GB1189904A - Process for Encapsulating Electronic Devices in Plastics and Devices so Produced - Google Patents

Process for Encapsulating Electronic Devices in Plastics and Devices so Produced

Info

Publication number
GB1189904A
GB1189904A GB3032467A GB3032467A GB1189904A GB 1189904 A GB1189904 A GB 1189904A GB 3032467 A GB3032467 A GB 3032467A GB 3032467 A GB3032467 A GB 3032467A GB 1189904 A GB1189904 A GB 1189904A
Authority
GB
United Kingdom
Prior art keywords
wafer
lead
wires
devices
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3032467A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of GB1189904A publication Critical patent/GB1189904A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
    • B29L2031/3055—Cars
    • B29L2031/3061—Number plates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

1,189,904. Semi-conductor devices. TEXAS INSTRUMENTS Inc. 30 June, 1967 [1 July, 1966], No. 30324/67. Heading H1K. A semi-conductor device consists of a semiconductor wafer 22, Fig. 5, bonded to the flattened end of one of a plurality of terminal lead wires, further wires 24, 26 connecting the other lead wires to the wafer. The lead wires are required to be parallel for the greater part of their lengths, but they need not be co-planar: Fig. 5 shows a co-planar and Fig. 12 a non- co-planar arrangement. Plastics encapsulation 42 (not shown in Fig. 5) surrounds the wafer and the lead ends to which it is connected. The device is made by holding the leads frictionally either in a grooved block 10 as in Fig. 5 or in a bore 204 in a block 206 as in Fig. 24. In the latter case the other end of each lead is also flattened and is bent to provide a spring-like portion 202b by which the lead is frictionally held in an enlargement 214 of the bore 204. After securing the wafer, e.g. by gold-foil alloying, to one of the leads and the wires 24, 26 (Fig. 5), or 40, 41 (Fig. 12) to the wafer, the wafer-carrying end of the set of leads is introduced into a mould to which the encapsulating plastics material is supplied. For this purpose a plurality of the blocks 10 or 206 are fitted on each of a pair of trays 84 (Fig. 20, not shown), which are then mounted on a moulding machine which has a mould cavity in each position occupied by a wafer and its adjacent lead ends. The devices are then encapsulated simultaneously.
GB3032467A 1966-07-01 1967-06-30 Process for Encapsulating Electronic Devices in Plastics and Devices so Produced Expired GB1189904A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US56223966A 1966-07-01 1966-07-01

Publications (1)

Publication Number Publication Date
GB1189904A true GB1189904A (en) 1970-04-29

Family

ID=24245413

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3032467A Expired GB1189904A (en) 1966-07-01 1967-06-30 Process for Encapsulating Electronic Devices in Plastics and Devices so Produced

Country Status (5)

Country Link
BR (1) BR6790958D0 (en)
DE (1) DE1614834C2 (en)
GB (1) GB1189904A (en)
MY (1) MY7300360A (en)
NL (1) NL6709059A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5030833B1 (en) * 1970-03-07 1975-10-04
EP0158831A2 (en) * 1984-03-29 1985-10-23 OTLAV S.p.A. Hinge device particularly for frames for doors, windows or the like
EP0202701A1 (en) * 1985-05-14 1986-11-26 Boschman Tooling & Systems B.V. Apparatus for encapsulating electronic components with plastics material
EP0496331A2 (en) * 1991-01-23 1992-07-29 Sumitomo Electric Industries, Ltd. Mold die for manufacturing optical module and manufacturing method using the same
US5275765A (en) * 1991-01-23 1994-01-04 Sumitomo Electric Industries, Ltd. Method of manufacturing an optical module using a mold die

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3703465C2 (en) * 1987-02-05 1998-02-19 Behr Thomson Dehnstoffregler Method of manufacturing an electrical switching device and electrical switching device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1193608B (en) * 1961-06-08 1965-05-26 Elektronik M B H Method and device for measuring, contacting and socketing of semiconductor bodies
DE1439477A1 (en) * 1964-11-30 1969-02-20 Siemens Ag Process for the series production of semiconductor components

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5030833B1 (en) * 1970-03-07 1975-10-04
EP0158831A2 (en) * 1984-03-29 1985-10-23 OTLAV S.p.A. Hinge device particularly for frames for doors, windows or the like
EP0158831A3 (en) * 1984-03-29 1986-06-11 OTLAV S.p.A. Hinge device particularly for frames for doors, windows or the like
EP0202701A1 (en) * 1985-05-14 1986-11-26 Boschman Tooling & Systems B.V. Apparatus for encapsulating electronic components with plastics material
EP0496331A2 (en) * 1991-01-23 1992-07-29 Sumitomo Electric Industries, Ltd. Mold die for manufacturing optical module and manufacturing method using the same
EP0496331A3 (en) * 1991-01-23 1993-02-24 Sumitomo Electric Industries, Ltd. Mold die for manufacturing optical module and manufacturing method using the same
AU638372B2 (en) * 1991-01-23 1993-06-24 Sumitomo Electric Industries, Ltd. Mold die for manufacturing optical module and manufacturing method using the same
US5275765A (en) * 1991-01-23 1994-01-04 Sumitomo Electric Industries, Ltd. Method of manufacturing an optical module using a mold die

Also Published As

Publication number Publication date
BR6790958D0 (en) 1973-07-19
DE1614834C2 (en) 1973-12-13
NL6709059A (en) 1968-01-02
DE1614834B1 (en) 1971-11-11
MY7300360A (en) 1973-12-31

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Legal Events

Date Code Title Description
PS Patent sealed
PE20 Patent expired after termination of 20 years