CA1086430A - Method and apparatus for the assembly of semiconductor devices - Google Patents

Method and apparatus for the assembly of semiconductor devices

Info

Publication number
CA1086430A
CA1086430A CA177,075A CA177075A CA1086430A CA 1086430 A CA1086430 A CA 1086430A CA 177075 A CA177075 A CA 177075A CA 1086430 A CA1086430 A CA 1086430A
Authority
CA
Canada
Prior art keywords
lead frame
film
pattern
bonding tool
strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA177,075A
Other languages
English (en)
French (fr)
Inventor
Terry W. Noe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of CA1086430A publication Critical patent/CA1086430A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W72/071—
    • H10W72/0198—
    • H10P72/0446—
    • H10W70/438—
    • H10W70/453—
    • H10W70/468—
    • H10W72/077—
    • H10W72/50—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H10W72/07336—
    • H10W74/00—
    • H10W90/736—

Landscapes

  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CA177,075A 1973-01-02 1973-07-23 Method and apparatus for the assembly of semiconductor devices Expired CA1086430A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US320,349 1973-01-02
US320349A US3859718A (en) 1973-01-02 1973-01-02 Method and apparatus for the assembly of semiconductor devices

Publications (1)

Publication Number Publication Date
CA1086430A true CA1086430A (en) 1980-09-23

Family

ID=23246002

Family Applications (1)

Application Number Title Priority Date Filing Date
CA177,075A Expired CA1086430A (en) 1973-01-02 1973-07-23 Method and apparatus for the assembly of semiconductor devices

Country Status (14)

Country Link
US (1) US3859718A (enExample)
JP (2) JPS5751732B2 (enExample)
KR (1) KR780000595B1 (enExample)
BR (1) BR7309074D0 (enExample)
CA (1) CA1086430A (enExample)
DD (1) DD107812A5 (enExample)
DE (1) DE2363833C2 (enExample)
FR (1) FR2212642B1 (enExample)
GB (1) GB1447524A (enExample)
HU (1) HU167861B (enExample)
IT (1) IT991996B (enExample)
PH (1) PH9927A (enExample)
PL (1) PL87007B1 (enExample)
RO (1) RO64695A (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3949925A (en) * 1974-10-03 1976-04-13 The Jade Corporation Outer lead bonder
CA1052912A (en) * 1975-07-07 1979-04-17 National Semiconductor Corporation Gang bonding interconnect tape for semiconductive devices and method of making same
US4099660A (en) * 1975-10-31 1978-07-11 National Semiconductor Corporation Apparatus for and method of shaping interconnect leads
US4166562A (en) * 1977-09-01 1979-09-04 The Jade Corporation Assembly system for microcomponent devices such as semiconductor devices
US4330790A (en) * 1980-03-24 1982-05-18 National Semiconductor Corporation Tape operated semiconductor device packaging
EP0064496A1 (en) * 1980-11-07 1982-11-17 Mostek Corporation Multiple terminal two conductor layer burn-in tape
US4331831A (en) * 1980-11-28 1982-05-25 Bell Telephone Laboratories, Incorporated Package for semiconductor integrated circuits
US4409733A (en) * 1981-01-26 1983-10-18 Integrated Machine Development Means and method for processing integrated circuit element
JPS5922386A (ja) * 1982-07-07 1984-02-04 アルカテル・エヌ・ブイ 電子部品構造体
US4754912A (en) * 1984-04-05 1988-07-05 National Semiconductor Corporation Controlled collapse thermocompression gang bonding
JPS60229345A (ja) * 1984-04-27 1985-11-14 Toshiba Corp 半導体装置
DE3686990T2 (de) * 1985-08-23 1993-04-22 Nippon Electric Co Verfahren zum herstellen einer halbleiteranordnung wobei ein filmtraegerband angewendet wird.
FR2590052B1 (fr) * 1985-11-08 1991-03-01 Eurotechnique Sa Procede de recyclage d'une carte comportant un composant, carte prevue pour etre recyclee
US5038453A (en) * 1988-07-22 1991-08-13 Rohm Co., Ltd. Method of manufacturing semiconductor devices, and leadframe and differential overlapping apparatus therefor
US4985988A (en) * 1989-11-03 1991-01-22 Motorola, Inc. Method for assembling, testing, and packaging integrated circuits
US5528397A (en) * 1991-12-03 1996-06-18 Kopin Corporation Single crystal silicon transistors for display panels
US6087195A (en) 1998-10-15 2000-07-11 Handy & Harman Method and system for manufacturing lamp tiles
JP5167779B2 (ja) * 2007-11-16 2013-03-21 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US20160056095A1 (en) * 2014-08-25 2016-02-25 Infineon Technologies Ag Leadframe Strip with Sawing Enhancement Feature

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3544857A (en) * 1966-08-16 1970-12-01 Signetics Corp Integrated circuit assembly with lead structure and method
US3442432A (en) * 1967-06-15 1969-05-06 Western Electric Co Bonding a beam-leaded device to a substrate
US3689991A (en) * 1968-03-01 1972-09-12 Gen Electric A method of manufacturing a semiconductor device utilizing a flexible carrier
US3698074A (en) * 1970-06-29 1972-10-17 Motorola Inc Contact bonding and packaging of integrated circuits
US3698073A (en) * 1970-10-13 1972-10-17 Motorola Inc Contact bonding and packaging of integrated circuits
US3793714A (en) * 1971-05-27 1974-02-26 Texas Instruments Inc Integrated circuit assembly using etched metal patterns of flexible insulating film

Also Published As

Publication number Publication date
JPS57164556A (en) 1982-10-09
FR2212642B1 (enExample) 1978-11-10
JPS5751732B2 (enExample) 1982-11-04
DE2363833C2 (de) 1987-01-22
BR7309074D0 (pt) 1974-10-22
DD107812A5 (enExample) 1974-08-12
HU167861B (enExample) 1975-12-25
PL87007B1 (enExample) 1976-06-30
DE2363833A1 (de) 1974-07-04
IT991996B (it) 1975-08-30
JPS4999477A (enExample) 1974-09-19
RO64695A (ro) 1980-06-15
GB1447524A (en) 1976-08-25
PH9927A (en) 1976-06-14
US3859718A (en) 1975-01-14
KR780000595B1 (en) 1978-11-23
FR2212642A1 (enExample) 1974-07-26

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