CH440464A - Kühlkörper für Halbleiterelemente - Google Patents

Kühlkörper für Halbleiterelemente

Info

Publication number
CH440464A
CH440464A CH1025166A CH1025166A CH440464A CH 440464 A CH440464 A CH 440464A CH 1025166 A CH1025166 A CH 1025166A CH 1025166 A CH1025166 A CH 1025166A CH 440464 A CH440464 A CH 440464A
Authority
CH
Switzerland
Prior art keywords
semiconductor elements
heat sinks
sinks
heat
semiconductor
Prior art date
Application number
CH1025166A
Other languages
English (en)
Inventor
Schaerli Otto
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Priority to CH1025166A priority Critical patent/CH440464A/de
Priority to DE19661539656 priority patent/DE1539656A1/de
Priority to US628675A priority patent/US3366171A/en
Priority to SE9943/67*A priority patent/SE311956B/xx
Priority to FR114021A priority patent/FR1538433A/fr
Priority to GB32099/67A priority patent/GB1120926A/en
Publication of CH440464A publication Critical patent/CH440464A/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/625—Clamping parts not primarily conducting heat
CH1025166A 1966-07-14 1966-07-14 Kühlkörper für Halbleiterelemente CH440464A (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CH1025166A CH440464A (de) 1966-07-14 1966-07-14 Kühlkörper für Halbleiterelemente
DE19661539656 DE1539656A1 (de) 1966-07-14 1966-08-08 Kuehlkoerper fuer Halbleiterelemente
US628675A US3366171A (en) 1966-07-14 1967-04-05 Heat sink for semi-conductor elements
SE9943/67*A SE311956B (de) 1966-07-14 1967-06-30
FR114021A FR1538433A (fr) 1966-07-14 1967-07-12 Refroidisseur pour éléments à semi-conducteurs
GB32099/67A GB1120926A (en) 1966-07-14 1967-07-12 Heat sink for semi-conductor elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1025166A CH440464A (de) 1966-07-14 1966-07-14 Kühlkörper für Halbleiterelemente

Publications (1)

Publication Number Publication Date
CH440464A true CH440464A (de) 1967-07-31

Family

ID=4361126

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1025166A CH440464A (de) 1966-07-14 1966-07-14 Kühlkörper für Halbleiterelemente

Country Status (5)

Country Link
US (1) US3366171A (de)
CH (1) CH440464A (de)
DE (1) DE1539656A1 (de)
GB (1) GB1120926A (de)
SE (1) SE311956B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0092720A1 (de) * 1982-04-23 1983-11-02 Siemens Aktiengesellschaft Einspannvorrichtung für scheibenförmige Halbleiter-Bauelemente

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3519888A (en) * 1968-08-12 1970-07-07 Int Rectifier Corp High voltage stack having metallic enclosure
GB8325320D0 (en) * 1983-09-21 1983-10-26 Plessey Co Plc Diamond heatsink assemblies
US4614964A (en) * 1984-08-15 1986-09-30 Sundstrand Corporation Coaxial semiconductor package
US4581695A (en) * 1984-12-12 1986-04-08 Sundstrand Corporation Rectifier assembly
US4610299A (en) * 1985-04-01 1986-09-09 S.I.E., Inc. Spring-biased heat sink
US5005638A (en) * 1988-10-31 1991-04-09 International Business Machines Corporation Thermal conduction module with barrel shaped piston for improved heat transfer
US5398748A (en) * 1991-06-05 1995-03-21 Fujitsu Limited Heat pipe connector and electronic apparatus and radiating fins having such connector
US5172756A (en) * 1991-06-21 1992-12-22 Northern Telecom Limited Heat sink
US5184281A (en) * 1992-03-03 1993-02-02 Digital Equipment Corporation Heat dissipation apparatus
US5396404A (en) * 1993-09-20 1995-03-07 Delco Electronics Corp. Heat sinking assembly for electrical components
US5504653A (en) * 1994-11-21 1996-04-02 Delco Electronics Corp. Heat sinking assembly for electrical components
US5794685A (en) * 1996-12-17 1998-08-18 Hewlett-Packard Company Heat sink device having radial heat and airflow paths
US5852339A (en) * 1997-06-18 1998-12-22 Northrop Grumman Corporation Affordable electrodeless lighting
US6038156A (en) * 1998-06-09 2000-03-14 Heart Interface Corporation Power inverter with improved heat sink configuration
US6176299B1 (en) 1999-02-22 2001-01-23 Agilent Technologies, Inc. Cooling apparatus for electronic devices
US6628521B2 (en) 2000-11-06 2003-09-30 Adc Telecommunications, Inc. Mechanical housing
US6897377B2 (en) * 2001-07-31 2005-05-24 Adc Telecommunications, Inc. Clamping receptacle
US6894907B2 (en) 2001-07-31 2005-05-17 Adc Telecommunications, Inc. Clamping case
US6862180B2 (en) * 2002-05-24 2005-03-01 Adc Dsl Systems, Inc. Housings for circuit cards
US6781830B2 (en) * 2002-11-05 2004-08-24 Adc Dsl Systems, Inc. Methods and systems of heat transfer for electronic enclosures
US7120023B2 (en) * 2003-08-25 2006-10-10 Hewlett-Packard Development Company, L.P. Method of assembly of a wedge thermal interface to allow expansion after assembly
US6865085B1 (en) 2003-09-26 2005-03-08 Adc Dsl Systems, Inc. Heat dissipation for electronic enclosures
CN103975430B (zh) * 2011-11-30 2016-12-07 三菱电机株式会社 半导体装置及车载用功率转换装置
DE102015206992A1 (de) * 2015-04-17 2016-10-20 Zf Friedrichshafen Ag Anbindung eines Leistungsbauteils an einen Kühlkörper

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1094755A (de) * 1955-01-20 1955-05-24
US2879977A (en) * 1957-07-11 1959-03-31 Trought Associates Inc Mounting device
NL288523A (de) * 1961-08-04 1900-01-01
DE1184000B (de) * 1962-05-18 1964-12-23 Siemens Ag Einbau eines scheibenfoermigen elektrischen Halbleiterbauelementes in einer Aussparung eines anderen Konstruktionsteiles, insbesondere einem Gehaeuse einer elektrischen Maschine oder einem von diesem getragenen Zusatzteil
US3301315A (en) * 1965-03-12 1967-01-31 James E Webb Thermal conductive connection and method of making same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0092720A1 (de) * 1982-04-23 1983-11-02 Siemens Aktiengesellschaft Einspannvorrichtung für scheibenförmige Halbleiter-Bauelemente

Also Published As

Publication number Publication date
GB1120926A (en) 1968-07-24
SE311956B (de) 1969-06-30
US3366171A (en) 1968-01-30
DE1539656A1 (de) 1969-11-20

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