IN2015DN00551A - - Google Patents

Info

Publication number
IN2015DN00551A
IN2015DN00551A IN551DEN2015A IN2015DN00551A IN 2015DN00551 A IN2015DN00551 A IN 2015DN00551A IN 551DEN2015 A IN551DEN2015 A IN 551DEN2015A IN 2015DN00551 A IN2015DN00551 A IN 2015DN00551A
Authority
IN
India
Prior art keywords
insulating layer
elasticity modulus
layer
sandwiched
substrate
Prior art date
Application number
Other languages
English (en)
Inventor
Ryoichi Suganuma
Hirofumi Arima
Satoru Suzuki
Takuya Sato
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of IN2015DN00551A publication Critical patent/IN2015DN00551A/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Studio Devices (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Non-Volatile Memory (AREA)
IN551DEN2015 2012-06-22 2013-03-13 IN2015DN00551A (enrdf_load_stackoverflow)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012141508 2012-06-22
JP2012177980 2012-08-10
JP2012179095 2012-08-10
PCT/JP2013/001678 WO2013190748A1 (ja) 2012-06-22 2013-03-13 基板、撮像ユニットおよび撮像装置

Publications (1)

Publication Number Publication Date
IN2015DN00551A true IN2015DN00551A (enrdf_load_stackoverflow) 2015-06-26

Family

ID=49768363

Family Applications (1)

Application Number Title Priority Date Filing Date
IN551DEN2015 IN2015DN00551A (enrdf_load_stackoverflow) 2012-06-22 2013-03-13

Country Status (6)

Country Link
US (3) US9743510B2 (enrdf_load_stackoverflow)
EP (2) EP3592121B1 (enrdf_load_stackoverflow)
JP (3) JPWO2013190748A1 (enrdf_load_stackoverflow)
CN (2) CN104584701B (enrdf_load_stackoverflow)
IN (1) IN2015DN00551A (enrdf_load_stackoverflow)
WO (1) WO2013190748A1 (enrdf_load_stackoverflow)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2013190748A1 (ja) * 2012-06-22 2016-02-08 株式会社ニコン 基板、撮像ユニットおよび撮像装置
KR101816967B1 (ko) * 2013-09-30 2018-01-09 주식회사 엘지화학 유기전자소자용 기판 및 이의 제조방법
JP6357784B2 (ja) * 2014-02-03 2018-07-18 株式会社ニコン 撮像ユニット及び撮像装置
JP6363712B2 (ja) * 2014-07-18 2018-07-25 株式会社Ｆｕｊｉ 撮像装置
CN108391451B (zh) * 2015-11-24 2022-09-13 索尼公司 图像拾取元件封装件及其制造方法、图像拾取装置
DE212016000255U1 (de) * 2015-12-25 2018-08-09 Taiyo Yuden Co., Ltd. Leiterplatte und Kameramodul
JP6972523B2 (ja) * 2016-09-13 2021-11-24 セイコーエプソン株式会社 電子機器
US10133158B2 (en) * 2016-10-17 2018-11-20 Panasonic Intellectual Property Management Co., Ltd. Imaging device
JP7383866B2 (ja) * 2017-01-09 2023-11-21 サムソン エレクトロ－メカニックス カンパニーリミテッド． プリント回路基板
JP2018120968A (ja) * 2017-01-25 2018-08-02 太陽誘電株式会社 プリント配線板、プリント配線板を用いたモジュールおよびプリント配線板を用いたカメラモジュール
US10580725B2 (en) * 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
JP6745770B2 (ja) * 2017-08-22 2020-08-26 太陽誘電株式会社 回路基板
JP6783724B2 (ja) * 2017-08-22 2020-11-11 太陽誘電株式会社 回路基板
US10602608B2 (en) 2017-08-22 2020-03-24 Taiyo Yuden Co., Ltd. Circuit board
JP2019076358A (ja) * 2017-10-24 2019-05-23 オリンパス株式会社 撮像モジュール、内視鏡、撮像モジュールの製造方法
DE102018109920A1 (de) * 2018-04-25 2019-10-31 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Kühlung von leistungselektronischen Schaltungen
TW202015208A (zh) * 2018-10-09 2020-04-16 南茂科技股份有限公司 基板結構以及半導體封裝
JP2020064998A (ja) * 2018-10-18 2020-04-23 キヤノン株式会社 実装基板およびその製造方法
US11622064B2 (en) * 2018-11-20 2023-04-04 Lg Innotek Co., Ltd. Substrate for image sensor
DE112020003363T5 (de) * 2019-07-12 2022-03-24 Sony Semiconductor Solutions Corporation Verdrahtungsmodul und abbildungsvorrichtung
US12022859B2 (en) * 2019-07-18 2024-07-02 R.J. Reynolds Tobacco Company Thermal energy absorbers for tobacco heating products
CN114450795A (zh) * 2019-09-30 2022-05-06 株式会社尼康 拍摄元件及拍摄装置
US20230005976A1 (en) * 2020-01-22 2023-01-05 Hitachi Astemo, Ltd. Imaging device
US12150237B2 (en) * 2020-05-06 2024-11-19 Veea Inc. Method and procedure for miniaturing a multi-layer PCB
US12035060B2 (en) * 2021-11-05 2024-07-09 Omnivision Technologies, Inc. Stacked image sensor

