IN2014DN07180A - - Google Patents

Info

Publication number
IN2014DN07180A
IN2014DN07180A IN7180DEN2014A IN2014DN07180A IN 2014DN07180 A IN2014DN07180 A IN 2014DN07180A IN 7180DEN2014 A IN7180DEN2014 A IN 7180DEN2014A IN 2014DN07180 A IN2014DN07180 A IN 2014DN07180A
Authority
IN
India
Prior art keywords
substrate layers
bonding material
layers
layer
electrical circuit
Prior art date
Application number
Other languages
English (en)
Inventor
Ernest Clyde Parker
Philip Joseph Lauriello
Original Assignee
Crane Electronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Crane Electronics filed Critical Crane Electronics
Priority claimed from PCT/US2013/024907 external-priority patent/WO2013119643A1/en
Publication of IN2014DN07180A publication Critical patent/IN2014DN07180A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H05K1/186—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07334—Using a reflow oven
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
IN7180DEN2014 2012-02-08 2013-02-06 IN2014DN07180A (enExample)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261596652P 2012-02-08 2012-02-08
US13/758,843 US9888568B2 (en) 2012-02-08 2013-02-04 Multilayer electronics assembly and method for embedding electrical circuit components within a three dimensional module
PCT/US2013/024907 WO2013119643A1 (en) 2012-02-08 2013-02-06 Multilayer electronics assembly and method for embedding electrical circuit components within a three dimensional module

Publications (1)

Publication Number Publication Date
IN2014DN07180A true IN2014DN07180A (enExample) 2015-04-24

Family

ID=48902707

Family Applications (1)

Application Number Title Priority Date Filing Date
IN7180DEN2014 IN2014DN07180A (enExample) 2012-02-08 2013-02-06

Country Status (4)

Country Link
US (2) US9888568B2 (enExample)
JP (1) JP6257047B2 (enExample)
KR (1) KR102103196B1 (enExample)
IN (1) IN2014DN07180A (enExample)

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DE102014206608A1 (de) 2014-04-04 2015-10-08 Siemens Aktiengesellschaft Verfahren zum Montieren eines elektrischen Bauelements, bei der eine Haube zum Einsatz kommt, und zur Anwendung in diesem Verfahren geeignete Haube
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CN111799251B (zh) * 2020-07-09 2023-06-02 华羿微电子股份有限公司 采用多芯片堆叠结构的功率分立器件及其制备方法
US11497112B2 (en) * 2020-12-11 2022-11-08 Toyota Motor Engineering & Manufacturing North America, Inc. Driver board assemblies and methods of forming a driver board assembly
JP7845197B2 (ja) * 2021-01-14 2026-04-14 Ｔｏｐｐａｎホールディングス株式会社 カード型媒体、およびカード型媒体の製造方法
TWI796738B (zh) * 2021-07-23 2023-03-21 先豐通訊股份有限公司 具有波導管的線路板結構及其製作方法
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US9888568B2 (en) 2018-02-06
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HK1204204A1 (en) 2015-11-06

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