1 (enExample)
GB (1) GB1447524A (enExample)
HU (1) HU167861B (enExample)
IT (1) IT991996B (enExample)
PH (1) PH9927A (enExample)
PL (1) PL87007B1 (enExample)
RO (1) RO64695A (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3949925A (en) * 1974-10-03 1976-04-13 The Jade Corporation Outer lead bonder
CA1052912A (en) * 1975-07-07 1979-04-17 National Semiconductor Corporation Gang bonding interconnect tape for semiconductive devices and method of making same
US4099660A (en) * 1975-10-31 1978-07-11 National Semiconductor Corporation Apparatus for and method of shaping interconnect leads
US4166562A (en) * 1977-09-01 1979-09-04 The Jade Corporation Assembly system for microcomponent devices such as semiconductor devices
US4330790A (en) * 1980-03-24 1982-05-18 National Semiconductor Corporation Tape operated semiconductor device packaging
EP0064496A1 (en) * 1980-11-07 1982-11-17 Mostek Corporation Multiple terminal two conductor layer burn-in tape
US4331831A (en) * 1980-11-28 1982-05-25 Bell Telephone Laboratories, Incorporated Package for semiconductor integrated circuits
US4409733A (en) * 1981-01-26 1983-10-18 Integrated Machine Development Means and method for processing integrated circuit element
GB2124433B (en) * 1982-07-07 1986-05-21 Int Standard Electric Corp Electronic component assembly
US4754912A (en) * 1984-04-05 1988-07-05 National Semiconductor Corporation Controlled collapse thermocompression gang bonding
JPS60229345A (ja) * 1984-04-27 1985-11-14 Toshiba Corp 半導体装置
EP0213575B1 (en) * 1985-08-23 1992-10-21 Nec Corporation Method of manufacturing a semiconductor device employing a film carrier tape
FR2590052B1 (fr) * 1985-11-08 1991-03-01 Eurotechnique Sa Procede de recyclage d'une carte comportant un composant, carte prevue pour etre recyclee
US5038453A (en) * 1988-07-22 1991-08-13 Rohm Co., Ltd. Method of manufacturing semiconductor devices, and leadframe and differential overlapping apparatus therefor
US4985988A (en) * 1989-11-03 1991-01-22 Motorola, Inc. Method for assembling, testing, and packaging integrated circuits
US5528397A (en) * 1991-12-03 1996-06-18 Kopin Corporation Single crystal silicon transistors for display panels
US6087195A (en) 1998-10-15 2000-07-11 Handy & Harman Method and system for manufacturing lamp tiles
JP5167779B2 (ja) * 2007-11-16 2013-03-21 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US20160056095A1 (en) * 2014-08-25 2016-02-25 Infineon Technologies Ag Leadframe Strip with Sawing Enhancement Feature

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3544857A (en) * 1966-08-16 1970-12-01 Signetics Corp Integrated circuit assembly with lead structure and method
US3442432A (en) * 1967-06-15 1969-05-06 Western Electric Co Bonding a beam-leaded device to a substrate
US3689991A (en) * 1968-03-01 1972-09-12 Gen Electric A method of manufacturing a semiconductor device utilizing a flexible carrier
US3698074A (en) * 1970-06-29 1972-10-17 Motorola Inc Contact bonding and packaging of integrated circuits
US3698073A (en) * 1970-10-13 1972-10-17 Motorola Inc Contact bonding and packaging of integrated circuits
US3793714A (en) * 1971-05-27 1974-02-26 Texas Instruments Inc Integrated circuit assembly using etched metal patterns of flexible insulating film

Also Published As

Publication number Publication date
FR2212642B1 (enExample) 1978-11-10
FR2212642A1 (enExample) 1974-07-26
DD107812A5 (enExample) 1974-08-12
HU167861B (enExample) 1975-12-25
JPS4999477A (enExample) 1974-09-19
DE2363833A1 (de) 1974-07-04
JPS57164556A (en) 1982-10-09
DE2363833C2 (de) 1987-01-22
PH9927A (en) 1976-06-14
US3859718A (en) 1975-01-14
BR7309074D0 (pt) 1974-10-22
JPS5751732B2 (enExample) 1982-11-04
RO64695A (ro) 1980-06-15
KR780000595B1 (en) 1978-11-23
CA1086430A (en) 1980-09-23
PL87007B1 (enExample) 1976-06-30
GB1447524A (en) 1976-08-25

Similar Documents

Publication Publication Date Title
FR2212642B1 (enExample)
ES349093A1 (es) Un dispositivo de paquete de semiconductor.
CA1017071A (en) Plastic power semiconductor flip chip package
SE219304C1 (sv) Förfarande för framställning av en elektrisk kontakt på en oxidöverdragen halvledarskiva jämte enligt sättet framställd kontakt
DE3787671D1 (de) Halbleiterpackung mit Eingang/Ausgang-Verbindungen hoher Dichte.
SE8106859L (sv) Kapa for jc-halvledarbricka
IE37284L (en) Semiconductor device
DE3280202D1 (de) Heterouebergang-halbleitereinrichtung mit hoher elektronenbeweglichkeit.
JPS5675626A (en) Distance measuring device
JPS52101967A (en) Semiconductor device
BR7401204D0 (pt) Aperfeicoamento em dispositivo semicondutor de circuito integrado
JPS5769765A (en) Sealed body of semiconductor device
HK64179A (en) Improvements in or relating to bonding a small object to a substrate
SE218102C1 (sv) Sätt för framställning av en elektriskt osymmetrisk halvledaranordning
GB1189904A (en) Process for Encapsulating Electronic Devices in Plastics and Devices so Produced
JPS55138241A (en) Sealing structure for semiconductor device
JPS54152966A (en) Manufacture of semiconductor integrated-circuit device
NL7606781A (nl) Halfgeleiderinrichting.
JPS5324270A (en) Semiconductor device
GB1494653A (en) Charge coupled devices
CN108172522B (zh) 一种激光制造半导体封装器件的方法
JPS5370766A (en) Semiconductor device
JPS5571050A (en) Semiconductor device
JPS55119071A (en) Characteristics measurement of semiconductor device
JPS5313874A (en) Production of semiconductor device