CH440464A - Kühlkörper für Halbleiterelemente - Google Patents

Kühlkörper für Halbleiterelemente

Info

Publication number
CH440464A
CH440464A CH1025166A CH1025166A CH440464A CH 440464 A CH440464 A CH 440464A CH 1025166 A CH1025166 A CH 1025166A CH 1025166 A CH1025166 A CH 1025166A CH 440464 A CH440464 A CH 440464A
Authority
CH
Switzerland
Prior art keywords
semiconductor elements
heat sinks
sinks
heat
semiconductor
Prior art date
Application number
CH1025166A
Other languages
English (en)
Inventor
Schaerli Otto
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Priority to CH1025166A priority Critical patent/CH440464A/de
Priority to DE19661539656 priority patent/DE1539656A1/de
Priority to US628675A priority patent/US3366171A/en
Priority to SE9943/67*A priority patent/SE311956B/xx
Priority to FR114021A priority patent/FR1538433A/fr
Priority to GB32099/67A priority patent/GB1120926A/en
Publication of CH440464A publication Critical patent/CH440464A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CH1025166A 1966-07-14 1966-07-14 Kühlkörper für Halbleiterelemente CH440464A (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CH1025166A CH440464A (de) 1966-07-14 1966-07-14 Kühlkörper für Halbleiterelemente
DE19661539656 DE1539656A1 (de) 1966-07-14 1966-08-08 Kuehlkoerper fuer Halbleiterelemente
US628675A US3366171A (en) 1966-07-14 1967-04-05 Heat sink for semi-conductor elements
SE9943/67*A SE311956B (de) 1966-07-14 1967-06-30
FR114021A FR1538433A (fr) 1966-07-14 1967-07-12 Refroidisseur pour éléments à semi-conducteurs
GB32099/67A GB1120926A (en) 1966-07-14 1967-07-12 Heat sink for semi-conductor elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1025166A CH440464A (de) 1966-07-14 1966-07-14 Kühlkörper für Halbleiterelemente

Publications (1)

Publication Number Publication Date
CH440464A true CH440464A (de) 1967-07-31

Family

ID=4361126

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1025166A CH440464A (de) 1966-07-14 1966-07-14 Kühlkörper für Halbleiterelemente

Country Status (5)

Country Link
US (1) US3366171A (de)
CH (1) CH440464A (de)
DE (1) DE1539656A1 (de)
GB (1) GB1120926A (de)
SE (1) SE311956B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0092720A1 (de) * 1982-04-23 1983-11-02 Siemens Aktiengesellschaft Einspannvorrichtung für scheibenförmige Halbleiter-Bauelemente

