IN2014CN03799A - - Google Patents
Info
- Publication number
- IN2014CN03799A IN2014CN03799A IN3799CHN2014A IN2014CN03799A IN 2014CN03799 A IN2014CN03799 A IN 2014CN03799A IN 3799CHN2014 A IN3799CHN2014 A IN 3799CHN2014A IN 2014CN03799 A IN2014CN03799 A IN 2014CN03799A
- Authority
- IN
- India
- Prior art keywords
- microspeaker
- piezoactuator
- dielectric layer
- cover glass
- elements
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/40—Piezoelectric or electrostrictive devices with electrical input and electrical output, e.g. functioning as transformers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/40—Details of arrangements for obtaining desired directional characteristic by combining a number of identical transducers covered by H04R1/40 but not provided for in any of its subgroups
- H04R2201/401—2D or 3D arrays of transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/15—Transducers incorporated in visual displaying devices, e.g. televisions, computer displays, laptops
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Power Engineering (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Micromachines (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/306,397 US8811636B2 (en) | 2011-11-29 | 2011-11-29 | Microspeaker with piezoelectric, metal and dielectric membrane |
| PCT/US2012/066875 WO2013082169A1 (en) | 2011-11-29 | 2012-11-28 | Microspeaker with piezoelectric, conductive and dielectric membrane |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN2014CN03799A true IN2014CN03799A (enExample) | 2015-10-16 |
Family
ID=47428996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN3799CHN2014 IN2014CN03799A (enExample) | 2011-11-29 | 2012-11-28 |
Country Status (9)
| Country | Link |
|---|---|
| US (3) | US8811636B2 (enExample) |
| EP (1) | EP2786595B1 (enExample) |
| JP (1) | JP6099663B2 (enExample) |
| KR (1) | KR101885180B1 (enExample) |
| CN (1) | CN103959818B (enExample) |
| ES (1) | ES2652036T3 (enExample) |
| HU (1) | HUE037612T2 (enExample) |
| IN (1) | IN2014CN03799A (enExample) |
| WO (1) | WO2013082169A1 (enExample) |
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-
2011
- 2011-11-29 US US13/306,397 patent/US8811636B2/en active Active
-
2012
- 2012-11-28 KR KR1020147017962A patent/KR101885180B1/ko active Active
- 2012-11-28 JP JP2014544851A patent/JP6099663B2/ja active Active
- 2012-11-28 HU HUE12805839A patent/HUE037612T2/hu unknown
- 2012-11-28 IN IN3799CHN2014 patent/IN2014CN03799A/en unknown
- 2012-11-28 EP EP12805839.3A patent/EP2786595B1/en active Active
- 2012-11-28 ES ES12805839.3T patent/ES2652036T3/es active Active
- 2012-11-28 WO PCT/US2012/066875 patent/WO2013082169A1/en not_active Ceased
- 2012-11-28 CN CN201280058708.1A patent/CN103959818B/zh active Active
-
2014
- 2014-07-21 US US14/336,744 patent/US10003888B2/en active Active
-
2017
- 2017-01-12 US US15/404,989 patent/US10735865B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN103959818B (zh) | 2018-12-14 |
| HUE037612T2 (hu) | 2018-09-28 |
| US8811636B2 (en) | 2014-08-19 |
| CN103959818A (zh) | 2014-07-30 |
| ES2652036T3 (es) | 2018-01-31 |
| KR101885180B1 (ko) | 2018-08-03 |
| KR20140098836A (ko) | 2014-08-08 |
| EP2786595A1 (en) | 2014-10-08 |
| US20170125660A1 (en) | 2017-05-04 |
| US20130136280A1 (en) | 2013-05-30 |
| US10003888B2 (en) | 2018-06-19 |
| US20140328504A1 (en) | 2014-11-06 |
| US10735865B2 (en) | 2020-08-04 |
| JP2015507388A (ja) | 2015-03-05 |
| WO2013082169A1 (en) | 2013-06-06 |
| JP6099663B2 (ja) | 2017-03-22 |
| EP2786595B1 (en) | 2017-09-27 |
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