IT963530B - Dispositivo semiconduttore senza fatica termica - Google Patents

Dispositivo semiconduttore senza fatica termica

Info

Publication number
IT963530B
IT963530B IT27631/72A IT2763172A IT963530B IT 963530 B IT963530 B IT 963530B IT 27631/72 A IT27631/72 A IT 27631/72A IT 2763172 A IT2763172 A IT 2763172A IT 963530 B IT963530 B IT 963530B
Authority
IT
Italy
Prior art keywords
semiconductor device
thermal fatigue
enclosure
substrate
die
Prior art date
Application number
IT27631/72A
Other languages
English (en)
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Application granted granted Critical
Publication of IT963530B publication Critical patent/IT963530B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/132—Containers comprising a conductive base serving as an interconnection having other interconnections through an insulated passage in the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
IT27631/72A 1971-08-26 1972-07-28 Dispositivo semiconduttore senza fatica termica IT963530B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17519671A 1971-08-26 1971-08-26

Publications (1)

Publication Number Publication Date
IT963530B true IT963530B (it) 1974-01-21

Family

ID=22639336

Family Applications (1)

Application Number Title Priority Date Filing Date
IT27631/72A IT963530B (it) 1971-08-26 1972-07-28 Dispositivo semiconduttore senza fatica termica

Country Status (11)

Country Link
US (1) US3735208A (it)
JP (1) JPS4831056A (it)
AU (1) AU463308B2 (it)
BE (1) BE787811A (it)
CA (1) CA967291A (it)
DE (1) DE2240468A1 (it)
FR (1) FR2150488B1 (it)
GB (1) GB1341648A (it)
IT (1) IT963530B (it)
MY (1) MY7400320A (it)
NL (1) NL7211633A (it)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5187736A (it) * 1975-01-31 1976-07-31 Hitachi Ltd
GB2132413A (en) * 1982-12-24 1984-07-04 Plessey Co Plc Microwave device package
US4486511A (en) * 1983-06-27 1984-12-04 National Semiconductor Corporation Solder composition for thin coatings
CH662007A5 (en) * 1983-12-21 1987-08-31 Bbc Brown Boveri & Cie Method of soldering semiconductor components
JPS60234346A (ja) * 1984-05-07 1985-11-21 Nec Corp 半導体装置
US6583673B2 (en) * 2001-02-26 2003-06-24 Infineon Technologies Ag Stability enhanced multistage power amplifier
JP6239840B2 (ja) * 2013-03-27 2017-11-29 ローム株式会社 半導体装置および半導体装置の製造方法
US10319654B1 (en) * 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1048358B (it) * 1955-08-12 1959-01-08
US2986678A (en) * 1957-06-20 1961-05-30 Motorola Inc Semiconductor device
BE584431A (it) * 1959-02-09
GB1064290A (en) * 1963-01-14 1967-04-05 Motorola Inc Method of making semiconductor devices
GB1030540A (en) * 1964-01-02 1966-05-25 Gen Electric Improvements in and relating to semi-conductor diodes
US3331997A (en) * 1964-12-31 1967-07-18 Wagner Electric Corp Silicon diode with solder composition attaching ohmic contacts

Also Published As

Publication number Publication date
FR2150488B1 (it) 1976-01-23
NL7211633A (it) 1973-02-28
JPS4831056A (it) 1973-04-24
AU463308B2 (en) 1975-07-24
GB1341648A (en) 1973-12-25
BE787811A (fr) 1972-12-18
US3735208A (en) 1973-05-22
CA967291A (en) 1975-05-06
FR2150488A1 (it) 1973-04-06
DE2240468A1 (de) 1973-03-01
AU4573272A (en) 1974-03-07
MY7400320A (en) 1974-12-31

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