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3519888A (en) * 1968-08-12 1970-07-07 Int Rectifier Corp High voltage stack having metallic enclosure
GB8325320D0 (en) * 1983-09-21 1983-10-26 Plessey Co Plc Diamond heatsink assemblies
US4614964A (en) * 1984-08-15 1986-09-30 Sundstrand Corporation Coaxial semiconductor package
US4581695A (en) * 1984-12-12 1986-04-08 Sundstrand Corporation Rectifier assembly
US4610299A (en) * 1985-04-01 1986-09-09 S.I.E., Inc. Spring-biased heat sink
US5005638A (en) * 1988-10-31 1991-04-09 International Business Machines Corporation Thermal conduction module with barrel shaped piston for improved heat transfer
US5398748A (en) * 1991-06-05 1995-03-21 Fujitsu Limited Heat pipe connector and electronic apparatus and radiating fins having such connector
US5172756A (en) * 1991-06-21 1992-12-22 Northern Telecom Limited Heat sink
US5184281A (en) * 1992-03-03 1993-02-02 Digital Equipment Corporation Heat dissipation apparatus
US5396404A (en) * 1993-09-20 1995-03-07 Delco Electronics Corp. Heat sinking assembly for electrical components
US5504653A (en) * 1994-11-21 1996-04-02 Delco Electronics Corp. Heat sinking assembly for electrical components
US5794685A (en) * 1996-12-17 1998-08-18 Hewlett-Packard Company Heat sink device having radial heat and airflow paths
US5852339A (en) * 1997-06-18 1998-12-22 Northrop Grumman Corporation Affordable electrodeless lighting
US6038156A (en) * 1998-06-09 2000-03-14 Heart Interface Corporation Power inverter with improved heat sink configuration
US6176299B1 (en) 1999-02-22 2001-01-23 Agilent Technologies, Inc. Cooling apparatus for electronic devices
US6628521B2 (en) 2000-11-06 2003-09-30 Adc Telecommunications, Inc. Mechanical housing
US6897377B2 (en) * 2001-07-31 2005-05-24 Adc Telecommunications, Inc. Clamping receptacle
US6894907B2 (en) * 2001-07-31 2005-05-17 Adc Telecommunications, Inc. Clamping case
US6862180B2 (en) * 2002-05-24 2005-03-01 Adc Dsl Systems, Inc. Housings for circuit cards
US6781830B2 (en) * 2002-11-05 2004-08-24 Adc Dsl Systems, Inc. Methods and systems of heat transfer for electronic enclosures
US7120023B2 (en) * 2003-08-25 2006-10-10 Hewlett-Packard Development Company, L.P. Method of assembly of a wedge thermal interface to allow expansion after assembly
US6865085B1 (en) 2003-09-26 2005-03-08 Adc Dsl Systems, Inc. Heat dissipation for electronic enclosures
EP2787529B1 (de) * 2011-11-30 2018-05-23 Mitsubishi Electric Corporation Halbleitervorrichtung und bordinterne leistungsumwandlungsvorrichtung
DE102015206992A1 (de) * 2015-04-17 2016-10-20 Zf Friedrichshafen Ag Anbindung eines Leistungsbauteils an einen Kühlkörper

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1094755A (de) * 1955-01-20 1955-05-24
US2879977A (en) * 1957-07-11 1959-03-31 Trought Associates Inc Mounting device
NL136972C (de) * 1961-08-04 1900-01-01
DE1184000B (de) * 1962-05-18 1964-12-23 Siemens Ag Einbau eines scheibenfoermigen elektrischen Halbleiterbauelementes in einer Aussparung eines anderen Konstruktionsteiles, insbesondere einem Gehaeuse einer elektrischen Maschine oder einem von diesem getragenen Zusatzteil
US3301315A (en) * 1965-03-12 1967-01-31 James E Webb Thermal conductive connection and method of making same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0092720A1 (de) * 1982-04-23 1983-11-02 Siemens Aktiengesellschaft Einspannvorrichtung für scheibenförmige Halbleiter-Bauelemente

Also Published As

Publication number Publication date
GB1120926A (en) 1968-07-24
SE311956B (de) 1969-06-30
DE1539656A1 (de) 1969-11-20
US3366171A (en) 1968-01-30

Similar Documents

Publication Publication Date Title
CH440464A (de) Kühlkörper für Halbleiterelemente
FR1523867A (fr) Microcircuits semiconducteurs
BR6684160D0 (pt) Microcircuitos semicondutores monaliticos
CH474851A (de) Halbleiteranordnung
CH438497A (de) Halbleiteranordnung
CH406446A (de) Halbleiterbauelement
AT265432B (de) Halbleiterbauelement
CH444318A (de) Halbleiterbauelement
CH469357A (de) Halbleiteranordnung
CH454279A (de) Halbleiterventil
AT264623B (de) Thermoelektrische Halbleitereinrichtung
CH463628A (de) Halbleiterbauteil
FR1481737A (fr) Semi-conducteur
CH427043A (de) Halbleitervorrichtung
CH477093A (de) Halbleiterelement
CH458545A (de) Halbleiterelement
AT303195B (de) Kühlkörper für Halbleiterbauelemente
CH446539A (de) Halbleiterbauelement
CH399601A (de) Halbleiteranordnung
CH461644A (de) Halbleiterbauelement
AT266218B (de) Halbleiterbauelement
FR1508699A (fr) Evier
CH452060A (de) Halbleiterbauelement
CH428007A (de) Halbleiterbauelement
FR1513630A (fr) Circuit semi-conducteur