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6473695A (en) * 1987-09-14 1989-03-17 Mitsubishi Plastics Ind Substrate for printed-circuit board
JP2875076B2 (ja) * 1990-11-29 1999-03-24 三井化学株式会社 フレキシブル配線基板
JPH07307572A (ja) * 1994-05-13 1995-11-21 Cmk Corp フレキシブルプリント配線板およびリジッド・フレックスプリント配線板
JP3817453B2 (ja) * 2001-09-25 2006-09-06 新光電気工業株式会社 半導体装置
JP2003110892A (ja) * 2001-09-26 2003-04-11 Sanyo Electric Co Ltd カメラモジュール
JP4387076B2 (ja) * 2001-10-18 2009-12-16 株式会社ルネサステクノロジ 半導体装置
JP2003234926A (ja) * 2002-02-08 2003-08-22 Seiko Precision Inc 固体撮像装置
JP2004356569A (ja) 2003-05-30 2004-12-16 Shinko Electric Ind Co Ltd 半導体装置用パッケージ
JP2005203420A (ja) * 2004-01-13 2005-07-28 Murata Mach Ltd 電子回路基板
JP4089629B2 (ja) * 2004-01-27 2008-05-28 カシオ計算機株式会社 光センサモジュール
TWI296154B (en) * 2004-01-27 2008-04-21 Casio Computer Co Ltd Optical sensor module
JP2005284147A (ja) 2004-03-30 2005-10-13 Fuji Photo Film Co Ltd 撮像装置
EP1753278A4 (en) * 2004-05-27 2010-05-19 Ibiden Co Ltd MULTILAYER PRINTED CIRCUIT BOARD
JP2007028430A (ja) * 2005-07-20 2007-02-01 Kyocera Corp カメラモジュール
CN101233190B (zh) * 2005-07-28 2011-12-07 日本电气株式会社 绝缘材料、布线板和半导体器件
JP2007150101A (ja) * 2005-11-29 2007-06-14 Sony Corp モジュール基板及び撮像装置
CN101321813B (zh) * 2005-12-01 2012-07-04 住友电木株式会社 预成型料、预成型料的制造方法、基板及半导体装置
MY146044A (en) * 2005-12-01 2012-06-15 Sumitomo Bakelite Co Prepreg, method for manufacturing prepreg, substrate, and semiconductor device
JP4983190B2 (ja) * 2006-10-02 2012-07-25 住友ベークライト株式会社 プリプレグ、回路基板および半導体装置
JP5040921B2 (ja) * 2006-11-10 2012-10-03 日本電気株式会社 多層配線基板
CN101803482A (zh) * 2007-07-13 2010-08-11 揖斐电株式会社 布线基板及其制造方法
WO2009081518A1 (ja) * 2007-12-26 2009-07-02 Panasonic Corporation 半導体装置および多層配線基板
WO2009122680A1 (ja) * 2008-03-31 2009-10-08 住友ベークライト株式会社 多層回路基板、絶縁シート、および多層回路基板を用いた半導体パッケージ
JP5397037B2 (ja) 2009-06-25 2014-01-22 株式会社ニコン 固体撮像装置
JP2011059272A (ja) 2009-09-08 2011-03-24 Canon Inc 撮像装置
CN102550138B (zh) * 2009-09-28 2015-07-22 京瓷株式会社 结构体及其制造方法
JP2011228676A (ja) * 2010-03-29 2011-11-10 Kyocera Corp 配線基板およびその実装構造体
JP5582904B2 (ja) 2010-07-22 2014-09-03 矢崎総業株式会社 メタルコア基板とその製造方法
US20130149514A1 (en) * 2010-07-30 2013-06-13 Kyocera Corporation Insulating sheet, method of manufacturing the same, and method of manufacturing structure using the insulating sheet
JPWO2013190748A1 (ja) * 2012-06-22 2016-02-08 株式会社ニコン 基板、撮像ユニットおよび撮像装置
JP6099734B2 (ja) * 2013-03-27 2017-03-22 京セラ株式会社 配線基板およびこれを用いた実装構造体

Also Published As

Publication number Publication date
CN109616485A (zh) 2019-04-12
EP2866535A1 (en) 2015-04-29
EP3592121A1 (en) 2020-01-08
JP6711370B2 (ja) 2020-06-17
CN104584701A (zh) 2015-04-29
US20150181698A1 (en) 2015-06-25
EP2866535B1 (en) 2019-09-04
JPWO2013190748A1 (ja) 2016-02-08
EP3592121B1 (en) 2021-02-17
US20190350076A1 (en) 2019-11-14
EP2866535A4 (en) 2016-03-16
US11343907B2 (en) 2022-05-24
WO2013190748A1 (ja) 2013-12-27
CN109616485B (zh) 2024-08-27
US10412824B2 (en) 2019-09-10
US9743510B2 (en) 2017-08-22
CN104584701B (zh) 2018-11-13
JP2018029180A (ja) 2018-02-22
JP2018166207A (ja) 2018-10-25
US20170374735A1 (en) 2017-12-28
JP6344516B2 (ja) 2018-06-20

Similar Documents

Publication Publication Date Title
IN2015DN00551A (enrdf_load_stackoverflow)
GB2497451A (en) Gate insulator layer for electronic devices
EP2992562A4 (en) Stress relieving semiconductor layer
PH12013502578A1 (en) Absorbent core for disposable absorbent articles
EP4145836B8 (en) Associating playback devices with playback queues
EP3058586A4 (en) Integrated circuit package substrate
EP3024424A4 (en) Moldable adhesive wafers
EP2981413A4 (en) Polyimide cover substrate
MY163250A (en) MAGNETIC STACK INCLUDING MgO-Ti(ON) INTERLAYER
BR112012022488A2 (pt) laminação de dispositivo eletrocrômico em substratos de vidro
IN2015DN03050A (enrdf_load_stackoverflow)
BR112013026310A2 (pt) cabos de transmissão elétrica com núcleos compósitos
EP3079911A4 (en) Ink-based layer fabrication using halftoning to control thickness
WO2014195482A3 (en) Organic electronic device
IN2014CN03520A (enrdf_load_stackoverflow)
EP3041043A4 (en) Assembly and power-module substrate
WO2012138903A3 (en) Dual active layers for semiconductor devices and methods of manufacturing the same
CL2012003550A1 (es) Antena inductiva que comprende un sustrato aislante, una primera bobina conductora plana y una segunda bobina conductora plana sobre una segunda superficie del sustrato
EP3032576A4 (en) Oxide semiconductor layer and production method therefor, oxide semiconductor precursor, oxide semiconductor layer, semiconductor element, and electronic device
FR2958441B1 (fr) Circuit pseudo-inverseur sur seoi
EP3041045A4 (en) Assembly and power-module substrate
EP3036741A4 (en) Collaborative audio conversation attestation
EP2676300A4 (en) Methods of forming semiconductor films including i2-ii-iv-vi4 and i2-(ii,iv)-iv-vi4 semiconductor films and electronic devices including the semiconductor films
IN2014DN09305A (enrdf_load_stackoverflow)
EP2784808B8 (en) Electrical component resin, semiconductor device, and substrate