CH530092A - Einrichtung zur Kühlung von Leistungs-Halbleiterbauelementen - Google Patents
Einrichtung zur Kühlung von Leistungs-HalbleiterbauelementenInfo
- Publication number
- CH530092A CH530092A CH202072A CH202072A CH530092A CH 530092 A CH530092 A CH 530092A CH 202072 A CH202072 A CH 202072A CH 202072 A CH202072 A CH 202072A CH 530092 A CH530092 A CH 530092A
- Authority
- CH
- Switzerland
- Prior art keywords
- power semiconductor
- semiconductor components
- cooling power
- cooling
- components
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19712107010 DE2107010A1 (de) | 1971-02-13 | 1971-02-13 | Einrichtung zur Kühlung von Leistungs-Halbleiterbauelementen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH530092A true CH530092A (de) | 1972-10-31 |
Family
ID=5798757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH202072A CH530092A (de) | 1971-02-13 | 1972-02-14 | Einrichtung zur Kühlung von Leistungs-Halbleiterbauelementen |
Country Status (3)
| Country | Link |
|---|---|
| CH (1) | CH530092A (de) |
| DE (1) | DE2107010A1 (de) |
| FR (1) | FR2125379B1 (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5168919A (en) * | 1990-06-29 | 1992-12-08 | Digital Equipment Corporation | Air cooled heat exchanger for multi-chip assemblies |
| US5198889A (en) * | 1990-06-30 | 1993-03-30 | Kabushiki Kaisha Toshiba | Cooling apparatus |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1406481A (fr) * | 1964-01-16 | 1965-07-23 | Materiel Electrique S W Le | Dispositif de refroidissement d'au moins un boîtier contenant un élément semiconducteur |
-
1971
- 1971-02-13 DE DE19712107010 patent/DE2107010A1/de active Pending
-
1972
- 1972-02-11 FR FR7204623A patent/FR2125379B1/fr not_active Expired
- 1972-02-14 CH CH202072A patent/CH530092A/de not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| DE2107010A1 (de) | 1972-08-17 |
| FR2125379A1 (de) | 1972-09-29 |
| FR2125379B1 (de) | 1975-10-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AT313423B (de) | Kühlvorrichtung für Leistungshalbleiterbauelemente | |
| IT947946B (it) | Dispositivo semiconduttore elettroluminescente | |
| AT361042B (de) | Integrierte halbleiterschaltung | |
| IT956672B (it) | Dispositivo semiconduttore elettroluminescente | |
| SE396995B (sv) | Kondensationsanordning for angturbinkraftverk | |
| AT324371B (de) | Kühlsystem | |
| AT324372B (de) | Kühlsystem | |
| SE394344B (sv) | Anordning for kylning av halvledarkomponenter | |
| IT947244B (it) | Dispositivo semiconduttore | |
| IT975353B (it) | Dispositivo semiconduttore | |
| BE787880A (fr) | Module de refroidissement | |
| IT984607B (it) | Procedimento e dispositivo di raffreddamento | |
| IT959277B (it) | Dispositivo semiconduttore | |
| SE384085B (sv) | Anordning for temperaturmetning | |
| IT956991B (it) | Dispositivo di raffreddamento per convertitore | |
| SE385049B (sv) | Kraftmetanordning | |
| IT957753B (it) | Dispositivo e procedimento per il raffreddamento di corpi | |
| CH530092A (de) | Einrichtung zur Kühlung von Leistungs-Halbleiterbauelementen | |
| IT952873B (it) | Dispositivo semiconduttore | |
| SE386507B (sv) | Kylapparat | |
| IT967178B (it) | Dispositivo di raffreddamento per il raffreddamento di componenti elettronici | |
| IT968868B (it) | Dispoitivo semiconduttore | |
| IT975299B (it) | Dispositivo per il trasporto di pezzi | |
| IT949161B (it) | Dispositivo semiconduttore | |
| CH517379A (de) | Halbleitervorrichtung |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased |