AT313423B - Kühlvorrichtung für Leistungshalbleiterbauelemente - Google Patents

Kühlvorrichtung für Leistungshalbleiterbauelemente

Info

Publication number
AT313423B
AT313423B AT37272A AT37272A AT313423B AT 313423 B AT313423 B AT 313423B AT 37272 A AT37272 A AT 37272A AT 37272 A AT37272 A AT 37272A AT 313423 B AT313423 B AT 313423B
Authority
AT
Austria
Prior art keywords
cooling device
power semiconductor
semiconductor components
components
power
Prior art date
Application number
AT37272A
Other languages
English (en)
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Application granted granted Critical
Publication of AT313423B publication Critical patent/AT313423B/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AT37272A 1971-01-19 1972-01-17 Kühlvorrichtung für Leistungshalbleiterbauelemente AT313423B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19712102254 DE2102254B2 (de) 1971-01-19 1971-01-19 Kuehlvorrichtung fuer leistungshalbleiterbauelemente

Publications (1)

Publication Number Publication Date
AT313423B true AT313423B (de) 1974-02-25

Family

ID=5796241

Family Applications (1)

Application Number Title Priority Date Filing Date
AT37272A AT313423B (de) 1971-01-19 1972-01-17 Kühlvorrichtung für Leistungshalbleiterbauelemente

Country Status (7)

Country Link
US (1) US3817321A (de)
AT (1) AT313423B (de)
DE (1) DE2102254B2 (de)
FR (1) FR2122413B1 (de)
GB (1) GB1372641A (de)
IT (1) IT946683B (de)
SE (1) SE386307B (de)

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DE3422039A1 (de) * 1984-06-14 1985-12-19 BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau Siedekuehlung, insbesondere zur kuehlung von stromrichtern der leistungselektronik
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DE3679978D1 (de) * 1985-12-13 1991-08-01 Hasler Ag Ascom Verfahren und vorrichtung zum abfuehren der verlustwaerme wenigstens einer baugruppe elektrischer elemente.
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US6519955B2 (en) 2000-04-04 2003-02-18 Thermal Form & Function Pumped liquid cooling system using a phase change refrigerant
DE60140837D1 (de) 2000-04-19 2010-02-04 Thermal Form & Function Inc Kühlplatte mit Kühlrippen mit einem verdampfenden Kühlmittel
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US7836597B2 (en) * 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
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US20040112571A1 (en) * 2002-11-01 2004-06-17 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
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US7201012B2 (en) * 2003-01-31 2007-04-10 Cooligy, Inc. Remedies to prevent cracking in a liquid system
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US7044196B2 (en) * 2003-01-31 2006-05-16 Cooligy,Inc Decoupled spring-loaded mounting apparatus and method of manufacturing thereof
US7293423B2 (en) * 2004-06-04 2007-11-13 Cooligy Inc. Method and apparatus for controlling freezing nucleation and propagation
US7017654B2 (en) * 2003-03-17 2006-03-28 Cooligy, Inc. Apparatus and method of forming channels in a heat-exchanging device
US20040182551A1 (en) * 2003-03-17 2004-09-23 Cooligy, Inc. Boiling temperature design in pumped microchannel cooling loops
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US7017655B2 (en) * 2003-12-18 2006-03-28 Modine Manufacturing Co. Forced fluid heat sink
JP4409976B2 (ja) * 2004-02-03 2010-02-03 山洋電気株式会社 電子部品冷却装置
CN100339984C (zh) * 2004-04-08 2007-09-26 台达电子工业股份有限公司 散热模组
US7188662B2 (en) * 2004-06-04 2007-03-13 Cooligy, Inc. Apparatus and method of efficient fluid delivery for cooling a heat producing device
US7616444B2 (en) 2004-06-04 2009-11-10 Cooligy Inc. Gimballed attachment for multiple heat exchangers
EP1607707A1 (de) * 2004-06-18 2005-12-21 Ecole Polytechnique Federale De Lausanne (Epfl) Blasengenerator und Wärmetauschervorrichtung
US20060042785A1 (en) * 2004-08-27 2006-03-02 Cooligy, Inc. Pumped fluid cooling system and method
US20060118279A1 (en) * 2004-12-07 2006-06-08 Eric Stafford Water cooling system for computer components
US20060131003A1 (en) * 2004-12-20 2006-06-22 Je-Young Chang Apparatus and associated method for microelectronic cooling
US7506682B2 (en) * 2005-01-21 2009-03-24 Delphi Technologies, Inc. Liquid cooled thermosiphon for electronic components
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US20070114010A1 (en) * 2005-11-09 2007-05-24 Girish Upadhya Liquid cooling for backlit displays
US7913719B2 (en) * 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
EP1987309B1 (de) * 2006-02-16 2014-04-16 Cooligy, Inc. Flüssigkeitskühlungsschleifen für serveranwendungen
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JP5117101B2 (ja) * 2007-05-08 2013-01-09 株式会社東芝 蒸発器およびこれを用いた循環型冷却装置
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US20090225514A1 (en) 2008-03-10 2009-09-10 Adrian Correa Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
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US8302419B2 (en) * 2008-05-02 2012-11-06 Thermal Take Technology Co., Ltd. Computer cooling apparatus
US8299604B2 (en) 2008-08-05 2012-10-30 Cooligy Inc. Bonded metal and ceramic plates for thermal management of optical and electronic devices
US20110073292A1 (en) * 2009-09-30 2011-03-31 Madhav Datta Fabrication of high surface area, high aspect ratio mini-channels and their application in liquid cooling systems
JP5813300B2 (ja) * 2010-08-23 2015-11-17 三桜工業株式会社 冷却装置
JP5386564B2 (ja) * 2011-09-28 2014-01-15 山洋電気株式会社 電子部品冷却装置
WO2014038179A1 (ja) * 2012-09-05 2014-03-13 パナソニック株式会社 冷却装置、これを搭載した電気自動車、および電子機器
TWI531795B (zh) 2013-03-15 2016-05-01 水冷系統公司 感測器、多工通信技術及相關系統
US9861012B2 (en) * 2014-10-21 2018-01-02 International Business Machines Corporation Multifunction coolant manifold structures
CN106358420B (zh) * 2015-07-15 2020-05-19 宏碁股份有限公司 散热模块
US9835382B2 (en) * 2015-09-16 2017-12-05 Acer Incorporated Thermal dissipation module
TWI639379B (zh) * 2017-12-26 2018-10-21 訊凱國際股份有限公司 散熱結構
JP7124425B2 (ja) * 2018-05-02 2022-08-24 富士電機株式会社 冷却装置、半導体モジュールおよび車両
US11201102B2 (en) * 2018-05-10 2021-12-14 International Business Machines Corporation Module lid with embedded two-phase cooling and insulating layer
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US3586101A (en) * 1969-12-22 1971-06-22 Ibm Cooling system for data processing equipment

Also Published As

Publication number Publication date
SE386307B (sv) 1976-08-02
FR2122413B1 (de) 1975-02-07
US3817321A (en) 1974-06-18
DE2102254B2 (de) 1973-05-30
DE2102254A1 (de) 1972-08-10
FR2122413A1 (de) 1972-09-01
IT946683B (it) 1973-05-21
GB1372641A (en) 1974-11-06

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee